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DTSTART:20260308T030000
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DTSTAMP:20260523T055924Z
UID:7C2D0541-8963-4642-B7EC-2FC508AF840A
DTSTART;TZID=America/Chicago:20260708T215300
DTEND;TZID=America/Chicago:20260708T215500
DESCRIPTION:IEEE AP-S Technical Committee (TC4) Workshop on\nMetamaterials 
 and Smart Electromagnetic Environments\n\nDate: July 8\, 2026\n\nVenue: Co
 mputer Design Research and Learning Center\, University of Illinois Chicag
 o\, Chicago\, USA\n\nOrganizers and Chairs\n\nPai-Yen Chen\, University of
  Illinois Chicago\, USA (pychen@uic.edu)\n\nAlessio Monti\, Roma Tre Unive
 rsity\, Italy (alessio.monti@uniroma3.it)\n\nDanilo Erricolo\, University 
 of Illinois Chicago\, USA derric1@uic.edu)\n\nProgram Summary\n\nThe IEEE 
 AP-S Technical Committee on Metamaterials (TC4) and the University of Illi
 nois Chicago (UIC) will co-organize a full-day workshop on Metamaterials a
 nd Smart Electromagnetic Environments in Chicago\, USA. This event convene
 d leading researchers and engineers to examine transformative advancements
  in metasurfaces\, reconfigurable intelligent surfaces (RIS)\, and next-ge
 neration antenna and wireless systems\, as well as their cutting-edge inte
 gration with AI\, digital twin\, quantum and chip technologies.\n\nThe wor
 kshop commenced with welcoming remarks from Danilo Erricolo (UIC)\, who pr
 ovided a strategic overview of IEEE AP-S initiatives designed to bolster t
 he global antennas and electromagnetics research community. Following this
 \, Pai-Yen Chen (UIC)\, Chair of the IEEE Chicago AP-S/MTT-S Joint Chapter
 \, delivered an update on local chapter activities and professional develo
 pment opportunities. Alessio Monti (Roma Tre University) then detailed the
  mission of TC4\, highlighting its critical role in steering the evolution
  of metamaterial technologies.\n\nThe technical program showcased state-of
 -the-art electromagnetic research and emerging applications across wireles
 s sensing and communications\, biomedical\, and quantum technologies. Serv
 ing as a dynamic and interactive forum\, the workshop facilitated high-lev
 el knowledge exchange between leading experts\, academia\, industry\, and 
 IEEE Young Professionals.\n\nAgenda: \n\n\nBldg: Computer Design Research 
 and Learning Center (CDRLC) \, 850 W. Taylor Street\, Chicago\, Illinois\,
  United States\, IL 60607
LOCATION:Bldg: Computer Design Research and Learning Center (CDRLC) \, 850 
 W. Taylor Street\, Chicago\, Illinois\, United States\, IL 60607
ORGANIZER:pychen@uic.edu
SEQUENCE:4
SUMMARY:IEEE AP-S Technical Committee (TC4) Workshop on Metamaterials and S
 mart Electromagnetic Environments
URL;VALUE=URI:https://events.vtools.ieee.org/m/560623
X-ALT-DESC:Description: &lt;br /&gt;&lt;p class=&quot;MsoNormal&quot;&gt;&lt;img src=&quot;https://events
 .vtools.ieee.org/vtools_ui/media/display/d2584f9d-4831-4de2-872a-471d694dc
 b36&quot;&gt;&lt;/p&gt;\n&lt;p class=&quot;MsoNormal&quot;&gt;&amp;nbsp\;&lt;/p&gt;\n&lt;p class=&quot;MsoNormal&quot;&gt;&lt;strong&gt;
 IEEE AP-S Technical Committee (TC4) Workshop on&lt;br&gt;Metamaterials and Smart
  Electromagnetic Environments&lt;/strong&gt;&lt;/p&gt;\n&lt;p class=&quot;MsoNormal&quot;&gt;&lt;strong&gt;D
