BEGIN:VCALENDAR VERSION:2.0 PRODID:IEEE vTools.Events//EN CALSCALE:GREGORIAN BEGIN:VTIMEZONE TZID:Europe/Berlin BEGIN:DAYLIGHT DTSTART:20260329T030000 TZOFFSETFROM:+0100 TZOFFSETTO:+0200 RRULE:FREQ=YEARLY;BYDAY=-1SU;BYMONTH=3 TZNAME:CEST END:DAYLIGHT BEGIN:STANDARD DTSTART:20251026T020000 TZOFFSETFROM:+0200 TZOFFSETTO:+0100 RRULE:FREQ=YEARLY;BYDAY=-1SU;BYMONTH=10 TZNAME:CET END:STANDARD END:VTIMEZONE BEGIN:VEVENT DTSTAMP:20260301T100421Z UID:EFBCDCC8-5B1F-4D2B-94EF-03A0E3BDE372 DTSTART;TZID=Europe/Berlin:20260326T170000 DTEND;TZID=Europe/Berlin:20260326T180000 DESCRIPTION:Polymeric materials play a decisive role in the performance and lifetime of modern microelectronic systems. From PCB or IC substrate lami nates and encapsulation compounds to adhesives and functional layers\, the ir thermo-hygro-mechanical behavior strongly influences stress evolution\, warpage\, delamination\, and functional stability under service condition s. Modeling polymers in microelectronics\, therefore\, requires applicatio n-specific characterization combined with physics-based and multi-scale si mulation approaches.\n▸Based on advanced experimental methods\, material models are calibrated to describe flow\, curing\, thermo-(hygro-)mechanic al\, and degradation behavior.\n▸By linking global homogenized PCB model s with detailed local sub-models\, critical features can be assessed effic iently while maintaining computational feasibility.\n▸Modeling polymers in microelectronics is a key enabler for physics-of-degradation understand ing\, reliability-driven design optimization\, and the development of robu st\, next-generation electronic systems.\n\nSpeaker(s): Peter\, \n\nAgenda : \n1. Introduction\n2. Modeling Polymers in Microelectronics: From Materi al Behavior to System Reliability - Dr. Peter Fuchs MBA\n3. Q&A Session. M oderators - Dr. Jakub Premyslaw Gromala / Dr. Alexandru Prisacaru\n\nVirtu al: https://events.vtools.ieee.org/m/543798 LOCATION:Virtual: https://events.vtools.ieee.org/m/543798 ORGANIZER:alexandru.prisacaru@ieee.org SEQUENCE:6 SUMMARY:Modeling Polymers in Microelectronics - From Material Behavior to S ystem Reliability URL;VALUE=URI:https://events.vtools.ieee.org/m/543798 X-ALT-DESC:Description: <br /><p style="language: de\; line-height: 90%\; m argin-top: 10.0pt\; margin-bottom: 0pt\; margin-left: 0in\; text-indent: 0 in\; text-align: justify\; text-justify: inter-ideograph\; direction: ltr\ ; unicode-bidi: embed\; mso-line-break-override: none\; word-break: normal \; punctuation-wrap: hanging\;"><span style="font-size: 12.0pt\; font-fami ly: Calibri\; mso-ascii-font-family: Calibri\; mso-fareast-font-family: +m n-ea\; mso-bidi-font-family: +mn-cs\; mso-ascii-theme-font: minor-latin\; mso-fareast-theme-font: minor-fareast\; mso-bidi-theme-font: minor-bidi\; color: black\; mso-color-index: 1\; mso-font-kerning: 12.0pt\; language: e n-US\; mso-style-textfill-type: solid\; mso-style-textfill-fill-themecolor : text1\; mso-style-textfill-fill-color: black\; mso-style-textfill-fill-a lpha: 100.0%\;">Polymeric materials play a decisive role in the performanc e and lifetime of modern microelectronic systems. From PCB or IC substrate laminates and encapsulation compounds to adhesives and functional layers\ , their thermo-hygro-mechanical behavior strongly influences stress evolut ion\, warpage\, delamination\, and functional stability under service cond itions. Modeling polymers in microelectronics\, therefore\, requires appli cation-specific characterization combined with physics-based and multi-sca le simulation approaches.