BEGIN:VCALENDAR VERSION:2.0 PRODID:IEEE vTools.Events//EN CALSCALE:GREGORIAN BEGIN:VTIMEZONE TZID:Europe/Stockholm BEGIN:DAYLIGHT DTSTART:20260329T030000 TZOFFSETFROM:+0100 TZOFFSETTO:+0200 RRULE:FREQ=YEARLY;BYDAY=-1SU;BYMONTH=3 TZNAME:CEST END:DAYLIGHT BEGIN:STANDARD DTSTART:20261025T020000 TZOFFSETFROM:+0200 TZOFFSETTO:+0100 RRULE:FREQ=YEARLY;BYDAY=-1SU;BYMONTH=10 TZNAME:CET END:STANDARD END:VTIMEZONE BEGIN:VEVENT DTSTAMP:20260608T085112Z UID:1C629C9C-07B5-4257-9F0D-BBD4C53ABB6B DTSTART;TZID=Europe/Stockholm:20260609T091500 DTEND;TZID=Europe/Stockholm:20260609T220000 DESCRIPTION:[]AI data centers are driving the value of the semiconductor in dustry as well as developments in advanced packaging for GPUs/ASIC based a ccelerators\, CPUs\, and XPUs. Supporting packages are also critical to en ablement of the data center\, including power modules. Package options in production and under developing will be presented. Concerns of energy use and water consumption are driving a system-level approach to provide bette r solutions. Memory demand is driving the need for an increasing number of HBM stacks\, larger interposer sizes\, and increasingly complex substrate s that require more area. This growth put strains on the industry in terms of memory\, interposer\, substrate\, and assembly capacity to meet the gr owing demand. Trends in package architectures\, materials\, and cooling op tions are described. Limitations to growth are highlighted.\n\nE. Jan Vard aman is president and founder of TechSearch International\, Inc.\, which h as provided market research and technology trend analysis in semiconductor packaging since 1987. She is the author of numerous publications on emerg ing trends in semiconductor packaging and assembly. She is a senior member of IEEE EPS and is an IEEE EPS Distinguished Lecturer and received the Di stinguished Achievement Certificate for Technical Leadership and Expertise in May 2024. She received the IMAPS GBC Partnership award in 2012\, the D aniel C. Hughes\, Jr. Memorial Award in 2018\, the Sidney J. Stein Interna tional Award in 2019\, and she is an IMAPS Fellow. She served on the IEEE CPMT Board of Governors for two terms. Before founding TechSearch Internat ional\, she served on the corporate staff of Microelectronics and Computer Technology Corporation (MCC)\, the electronics industry’s first pre-com petitive research consortium. She received her M.A. from University of Tex as\, in 1981.\n\nCo-sponsored by: The 2026 IMAPS Nordic Microelectronics P ackaging Conference and Exhibition\, NordPac\n\nRoom: Cyber Auditorium\, B ldg: Kista Science Tower\, Färögatan 33\, Kista\, Stockholms lan\, Swede n\, 16451\, Virtual: https://events.vtools.ieee.org/m/561576 LOCATION:Room: Cyber Auditorium\, Bldg: Kista Science Tower\, Färögatan 3 3\, Kista\, Stockholms lan\, Sweden\, 16451\, Virtual: https://events.vtoo ls.ieee.org/m/561576 ORGANIZER:jiantong@kth.se SEQUENCE:79 SUMMARY:IEEE EPS Distinguished Lecture by Jan Vardaman: Growth Drivers and Limits for Advanced Packaging in the AI Data Center Era URL;VALUE=URI:https://events.vtools.ieee.org/m/561576 X-ALT-DESC:Description: <br /><p><img style="border-style: none\; margin-le ft: 20px\; margin-right: 20px\;" src="https://nordic.imapseurope.org/wp-co ntent/uploads/sites/4/2026/01/image001.jpg" alt="" height="250" align="lef t"><span lang="EN-US" style="font-size: 16.0pt\; line-height: 115%\; font- family: 'Calibri'\,sans-serif\; mso-ascii-theme-font: minor-latin\; mso-fa reast-font-family: SimSun\; mso-fareast-theme-font: minor-fareast\; mso-ha nsi-theme-font: minor-latin\; mso-bidi-font-family: 'Times New Roman'\; ms o-bidi-theme-font: minor-bidi\; color: #000000\; mso-ansi-language: EN-US\ ; mso-fareast-language: ZH-CN\; mso-bidi-language: AR-SA\;">AI data center s are driving the value of the semiconductor industry as well as developme nts in advanced packaging for GPUs/ASIC based accelerators\, CPUs\, and XP Us.&nbsp\; Supporting packages are also critical to enablement of the data center\, including power modules.&nbsp\; Package options in production an d under developing will be presented.&nbsp\; Concerns of energy use and wa ter consumption are driving a system-level approach to provide better solu tions.&nbsp\; Memory demand is driving the need for an increasing number o f HBM stacks\, larger interposer sizes\, and increasingly complex substrat es that require more area.&nbsp\; This growth put strains on the industry in terms of memory\, interposer\, substrate\, and assembly capacity to mee t the growing demand.&nbsp\; Trends in package architectures\, materials\, and cooling options are described.&nbsp\; Limitations to growth are highl ighted.</span></p>\n<p>&nbsp\;</p>\n<p><span style="background-color: rgb( 255\, 255\, 255)\; color: rgb(35\, 111\, 161)\; font-size: 14pt\;"><strong >E. Jan Vardaman</strong> is president and founder of TechSearch Internati onal\, Inc.\, which has provided market research and technology trend anal ysis in semiconductor packaging since 1987. She is the author of numerous publications on emerging trends in semiconductor packaging and assembly. S he is a senior member of IEEE EPS and is an IEEE EPS Distinguished Lecture r and received the Distinguished Achievement Certificate for Technical Lea dership and Expertise in May 2024. She received the IMAPS GBC Partnership award in 2012\, the Daniel C. Hughes\, Jr. Memorial Award in 2018\, the Si dney J. Stein International Award in 2019\, and she is an IMAPS Fellow. Sh e served on the IEEE CPMT Board of Governors for two terms. Before foundin g TechSearch International\, she served on the corporate staff of Microele ctronics and Computer Technology Corporation (MCC)\, the electronics indus try&rsquo\;s first pre-competitive research consortium. She received her M .A. from University of Texas\, in 1981.</span></p> END:VEVENT END:VCALENDAR