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DTSTAMP:20260529T133559Z
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DTSTART;TZID=America/New_York:20260528T170000
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DESCRIPTION:The wires inside a chip are the most overlooked component in el
 ectronics.\n\nInterconnects have always had one job: moving signals from A
  to B. This talk argues they can do far more. What if an interconnect coul
 d use a chip's own waste heat to automatically increase its bandwidth? Wha
 t if a passive circuit could reroute signals through random paths — and 
 yet reconstruct them perfectly\, with no active control? What if a conduct
 ing wire could be folded and unfolded many times — and never break? All 
 of this becomes possible when we stop treating interconnects as fixed infr
 astructure — and rebuild them with purpose. The reach is pervasive. Engi
 neered Electromagnetic interconnects could help solve some of the hardest 
 open problems in AI data center efficiency\, deployable robotics\, and har
 dware security.\n\nThis talk presents concrete examples of passive interco
 nnect structures that go far beyond signal transport — and make the case
  that this is an underexplored frontier for the future of electronic and c
 ommunication systems.\n\nSpeaker(s): Soumitra Joy\n\nRoom: 101\, Bldg: HEC
 \, 4328 Scorpius St.\, ECE Department\, UCF\, ORLANDO\, Florida\, United S
 tates\, 32816
LOCATION:Room: 101\, Bldg: HEC\, 4328 Scorpius St.\, ECE Department\, UCF\,
  ORLANDO\, Florida\, United States\, 32816
ORGANIZER:zahid.hasan@ucf.edu
SEQUENCE:28
SUMMARY:Engineered Electromagnetic Interconnects for Emerging System Capabi
 lities
URL;VALUE=URI:https://events.vtools.ieee.org/m/559611
X-ALT-DESC:Description: <br /><p style="margin: 0in\; text-align: justify\;
  background: white\;"><strong><em><span style="font-size: 10.5pt\; color: 
 #13501b\; mso-themecolor: accent3\; mso-themeshade: 191\; mso-style-textfi
 ll-fill-color: #13501B\; mso-style-textfill-fill-themecolor: accent3\; mso
 -style-textfill-fill-alpha: 100.0%\; mso-style-textfill-fill-colortransfor
 ms: lumm=75000\;">The wires inside a chip are the most overlooked componen
 t in electronics.</span></em></strong></p>\n<p style="margin-top: 0in\; te
 xt-align: justify\; background: white\;"><span style="font-size: 10.5pt\; 
 color: blue\;">Interconnects have always had one job: moving signals from 
 A to B. This talk argues they can do far more. What if an interconnect cou
 ld use a chip's own waste heat to automatically increase its bandwidth? Wh
 at if a passive circuit could reroute signals through random paths &mdash\
 ; and yet reconstruct them perfectly\, with no active control? What if a c
 onducting wire could be folded and unfolded many times &mdash\; and never 
 break? All of this becomes possible when we stop treating interconnects as
  fixed infrastructure &mdash\; and rebuild them with purpose. The reach is
  pervasive. Engineered Electromagnetic interconnects could help solve some
  of the hardest open problems in AI data center efficiency\, deployable ro
 botics\, and hardware security.</span></p>\n<p><span style="font-size: 10.
 5pt\; font-family: 'Times New Roman'\,serif\; mso-fareast-font-family: 'Ti
 mes New Roman'\; color: blue\; mso-font-kerning: 0pt\; mso-ligatures: none
 \; mso-ansi-language: EN-US\; mso-fareast-language: EN-US\; mso-bidi-langu
 age: AR-SA\;">This talk presents concrete examples of passive interconnect
  structures that go far beyond signal transport &mdash\; and make the case
  that this is an underexplored frontier for the future of electronic and c
 ommunication systems.</span></p>
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