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DTSTART:20260308T030000
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DTSTART:20261101T010000
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DTSTAMP:20260411T234832Z
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DTSTART;TZID=America/New_York:20260417T123000
DTEND;TZID=America/New_York:20260417T133000
DESCRIPTION:[]\n\nIn the rapidly evolving landscape of artificial intellige
 nce\, chiplets are emerging as a transformative technology\, paving the wa
 y for the next generation of AI systems. Chiplets permit the integration o
 f more processing power within a single package and allow for new connecti
 vity solutions so that thousands of AI accelerators can work as a cohesive
  unit. Optical connectivity\, facilitated by chiplets\, offers high-speed 
 data transmission with lower power consumption\, crucial for handling the 
 massive data loads in AI applications. The emerging chiplet ecosystem\, un
 derwritten by high-performance die-to-die interfaces\, is throwing open th
 e doors of innovation and facilitating the next wave of AI scaling.\n\nSpe
 aker(s): Tony Chan Carusone\, \n\nVirtual: https://events.vtools.ieee.org/
 m/554357
LOCATION:Virtual: https://events.vtools.ieee.org/m/554357
ORGANIZER:kelly.hunter@mail.utoronto.ca
SEQUENCE:18
SUMMARY:Scaling AI with Chiplet-Based Systems
URL;VALUE=URI:https://events.vtools.ieee.org/m/554357
X-ALT-DESC:Description: &lt;br /&gt;&lt;p&gt;&lt;img src=&quot;https://events.vtools.ieee.org/v
 tools_ui/media/display/5feb6ece-a928-4fb6-807f-5a9c15e27a5e&quot; alt=&quot;&quot; width=
 &quot;455&quot; height=&quot;455&quot;&gt;&lt;/p&gt;\n&lt;p&gt;In the rapidly evolving landscape of artificia
 l intelligence\, chiplets are emerging as a transformative technology\, pa
 ving the way for the next generation of AI systems. Chiplets permit the in
 tegration of more processing power within a single package and allow for n
 ew connectivity solutions so that thousands of AI accelerators can work as
  a cohesive unit. Optical connectivity\, facilitated by chiplets\, offers 
 high-speed data transmission with lower power consumption\, crucial for ha
 ndling the massive data loads in AI applications. The emerging chiplet eco
 system\, underwritten by high-performance die-to-die interfaces\, is throw
 ing open the doors of innovation and facilitating the next wave of AI scal
 ing.&lt;/p&gt;
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