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VERSION:2.0
PRODID:IEEE vTools.Events//EN
CALSCALE:GREGORIAN
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TZID:America/New_York
BEGIN:DAYLIGHT
DTSTART:20260308T030000
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BEGIN:STANDARD
DTSTART:20261101T010000
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BEGIN:VEVENT
DTSTAMP:20260519T190551Z
UID:B7A3AEEC-62BA-4B41-A691-ACC57D75BB08
DTSTART;TZID=America/New_York:20260616T170000
DTEND;TZID=America/New_York:20260616T213000
DESCRIPTION:The meeting will start with PCBA Mfg. Facility Tours followed b
 y three Presentations which are as follows:\n\n- Driving Quality in Electr
 onics Manufacturing: Advanced Packaging\, Process Tools\, and Smart Packag
 e Selection. Presented by Matteo Forgione of Forgione Engineering\n\n- Pac
 kaging Selection as a Root Cause of Failure in Microelectronics Chip Tray 
 and Waffle Pack Systems. Presented by Katherine Kutina of Forgione Enginee
 ring\n\n- What changed at APEX and Why it Matters\, a review of APEX 2026.
  Presented by Leo Lambert of Eptac Corporation\n\nCo-sponsored by: SMTA Bo
 ston Chapter\, iMAPS NE Chapter\, and the IEEE Boston Reliability Chapter\
 n\nSpeaker(s): Matteo \, Katia\, Leo\n\nAgenda: \nAgenda:\n\n5:00 PM – 6
 :30 PM Registration\, Networking\, Table Top Displays/Demos\, Manufacturin
 g Facility Tours\n\n6:00 PM – 7:00 PM Italian Buffet Dinner\n\n7:00 PM 
 – 7:30 PM Announcements\, Presentation: Overview of Mack Technologies\n\
 n7:30 PM – 8:00 PM Presentation 1 – Driving Quality in Electronics Mfg
 .: Advanced Packaging\, Process Tools &amp; Smart Package Selection\, Q&amp;A\n\n8
 :00 PM – 8:30 PM Presentation 2 – Packaging Selection as a Root Cause 
 of Failure in Microelectronics Chip Tray\, &amp; Waffle Pack Systems\, Q&amp;A\n\n
 8:30 PM – 9:15 PM Presentation 3 – What changed at APEX and Why it Mat
 ters\, a review of APEX 2026\, Q&amp;A\n\n9:15 PM – 9:30 PM Closing Announce
 ments\, Meeting Adjourns\n\nMack Technologies\, 27 Carlisle Road\, Westfor
 d\, Massachusetts\, United States\, 01886
LOCATION:Mack Technologies\, 27 Carlisle Road\, Westford\, Massachusetts\, 
 United States\, 01886
ORGANIZER:mjansen@macktech.com
SEQUENCE:28
SUMMARY:PCBA Mfg. Facility Tours followed by three Presentations about elec
 tronics manufacturing quality and packaging as a root cause of failure
URL;VALUE=URI:https://events.vtools.ieee.org/m/560186
X-ALT-DESC:Description: &lt;br /&gt;&lt;p class=&quot;MsoNormal&quot;&gt;&lt;strong&gt;The meeting will
  start with PCBA Mfg. Facility Tours followed by three Presentations which
  are as follows:&lt;/strong&gt;&lt;/p&gt;\n&lt;p class=&quot;MsoNormal&quot;&gt;&lt;strong&gt;&amp;nbsp\;&lt;/stron
 g&gt;&lt;/p&gt;\n&lt;ol start=&quot;1&quot; type=&quot;1&quot;&gt;\n&lt;li class=&quot;m_-3038221639477575808MsoListP
 aragraph&quot;&gt;&lt;strong&gt;Driving Quality in Electronics Manufacturing: Advanced P
 ackaging\, Process Tools\, and Smart Package Selection. Presented by M&lt;/st
 rong&gt;&lt;strong&gt;atteo Forgione of Forgione Engineering&lt;/strong&gt;&lt;/li&gt;\n&lt;/ol&gt;\n
