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DTSTART:20260308T030000
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DTSTAMP:20260327T114251Z
UID:F09FAFC2-A10F-4000-BBED-9CF9B54B1645
DTSTART;TZID=America/Los_Angeles:20260326T150000
DTEND;TZID=America/Los_Angeles:20260326T160000
DESCRIPTION:As chiplet packaging proliferates\, a reduction in die intercon
 nect pitch and concomitant increase in escape routing density must be enab
 led to meet performance and cost targets. The traditional 2D solution (die
  on organic substrate) has limitations related to pitch and escape routing
  capability\, which have promoted a shift to 2.5D technology (die + high d
 ensity routing interface + organic substrate) in certain application space
 s. Conventional thought is that use of a 2.5D solution can enable coarser\
 , lower cost substrate design rules. However\, a different cost point for 
 2D vs. 2.5D means that interconnect and escape routing should be properly 
 balanced between the organic substrate and the high-density routing interf
 ace\, to contain cost while delivering the proper level of chiplet integra
 tion. As both 2D and 2.5D solutions include an organic substrate\, continu
 ous development of higher routing density organic substrates is a prudent 
 approach to enable cost-optimized solutions moving forward. This talk will
  cover current application space and limitations for 2D vs. 2.5D technolog
 y\, and potential paths forward to achieve a cost-optimized\, complementar
 y solution.\n\nSpeaker(s): \, Omar Bchir\n\nBldg: Qualcomm Building Q Audi
 torium\, 6455 Lusk Blvd\, San Diego\, California\, United States\, 92121
LOCATION:Bldg: Qualcomm Building Q Auditorium\, 6455 Lusk Blvd\, San Diego\
 , California\, United States\, 92121
ORGANIZER:vaishnav.srinivas@gmail.com
SEQUENCE:11
SUMMARY:IEEE Lecture - Next Generation Package Technology: How Will Organic
  Substrates Synergize with 2.5D? 
URL;VALUE=URI:https://events.vtools.ieee.org/m/544647
X-ALT-DESC:Description: <br /><p class="MsoNormal">As chiplet packaging pro
 liferates\, a reduction in die interconnect pitch and concomitant increase
  in escape routing density must be enabled to meet performance and cost ta
 rgets.&nbsp\; The traditional 2D solution (die on organic substrate) has l
 imitations related to pitch and escape routing capability\, which have pro
 moted a shift to 2.5D technology (die + high density routing interface + o
 rganic substrate) in certain application spaces. Conventional thought is t
 hat use of a 2.5D solution can enable coarser\, lower cost substrate desig
 n rules.&nbsp\; However\, a different cost point for 2D vs. 2.5D means tha
 t interconnect and escape routing should be properly balanced between the 
 organic substrate and the high-density routing interface\, to contain cost
  while delivering the proper level of chiplet integration.&nbsp\; As both 
 2D and 2.5D solutions include an organic substrate\, continuous developmen
 t of higher routing density organic substrates is a prudent approach to en
 able cost-optimized solutions moving forward. This talk will cover current
  application space and limitations for 2D vs. 2.5D technology\, and potent
 ial paths forward to achieve a cost-optimized\,&nbsp\; complementary solut
 ion.</p>\n<p>&nbsp\;</p>
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