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DESCRIPTION:[]Cu-Cu Hybrid Bonding and Co-Packaged Optics\n\nJohn H Lau\n\n
 Unimicron Technology Corporation\n\nJohn_Lau@Unimicron.com\n\nCu-Cu hybrid
  bonding is one of the flip chip assembly technologies. The advantages of 
 hybrid bonding are: (a) higher density\, (b) finer pad pitch\, and (c) bet
 ter performance. In this lecture\, some fundamentals and more than 10 high
 -volume manufacturing products using hybrid bonding will be presented. On 
 the other hand\, co-packaged optics (CPO) are heterogeneous integration pa
 ckaging methods to integrate the chiplets such as the optical engine (OE) 
 which consists of photonic ICs (PIC) and the electrical engine (EE) which 
 consists of the electronic ICs (EIC) as well as the switch ASIC (applicati
 on specific IC). The advantages of CPO are: (a) to reduce the length of th
 e electrical interface between the OE/EE (or PIC/EIC) and the ASIC\, (b) t
 o reduce the energy required to drive the signal\, and (c) to cut the late
 ncy which leads to better electrical performance. In the next few years\, 
 we will see more implementations of Cu-Cu hybrid bonding and a higher leve
 l of heterogeneous integration of PIC and EIC\, whether it is for performa
 nce\, form factor\, power consumption or cost. The content of this lecture
  is shown below.\n\nSpeaker(s): John Lau\, \n\nAgenda: \n6:00 PM Registrat
 ion and Networking\n\n6:30 PM Presentation\n\n7:30 PM Questions and Networ
 king\n\nBldg: Broadcom Inc Building 1\, 15101/15191 Alton Parkway\, Irvine
  CA 92618\, Irvine\, California\, United States\, 92618
LOCATION:Bldg: Broadcom Inc Building 1\, 15101/15191 Alton Parkway\, Irvine
  CA 92618\, Irvine\, California\, United States\, 92618
ORGANIZER:hichrih@ajiusa.com
SEQUENCE:27
SUMMARY:Cu-Cu Hybrid Bonding and Co-Packaged Optics
URL;VALUE=URI:https://events.vtools.ieee.org/m/555513
X-ALT-DESC:Description: &lt;br /&gt;&lt;p align=&quot;center&quot;&gt;&lt;a name=&quot;m_-236637354077447
 2994_x__Hlk158268007&quot;&gt;&lt;/a&gt;&lt;strong&gt;Cu-Cu Hybrid Bonding and Co-Packaged Opt
 ics&lt;/strong&gt;&lt;/p&gt;\n&lt;p align=&quot;center&quot;&gt;John H Lau&lt;/p&gt;\n&lt;p align=&quot;center&quot;&gt;Unim
 icron Technology Corporation&lt;/p&gt;\n&lt;p align=&quot;center&quot;&gt;&lt;a href=&quot;mailto:John_L
 au@Unimicron.com&quot; target=&quot;_blank&quot; rel=&quot;noopener&quot;&gt;John_Lau@Unimicron.com&lt;/a
 &gt;&lt;/p&gt;\n&lt;p&gt;&amp;nbsp\;&lt;/p&gt;\n&lt;p&gt;&lt;strong&gt;&amp;nbsp\;&lt;/strong&gt;&lt;/p&gt;\n&lt;p&gt;Cu-Cu hybrid bo
 nding is one of the flip chip assembly technologies. The advantages of hyb
 rid bonding are: (a) higher density\, (b) finer pad pitch\, and (c) better
  performance. In this lecture\, some fundamentals and more than 10 high-vo
 lume manufacturing products using hybrid bonding will be presented. On the
  other hand\, co-packaged optics (CPO) are heterogeneous integration packa
 ging methods to integrate the chiplets such as the optical engine (OE) whi
 ch consists of photonic ICs (PIC) and the electrical engine (EE) which con
 sists of the electronic ICs (EIC) as well as the switch ASIC (application 
 specific IC). The advantages of CPO are: (a) to reduce the length of the e
 lectrical interface between the OE/EE (or PIC/EIC) and the ASIC\, (b) to r
 educe the energy required to drive the signal\, and (c) to cut the latency
  which leads to better electrical performance. In the next few years\, we 
 will see more implementations of Cu-Cu hybrid bonding and a higher level o
 f heterogeneous integration of PIC and EIC\, whether it is for performance
 \, form factor\, power consumption or cost. The content of this lecture is
  shown below.&lt;/p&gt;\n&lt;p&gt;&amp;nbsp\;&lt;/p&gt;&lt;br /&gt;&lt;br /&gt;Agenda: &lt;br /&gt;&lt;p&gt;6:00 PM Regi
 stration and Networking&lt;/p&gt;\n&lt;p&gt;6:30 PM Presentation&lt;/p&gt;\n&lt;p&gt;7:30 PM Quest
 ions and Networking&lt;/p&gt;
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