</span></p>\n<div style="language: de\; line-heig ht: 90%\; margin-top: 10.0pt\; margin-bottom: 0pt\; margin-left: .25in\; t ext-indent: -.25in\; text-align: left\; direction: ltr\; unicode-bidi: emb ed\; mso-line-break-override: none\; word-break: normal\; punctuation-wrap : hanging\;"><span style="font-size: 12.0pt\;"><span style="mso-special-fo rmat: bullet\; color: #0066a1\; font-family: LucidaGrande\;">▸</span></s pan><span style="font-size: 12.0pt\; font-family: Calibri\; mso-ascii-font -family: Calibri\; mso-fareast-font-family: +mn-ea\; mso-bidi-font-family: +mn-cs\; mso-ascii-theme-font: minor-latin\; mso-fareast-theme-font: mino r-fareast\; mso-bidi-theme-font: minor-bidi\; color: black\; mso-color-ind ex: 1\; mso-font-kerning: 12.0pt\; language: en-US\; mso-style-textfill-ty pe: solid\; mso-style-textfill-fill-themecolor: text1\; mso-style-textfill -fill-color: black\; mso-style-textfill-fill-alpha: 100.0%\;">Based on adv anced experimental methods\, material models are calibrated to describe fl ow\, curing\, thermo-(hygro-)mechanical\, and degradation behavior. </span ></div>\n<div style="language: de\; line-height: 90%\; margin-top: 10.0pt\ ; margin-bottom: 0pt\; margin-left: .25in\; text-indent: -.25in\; text-ali gn: left\; direction: ltr\; unicode-bidi: embed\; mso-line-break-override: none\; word-break: normal\; punctuation-wrap: hanging\;"><span style="fon t-size: 12.0pt\;"><span style="mso-special-format: bullet\; color: #0066a1 \; font-family: LucidaGrande\;">▸</span></span><span style="font-size: 1 2.0pt\; font-family: Calibri\; mso-ascii-font-family: Calibri\; mso-fareas t-font-family: +mn-ea\; mso-bidi-font-family: +mn-cs\; mso-ascii-theme-fon t: minor-latin\; mso-fareast-theme-font: minor-fareast\; mso-bidi-theme-fo nt: minor-bidi\; color: black\; mso-color-index: 1\; mso-font-kerning: 12. 0pt\; language: en-US\; mso-style-textfill-type: solid\; mso-style-textfil l-fill-themecolor: text1\; mso-style-textfill-fill-color: black\; mso-styl e-textfill-fill-alpha: 100.0%\;">By linking global homogenized PCB models with detailed local sub-models\, critical features can be assessed efficie ntly while maintaining computational feasibility. </span></div>\n<div styl e="language: de\; line-height: 90%\; margin-top: 10.0pt\; margin-bottom: 0 pt\; margin-left: .25in\; text-indent: -.25in\; text-align: left\; directi on: ltr\; unicode-bidi: embed\; mso-line-break-override: none\; word-break : normal\; punctuation-wrap: hanging\;"><span style="font-size: 12.0pt\;"> <span style="mso-special-format: bullet\; color: #0066a1\; font-family: Lu cidaGrande\;">▸</span></span><span style="font-size: 12.0pt\; font-famil y: Calibri\; mso-ascii-font-family: Calibri\; mso-fareast-font-family: +mn -ea\; mso-bidi-font-family: +mn-cs\; mso-ascii-theme-font: minor-latin\; m so-fareast-theme-font: minor-fareast\; mso-bidi-theme-font: minor-bidi\; c olor: black\; mso-color-index: 1\; mso-font-kerning: 12.0pt\; language: en -US\; mso-style-textfill-type: solid\; mso-style-textfill-fill-themecolor: text1\; mso-style-textfill-fill-color: black\; mso-style-textfill-fill-al pha: 100.0%\;">Modeling polymers in microelectronics is a key enabler for physics-of-degradation understanding\, reliability-driven design optimizat ion\, and the development of robust\, next-generation electronic systems.< /span></div><br /><br />Agenda: <br /><p><span style="font-size: 12.0pt\; font-family: 'Aptos'\,sans-serif\; mso-fareast-font-family: Aptos\; mso-fa reast-theme-font: minor-latin\; mso-bidi-font-family: Aptos\; mso-font-ker ning: 0pt\; mso-ligatures: none\; mso-ansi-language: DE\; mso-fareast-lang uage: DE\; mso-bidi-language: AR-SA\;">1. Introduction<br>2. Modeling Poly mers in Microelectronics: From Material Behavior to System Reliability - D r. Peter Fuchs MBA<br>3. Q&amp\;A Session. Moderators - Dr. Jakub Premysla w Gromala / Dr. Alexandru Prisacaru<br style="mso-special-character: line- break\;"><!-- [if !supportLineBreakNewLine]--><br style="mso-special-chara cter: line-break\;"><!--[endif]--></span></p> END:VEVENT END:VCALENDAR