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DTSTART:20260308T030000
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DTSTART:20261101T010000
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DTSTAMP:20260504T030053Z
UID:4A6608EE-7F69-4C47-B75B-6D4A27632756
DTSTART;TZID=America/New_York:20260430T180000
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DESCRIPTION:Artificial intelligence is no longer just a software story. Beh
 ind every large language model and every AI-powered breakthrough lies a ph
 ysical substrate — and the race to build it is reshaping the semiconduct
 or industry at its core. This panel brings together voices from the lab an
 d the industry floor to examine the challenge at the heart of the AI era. 
 How has explosive AI demand rewritten what chips need to do — and what i
 t takes to make them? What separates an AI accelerator from everything tha
 t came before it? And what does it mean for manufacturing\, supply chains\
 , and global competition when demand outpaces the industry&#39;s ability to ke
 ep up?\n\nFrom thin film deposition and nanofabrication to fab operations\
 , equipment markets\, and national semiconductor strategy\, our panelists 
 bring rare depth to questions that will define the next decade of technolo
 gy. This is not a conversation about chips in the abstract — it is a con
 versation about the physical foundations of the AI future\, and the very r
 eal challenges of building them at scale.\n\nSpeaker(s): Robert Quinn\n\nA
 genda: \n- Technical presentation by Robert Quinn\n- Panel discussion\n- A
 udience Q&amp;A\n\nVirtual: https://events.vtools.ieee.org/m/554730
LOCATION:Virtual: https://events.vtools.ieee.org/m/554730
ORGANIZER:phebeselly@ieee.org
SEQUENCE:129
SUMMARY:Semiconductors and AI: Architecting the Future
URL;VALUE=URI:https://events.vtools.ieee.org/m/554730
X-ALT-DESC:Description: &lt;br /&gt;&lt;p class=&quot;font-claude-response-body break-wor
 ds whitespace-normal leading-[1.7]&quot;&gt;Artificial intelligence is no longer j
 ust a software story. Behind every large language model and every AI-power
 ed breakthrough lies a physical substrate &amp;mdash\; and the race to build i
 t is reshaping the semiconductor industry at its core.&amp;nbsp\;This panel br
 ings together voices from the lab and the industry floor to examine the ch
 allenge at the heart of the AI era. How has explosive AI demand rewritten 
 what chips need to do &amp;mdash\; and what it takes to make them? What separa
 tes an AI accelerator from everything that came before it? And what does i
 t mean for manufacturing\, supply chains\, and global competition when dem
 and outpaces the industry&#39;s ability to keep up?&lt;/p&gt;\n&lt;p class=&quot;font-claude
 -response-body break-words whitespace-normal leading-[1.7]&quot;&gt;From thin film
  deposition and nanofabrication to fab operations\, equipment markets\, an
 d national semiconductor strategy\, our panelists bring rare depth to ques
 tions that will define the next decade of technology. This is not a conver
 sation about chips in the abstract &amp;mdash\; it is a conversation about the
  physical foundations of the AI future\, and the very real challenges of b
 uilding them at scale.&lt;/p&gt;&lt;br /&gt;&lt;br /&gt;Agenda: &lt;br /&gt;&lt;ul&gt;\n&lt;li&gt;Technical pr
 esentation by Robert Quinn&lt;/li&gt;\n&lt;li&gt;Panel discussion&lt;/li&gt;\n&lt;li&gt;Audience Q
 &amp;amp\;A&lt;/li&gt;\n&lt;/ul&gt;
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