BEGIN:VCALENDAR VERSION:2.0 PRODID:IEEE vTools.Events//EN CALSCALE:GREGORIAN BEGIN:VTIMEZONE TZID:US/Eastern BEGIN:DAYLIGHT DTSTART:20260308T030000 TZOFFSETFROM:-0500 TZOFFSETTO:-0400 RRULE:FREQ=YEARLY;BYDAY=2SU;BYMONTH=3 TZNAME:EDT END:DAYLIGHT BEGIN:STANDARD DTSTART:20261101T010000 TZOFFSETFROM:-0400 TZOFFSETTO:-0500 RRULE:FREQ=YEARLY;BYDAY=1SU;BYMONTH=11 TZNAME:EST END:STANDARD END:VTIMEZONE BEGIN:VEVENT DTSTAMP:20260429T133926Z UID:700FB3B4-8B53-4965-ADE5-1641ECBAEFF6 DTSTART;TZID=US/Eastern:20260421T180000 DTEND;TZID=US/Eastern:20260421T200000 DESCRIPTION:[]\n\nThermal Compression Bonding For Advanced Packaging\n\nThe rapid adoption of Artificial Intelligence (AI) and High Performance Compu ting (HPC) is driving unprecedented demand for ultra-high density\, fine p itch interconnects\, pushing Thermal Compression Bonding (TCB) technologie s beyond current limits. Advanced packages for semiconductors increasingly feature hundreds of thousands to over a million interconnects\, large die sizes (>26 × 34 mm)\, narrow inter chip spacing (≤50 µm)\, and reduce d standoff heights (≤50 µm)\, making fluxless TCB processes essential. Today\, formic acid (FA) vapor based fluxless TCB is the only technology w idely deployed in mass production. However\, concerns over FA related cont aminants such as metal formates have motivated interest in Atmospheric Hyd rogen Plasma (AHP) as an alternative oxide reduction method\, given its pr imary by product is water vapor. Under certain conditions\, plasma exposur e to Sn and In based interconnects can also generate volatile hydride spec ies and associated contamination.\n\nSpeaker(s): Dr. Adeel Bajwa\n\nAgenda : \nIn Person Event: 6:00 - 8:00 P.M.\n\n- Agenda:\n- 6 PM - Dinner and Ne tworking for In-Person attendees\n- 7 PM - Technical Presentation by Dr. A deel Bajwa of Kulicke & Soffa Industries\, Inc.\n\n- Virtual attendees sho uld join Zoom at 7 PM\n\n- 8 PM - Section Business\n- Presentation by IEEE Drexel Student Branch\n\nPDH certificates are available and an evaluation form will be emailed to you after the meeting. PDH certificate are sent b y IEEE USA 3-4 weeks after the meeting.\n\nRoom: 709\, Bldg: Drexel Univer sity - Bossone Research Center\, 3140 Market Street\, Philadelphia\, Penns ylvania\, United States\, 19104\, Virtual: https://events.vtools.ieee.org/ m/546561 LOCATION:Room: 709\, Bldg: Drexel University - Bossone Research Center\, 31 40 Market Street\, Philadelphia\, Pennsylvania\, United States\, 19104\, V irtual: https://events.vtools.ieee.org/m/546561 ORGANIZER:ieee@gpamg.org SEQUENCE:163 SUMMARY:Thermal Compression Bonding For Advanced Packaging (Semiconductors) URL;VALUE=URI:https://events.vtools.ieee.org/m/546561 X-ALT-DESC:Description: <br /><p class="MsoNormal"><strong><span style="fon t-size: 20.5pt\; font-family: 'Helvetica'\,sans-serif\; mso-fareast-font-f amily: 'Times New Roman'\; mso-ansi-language: EN-US\; mso-fareast-language : EN-US\; mso-bidi-language: AR-SA\;"><img src="https://events.vtools.ieee .org/vtools_ui/media/display/d12526be-96eb-44ef-800b-802f97942c25" alt="" width="750" height="422"></span></strong></p>\n<p class="MsoNormal"><stron g><span style="font-size: 20.5pt\; font-family: 'Helvetica'\,sans-serif\; mso-fareast-font-family: 'Times New Roman'\; mso-ansi-language: EN-US\; ms o-fareast-language: EN-US\; mso-bidi-language: AR-SA\;">Thermal Compressio n Bonding For Advanced Packaging</span></strong></p>\n<p class="MsoNormal" style="line-height: 1.5\;">The rapid adoption of Artificial Intelligence (AI) and High Performance Computing (HPC) is driving unprecedented demand for ultra-high density\, fine pitch interconnects\, pushing Thermal Compre ssion Bonding (TCB) technologies beyond current limits. Advanced packages for semiconductors increasingly feature hundreds of thousands to over a mi llion interconnects\, large die sizes (&gt\;26 &times\; 34 mm)\, narrow in ter chip spacing (&le\;50 &micro\;m)\, and reduced standoff heights (&le\; 50 &micro\;m)\, making fluxless TCB processes essential. Today\, formic ac id (FA) vapor based fluxless TCB is the only technology widely deployed in mass production. However\, concerns over FA related contaminants such as metal formates have motivated interest in Atmospheric Hydrogen Plasma (AHP ) as an alternative oxide reduction method\, given its primary by product is water vapor. Under certain conditions\, plasma exposure to Sn &nbsp\;an d In based interconnects can also generate volatile hydride species and as sociated contamination.</p><br /><br />Agenda: <br /><p><strong>In Person Event:</strong> 6:00 - 8:00 P.M.<strong>&nbsp\;</strong></p>\n<ul type="di sc">\n<li class="MsoNormal" style="mso-margin-top-alt: auto\; mso-margin-b ottom-alt: auto\; mso-list: l0 level1 lfo1\; tab-stops: list .5in\;"><stro ng>Agenda</strong>:\n<ul type="circle">\n<li class="MsoNormal" style="mso- margin-top-alt: auto\; mso-margin-bottom-alt: auto\; mso-list: l0 level2 l fo1\; tab-stops: list 1.0in\;">6 PM - Dinner and Networking for In-Person attendees</li>\n<li class="MsoNormal" style="mso-margin-top-alt: auto\; ms o-margin-bottom-alt: auto\; mso-list: l0 level2 lfo1\; tab-stops: list 1.0 in\;">7 PM - Technical Presentation by <strong>Dr. Adeel Bajwa</strong> of Kulicke &amp\; Soffa Industries\, Inc.<br>\n<ul type="square">\n<li class ="MsoNormal" style="font-weight: bold\;"><strong>Virtual attendees should join Zoom at 7 PM</strong></li>\n</ul>\n</li>\n<li class="MsoNormal" style ="mso-margin-top-alt: auto\; mso-margin-bottom-alt: auto\; mso-list: l0 le vel2 lfo1\; tab-stops: list 1.0in\;">8 PM - Section Business\n<ul style="l ist-style-type: square\;" type="circle">\n<li class="MsoNormal" style="mso -margin-top-alt: auto\; mso-margin-bottom-alt: auto\; mso-list: l0 level2 lfo1\; tab-stops: list 1.0in\;">Presentation by IEEE Drexel Student Branch </li>\n</ul>\n</li>\n</ul>\n</li>\n</ul>\n<p>PDH certificates are availabl e and an evaluation form will be emailed to you after the meeting. PDH cer tificate are sent by IEEE USA 3-4 weeks after the meeting.</p> END:VEVENT END:VCALENDAR