 &lt;p class=&quot;m_-3038221639477575808MsoListParagraph&quot;&gt;&lt;strong&gt;&amp;nbsp\;&lt;/strong&gt;
 &lt;/p&gt;\n&lt;ol start=&quot;2&quot; type=&quot;1&quot;&gt;\n&lt;li class=&quot;m_-3038221639477575808MsoListPar
 agraph&quot;&gt;&lt;strong&gt;Packaging Selection as a Root Cause of Failure in Microele
 ctronics Chip Tray and Waffle Pack Systems. Presented by&amp;nbsp\;&lt;/strong&gt;&lt;s
 trong&gt;Katherine Kutina of Forgione Engineering&lt;/strong&gt;&lt;/li&gt;\n&lt;/ol&gt;\n&lt;p cl
 ass=&quot;MsoNormal&quot;&gt;&lt;strong&gt;&amp;nbsp\;&lt;/strong&gt;&lt;/p&gt;\n&lt;ol start=&quot;3&quot; type=&quot;1&quot;&gt;\n&lt;li
  class=&quot;m_-3038221639477575808MsoListParagraph&quot;&gt;&lt;strong&gt;What changed at AP
 EX and Why it Matters\, a review of APEX 2026&lt;/strong&gt;&lt;strong&gt;. Presented 
 by&amp;nbsp\;&lt;/strong&gt;&lt;strong&gt;Leo Lambert of Eptac Corporation&lt;/strong&gt;&lt;/li&gt;\n
 &lt;/ol&gt;&lt;br /&gt;&lt;br /&gt;Agenda: &lt;br /&gt;&lt;p class=&quot;MsoNormal&quot;&gt;&lt;strong&gt;Agenda:&lt;/stron
 g&gt;&lt;/p&gt;\n&lt;p class=&quot;MsoNormal&quot;&gt;5:00 PM &amp;ndash\; 6:30 PM&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;
 &amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\; Registration\, Networking\, Tab
 le Top Displays/Demos\, Manufacturing Facility Tours&lt;/p&gt;\n&lt;p class=&quot;MsoNor
 mal&quot;&gt;6:00 PM &amp;ndash\; 7:00 PM&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nb
 sp\;&amp;nbsp\;&amp;nbsp\; Italian Buffet Dinner&lt;/p&gt;\n&lt;p class=&quot;MsoNormal&quot;&gt;7:00 PM
  &amp;ndash\; 7:30 PM&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;
 nbsp\; Announcements\,&amp;nbsp\;&lt;strong&gt;Presentation: Overview of Mack Techno
 logies&lt;/strong&gt;&lt;/p&gt;\n&lt;p class=&quot;MsoNormal&quot;&gt;7:30 PM &amp;ndash\; 8:00 PM&amp;nbsp\;&amp;
 nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\; Presentation 1 &amp;nd
 ash\;&amp;nbsp\;&lt;strong&gt;Driving Quality in Electronics Mfg.: Advanced Packagin
 g\, Process Tools &amp;amp\; Smart Package Selection\, Q&amp;amp\;A&lt;/strong&gt;&lt;/p&gt;\n
 &lt;p class=&quot;MsoNormal&quot;&gt;8:00 PM &amp;ndash\; 8:30 PM&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;
 nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\; Presentation 2 &amp;ndash\;&amp;nbsp\;&lt;strong&gt;P
 &lt;/strong&gt;&lt;strong&gt;ackaging Selection as a Root Cause of Failure in Microele
 ctronics Chip Tray\, &amp;amp\; Waffle Pack Systems\, Q&amp;amp\;A&lt;/strong&gt;&lt;/p&gt;\n&lt;
 p class=&quot;MsoNormal&quot;&gt;8:30 PM &amp;ndash\; 9:15 PM&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;n
 bsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\; Presentation 3 &amp;ndash\;&amp;nbsp\;&lt;strong&gt;Wh
 at changed at APEX and Why it Matters\, a review of APEX 2026\, Q&amp;amp\;A&lt;/
 strong&gt;&lt;/p&gt;\n&lt;p class=&quot;MsoNormal&quot;&gt;9:15 PM &amp;ndash\; 9:30 PM&amp;nbsp\;&amp;nbsp\;&amp;n
 bsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\;&amp;nbsp\; Closing Announcements\,&amp;nb
 sp\;&lt;strong&gt;Meeting Adjourns&lt;/strong&gt;&lt;/p&gt;
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