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DTSTART:20260308T030000
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DTSTART:20261101T010000
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DTSTAMP:20260328T185002Z
UID:C5CB87A5-BA2B-4F42-A509-3FC781B36994
DTSTART;TZID=America/Los_Angeles:20260415T070000
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DESCRIPTION:Th[]e transition to 3D heterogeneous integration has fundamenta
 lly changed the thermal characterization problem. Buried heat sources\, an
 isotropic thin-film materials\, through-silicon vias\, and multilayer stac
 ked structures require measurement techniques with sub-micron spatial reso
 lution\, depth sensitivity\, and a temporal range — capabilities that in
 frared thermography and Raman spectroscopy cannot reliably deliver at this
  level of structural complexity. This session presents optical sampling th
 ermoreflectance as a practical\, commercially available solution\, with re
 al measurement data from a university lab and an industrial FA environment
 .\n\nVirtual: https://events.vtools.ieee.org/m/551389
LOCATION:Virtual: https://events.vtools.ieee.org/m/551389
ORGANIZER:p.wesling@ieee.org
SEQUENCE:8
SUMMARY:Optical Sampling Thermoreflectance for 3D Heterogeneous Integration
URL;VALUE=URI:https://events.vtools.ieee.org/m/551389
X-ALT-DESC:Description: &lt;br /&gt;&lt;p&gt;Th&lt;img style=&quot;float: right\;&quot; src=&quot;https:/
 /events.vtools.ieee.org/vtools_ui/media/display/a5d939fd-bf50-4fc5-9c3b-45
 0c02ea0398&quot; alt=&quot;&quot; width=&quot;428&quot; height=&quot;183&quot;&gt;e transition to 3D heterogeneo
 us integration has fundamentally changed the thermal characterization prob
 lem. &amp;nbsp\;Buried heat sources\, anisotropic thin-film materials\, throug
 h-silicon vias\, and multilayer stacked structures require measurement tec
 hniques with sub-micron spatial resolution\, depth sensitivity\, and a tem
 poral range &amp;mdash\; capabilities that infrared thermography and Raman spe
 ctroscopy cannot reliably deliver at this level of structural complexity. 
 &amp;nbsp\;This session presents optical sampling thermoreflectance as a pract
 ical\, commercially available solution\, with real measurement data from a
  university lab and an industrial FA environment.&lt;/p&gt;
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