BEGIN:VCALENDAR
VERSION:2.0
PRODID:IEEE vTools.Events//EN
CALSCALE:GREGORIAN
BEGIN:VTIMEZONE
TZID:America/Los_Angeles
BEGIN:DAYLIGHT
DTSTART:20260308T030000
TZOFFSETFROM:-0800
TZOFFSETTO:-0700
RRULE:FREQ=YEARLY;BYDAY=2SU;BYMONTH=3
TZNAME:PDT
END:DAYLIGHT
BEGIN:STANDARD
DTSTART:20261101T010000
TZOFFSETFROM:-0700
TZOFFSETTO:-0800
RRULE:FREQ=YEARLY;BYDAY=1SU;BYMONTH=11
TZNAME:PST
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTAMP:20260507T200047Z
UID:8DD63CA7-B952-42E6-B734-CF2AEE94B585
DTSTART;TZID=America/Los_Angeles:20260507T120000
DTEND;TZID=America/Los_Angeles:20260507T130000
DESCRIPTION:[]Join us for an insightful webinar with Francesco Carobolante\
 , founder of IoTissimo® LLC and an EPS Distinguished Lecturer\, as he exp
 lores the critical challenges and innovative solutions that advanced packa
 ging can provide to address the "Power Wall". With over 30 years of indust
 ry experience and a tenure at Intel’s Corporate Strategy Office\, France
 sco will delve into the Heterogeneous Integration Roadmap (HIR) perspectiv
 e on scaling high-power AI processors. This session will analyze how signa
 l BW and energy requirements dictate the options available for architectin
 g the package structure\, including Vertical Power Delivery\, integrated v
 oltage regulators and advanced thermal management techniques. Discover how
  these architectural shifts are enabling the next generation of data cente
 r performance.\n\nSpeaker(s): Francesco Carobolante\, \n\nVirtual: https:/
 /events.vtools.ieee.org/m/546237
LOCATION:Virtual: https://events.vtools.ieee.org/m/546237
ORGANIZER:p.wesling@ieee.org
SEQUENCE:13
SUMMARY:Power Distribution in Heterogeneous Integrated Packaging for Data C
 enter Computing
URL;VALUE=URI:https://events.vtools.ieee.org/m/546237
X-ALT-DESC:Description: <br /><p><img style="float: right\;" src="https://e
 vents.vtools.ieee.org/vtools_ui/media/display/f0a60381-6d99-45c3-a687-0e6f
 c38fd295" alt="" width="384" height="192">Join us for an insightful webina
 r with Francesco Carobolante\, founder of IoTissimo&reg\; LLC and an EPS D
 istinguished Lecturer\, as he explores the critical challenges and innovat
 ive solutions that advanced packaging can provide to address the "Power Wa
 ll". With over 30 years of industry experience and a tenure at Intel&rsquo
 \;s Corporate Strategy Office\, Francesco will delve into the Heterogeneou
 s Integration Roadmap (HIR) perspective on scaling high-power AI processor
 s. This session will analyze how signal BW and energy requirements dictate
  the options available for architecting the package structure\, including 
 Vertical Power Delivery\, integrated voltage regulators and advanced therm
 al management techniques. Discover how these architectural shifts are enab
 ling the next generation of data center performance.</p>
END:VEVENT
END:VCALENDAR