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DTSTAMP:20260424T182324Z
UID:F838A64A-6E31-4D6D-A984-F5227563A36A
DTSTART;TZID=America/New_York:20260424T110000
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DESCRIPTION:This presentation introduces reliability-limiting mechanisms in
  lead-free solder joints used in advanced device packaging\, including AI 
 processors\, where complex joint geometries endure extreme electrical and 
 thermal loads. Escalating current densities are especially critical\, as e
 lectromigration (EM) accelerates interfacial reactions\, intermetallic com
 pound (IMC) evolution\, and void formation\, destabilizing the joint while
  failure pathways in modern assemblies remain insufficiently understood. W
 e establish a comprehensive metallurgical framework identifying microstruc
 tural drivers of EM-induced degradation and introduce a physics-based phas
 e-field FEM model that captures IMC growth\, void nucleation\, and current
 -crowding effects. The simulations reproduce observed damage evolution\, o
 ffering mechanistic insight and enabling more accurate long-term reliabili
 ty prediction for next-generation high-power electronics.\n\nCo-sponsored 
 by: UCF Department of Materials Science and Engineering\n\nSpeaker(s): Cho
 ong-Un Kim\n\nRoom: Room 101\, Bldg: Research 1\, 4353 Scorpius St\, Orlan
 do\, Florida\, United States\, 32816\, Virtual: https://events.vtools.ieee
 .org/m/555198
LOCATION:Room: Room 101\, Bldg: Research 1\, 4353 Scorpius St\, Orlando\, F
 lorida\, United States\, 32816\, Virtual: https://events.vtools.ieee.org/m
 /555198
ORGANIZER:tengfei.jiang@ucf.edu
SEQUENCE:35
SUMMARY:Electromigration Failure in Solder Joints in Advanced Packaging: In
 sights and Phase-Field-Based Mechanistic Modeling
URL;VALUE=URI:https://events.vtools.ieee.org/m/555198
X-ALT-DESC:Description: <br /><p dir="auto">This presentation introduces re
 liability-limiting mechanisms in lead-free solder joints used in advanced 
 device packaging\, including AI processors\, where complex joint geometrie
 s endure extreme electrical and thermal loads. Escalating current densitie
 s are especially critical\, as electromigration (EM) accelerates interfaci
 al reactions\, intermetallic compound (IMC) evolution\, and void formation
 \, destabilizing the joint while failure pathways in modern assemblies rem
 ain insufficiently understood. We establish a comprehensive metallurgical 
 framework identifying microstructural drivers of EM-induced degradation an
 d introduce a physics-based phase-field FEM model that captures IMC growth
 \, void nucleation\, and current-crowding effects. The simulations reprodu
 ce observed damage evolution\, offering mechanistic insight and enabling m
 ore accurate long-term reliability prediction for next-generation high-pow
 er electronics.</p>
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