BEGIN:VCALENDAR VERSION:2.0 PRODID:IEEE vTools.Events//EN CALSCALE:GREGORIAN BEGIN:VTIMEZONE TZID:America/New_York BEGIN:DAYLIGHT DTSTART:20260308T030000 TZOFFSETFROM:-0500 TZOFFSETTO:-0400 RRULE:FREQ=YEARLY;BYDAY=2SU;BYMONTH=3 TZNAME:EDT END:DAYLIGHT BEGIN:STANDARD DTSTART:20261101T010000 TZOFFSETFROM:-0400 TZOFFSETTO:-0500 RRULE:FREQ=YEARLY;BYDAY=1SU;BYMONTH=11 TZNAME:EST END:STANDARD END:VTIMEZONE BEGIN:VEVENT DTSTAMP:20260427T171258Z UID:2F79A573-3468-4418-9DA4-CCF55274A5A2 DTSTART;TZID=America/New_York:20260522T120000 DTEND;TZID=America/New_York:20260522T130000 DESCRIPTION:Abstract In high-volume manufacturing\, failures in advanced el ectronic packaging are an unavoidable reality. Consequently\, effective fa ilure analysis is vital for enhancing product quality\, reliability\, and safety. This multidisciplinary task requires the integration of fundamenta l material science with technological expertise in manufacturing processes and product operation. As packages incorporate increasingly diverse mater ials and complex geometries\, the interactions between components become m ore intricate. To address this\, a systematic\, data-driven approach is es sential for identifying root causes. This lecture outlines strategies for postulating and verifying failures by linking material properties and char acterization techniques to specific failure modes. The session concludes b y addressing the industry's most pressing technical challenges.\n\nOutline \n\n-\nFoundations of Failure Analysis: Global perspectives\, packaging ch allenges\, and the "Octagonal Relationship" of engineering materials.\n\n- \nMechanisms of Failure: Exploring electrical\, thermal\, mechanical\, che mical\, and optical properties in advanced packaging.\n\n-\nStrategic Prob lem Solving: Implementing the 3C Technique (Create\, Challenge\, and Confi rm) to navigate modern analysis hurdles.\n\nCo-sponsored by: Benson Chan\n \nSpeaker(s): KY Cheong\, \n\nAgenda: \nSee LOCATION tab for WebEx info\n\ nRoom: Symposium Hall\, Bldg: Center of Excellence Building\, Binghamton U niversity\, 85 Murray Hill Road\, Vestal\, New York\, United States\, 1385 0\, Virtual: https://events.vtools.ieee.org/m/557425 LOCATION:Room: Symposium Hall\, Bldg: Center of Excellence Building\, Bingh amton University\, 85 Murray Hill Road\, Vestal\, New York\, United States \, 13850\, Virtual: https://events.vtools.ieee.org/m/557425 ORGANIZER:bchan@ieee.org SEQUENCE:5 SUMMARY:Failure Analysis of Engineering Materials for Advanced Electronic P ackaging URL;VALUE=URI:https://events.vtools.ieee.org/m/557425 X-ALT-DESC:Description: <br /><p data-path-to-node="2"><strong data-path-to -node="2" data-index-in-node="0">Abstract</strong> In high-volume manufact uring\, failures in advanced electronic packaging are an unavoidable reali ty. Consequently\, effective failure analysis is vital for enhancing produ ct quality\, reliability\, and safety. This multidisciplinary task require s the integration of fundamental material science with technological exper tise in manufacturing processes and product operation. As packages incorpo rate increasingly diverse materials and complex geometries\, the interacti ons between components become more intricate. To address this\, a systemat ic\, data-driven approach is essential for identifying root causes. This l ecture outlines strategies for postulating and verifying failures by linki ng material properties and characterization techniques to specific failure modes. The session concludes by addressing the industry's most pressing t echnical challenges.</p>\n<p data-path-to-node="3"><strong data-path-to-no de="3" data-index-in-node="0">Outline</strong></p>\n<ol start="1" data-pat h-to-node="4">\n<li>\n<p data-path-to-node="4\,0\,0"><strong data-path-to- node="4\,0\,0" data-index-in-node="0">Foundations of Failure Analysis:</st rong> Global perspectives\, packaging challenges\, and the "Octagonal Rela tionship" of engineering materials.</p>\n</li>\n<li>\n<p data-path-to-node ="4\,1\,0"><strong data-path-to-node="4\,1\,0" data-index-in-node="0">Mech anisms of Failure:</strong> Exploring electrical\, thermal\, mechanical\, chemical\, and optical properties in advanced packaging.</p>\n</li>\n<li>\ n<p data-path-to-node="4\,2\,0"><strong data-path-to-node="4\,2\,0" data-i ndex-in-node="0">Strategic Problem Solving:</strong> Implementing the <str ong data-path-to-node="4\,2\,0" data-index-in-node="44">3C Technique</stro ng> (Create\, Challenge\, and Confirm) to navigate modern analysis hurdles .</p>\n</li>\n</ol><br /><br />Agenda: <br /><p><span style="font-size: 18 pt\;">See LOCATION tab for WebEx info</span></p> END:VEVENT END:VCALENDAR