 ate:&lt;/strong&gt;&amp;nbsp\;July 8\, 2026&lt;/p&gt;\n&lt;p class=&quot;MsoNormal&quot;&gt;&lt;strong&gt;Venue:
 &lt;/strong&gt;&amp;nbsp\;Computer Design Research and Learning Center\, University 
 of Illinois Chicago\, Chicago\, USA&lt;/p&gt;\n&lt;p class=&quot;MsoNormal&quot;&gt;&lt;strong&gt;Orga
 nizers and Chairs&lt;/strong&gt;&lt;/p&gt;\n&lt;p class=&quot;MsoNormal&quot;&gt;Pai-Yen Chen\, Univer
 sity of Illinois Chicago\, USA (&lt;a href=&quot;mailto:pychen@uic.edu&quot;&gt;pychen@uic
 .edu&lt;/a&gt;)&lt;/p&gt;\n&lt;p class=&quot;MsoNormal&quot;&gt;Alessio Monti\, Roma Tre University\, 
 Italy (&lt;a href=&quot;mailto:alessio.monti@uniroma3.it&quot;&gt;alessio.monti@uniroma3.i
 t&lt;/a&gt;)&lt;/p&gt;\n&lt;p class=&quot;MsoNormal&quot;&gt;Danilo Erricolo\, University of Illinois 
 Chicago\, USA &lt;a href=&quot;mailto:derric1@uic.edu&quot;&gt;derric1@uic.edu&lt;/a&gt;)&lt;/p&gt;\n&lt;
 p class=&quot;MsoNormal&quot;&gt;&lt;strong&gt;Program Summary&lt;/strong&gt;&lt;/p&gt;\n&lt;p class=&quot;MsoNor
 mal&quot;&gt;The IEEE AP-S Technical Committee on Metamaterials (TC4) and the Univ
 ersity of Illinois Chicago (UIC) will co-organize a full-day workshop on M
 etamaterials and Smart Electromagnetic Environments in Chicago\, USA. This
  event convened leading researchers and engineers to examine transformativ
 e advancements in metasurfaces\, reconfigurable intelligent surfaces (RIS)
 \, and next-generation antenna and wireless systems\, as well as their cut
 ting-edge integration with AI\, digital twin\, quantum and chip technologi
 es.&lt;/p&gt;\n&lt;p class=&quot;MsoNormal&quot;&gt;The workshop commenced with welcoming remark
 s from Danilo Erricolo (UIC)\, who provided a strategic overview of IEEE A
 P-S initiatives designed to bolster the global antennas and electromagneti
 cs research community. Following this\, Pai-Yen Chen (UIC)\, Chair of the 
 IEEE Chicago AP-S/MTT-S Joint Chapter\, delivered an update on local chapt
 er activities and professional development opportunities. Alessio Monti (R
 oma Tre University) then detailed the mission of TC4\, highlighting its cr
 itical role in steering the evolution of metamaterial technologies.&lt;/p&gt;\n&lt;
 p class=&quot;MsoNormal&quot;&gt;The technical program showcased state-of-the-art elect
 romagnetic research and emerging applications across wireless sensing and 
 communications\, biomedical\, and quantum technologies. Serving as a dynam
 ic and interactive forum\, the workshop facilitated high-level knowledge e
 xchange between leading experts\, academia\, industry\, and IEEE Young Pro
 fessionals.&lt;/p&gt;&lt;br /&gt;&lt;br /&gt;Agenda: &lt;br /&gt;&lt;p&gt;&amp;nbsp\; &lt;img src=&quot;https://even
 ts.vtools.ieee.org/vtools_ui/media/display/e4a843b1-342e-4d18-ad41-34b48f3
 09f8f&quot;&gt;&lt;/p&gt;\n&lt;p&gt;&amp;nbsp\; &amp;nbsp\; &amp;nbsp\; &amp;nbsp\;&lt;img src=&quot;https://events.vt
 ools.ieee.org/vtools_ui/media/display/88ea9193-bdf6-4f53-86ef-71c6ad9531a2
 &quot; width=&quot;655&quot; height=&quot;352&quot;&gt;&lt;/p&gt;\n&lt;p&gt;&lt;img src=&quot;https://events.vtools.ieee.o
 rg/vtools_ui/media/display/3bbf2f08-922d-40e9-8e11-6a38e954bbe8&quot;&gt;&lt;/p&gt;\n&lt;p&gt;
 &amp;nbsp\;&lt;/p&gt;
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