BEGIN:VCALENDAR VERSION:2.0 PRODID:IEEE vTools.Events//EN CALSCALE:GREGORIAN BEGIN:VTIMEZONE TZID:America/New_York BEGIN:DAYLIGHT DTSTART:20260308T030000 TZOFFSETFROM:-0500 TZOFFSETTO:-0400 RRULE:FREQ=YEARLY;BYDAY=2SU;BYMONTH=3 TZNAME:EDT END:DAYLIGHT BEGIN:STANDARD DTSTART:20261101T010000 TZOFFSETFROM:-0400 TZOFFSETTO:-0500 RRULE:FREQ=YEARLY;BYDAY=1SU;BYMONTH=11 TZNAME:EST END:STANDARD END:VTIMEZONE BEGIN:VEVENT DTSTAMP:20260622T162722Z UID:547D05DA-59C1-4F5B-BB04-79454E8FEF94 DTSTART;TZID=America/New_York:20260625T090000 DTEND;TZID=America/New_York:20260625T100000 DESCRIPTION:IEEE Electronic Packaging Society Toronto is proud to invite yo u to a virtual distinguished lecture by Dr. Fernando Guarin of GlobalFound ries.\n\nJoin us Monday\, 25 June 2026 at 10AM (ET) 9AM(EST)\n\nAbstract\n ---------------------------------------------------------------\n\nUp to t his point in the evolution of leading-edge Silicon CMOS technologies the q ualification of the latest nodes has been carried out using the methods an d targets dictated by digital/logic applications. For RF applications digi tal centric methodology and metrics will no longer be applicable. We will discuss the reliability impact of miniaturization and the qualification ac tivities driven by the need to support reliable operation for RF circuit a pplications. The CMOS solutions for RF applications include the introducti on of SOI that may introduce additional reliability considerations. The pa th to maintaining the advanced CMOS scaling cadence and new reliability li miting factors will be examined from the reliability perspective. We will also review the reliability requirements for RF reliability devices and ap plications as we prepare to introduce technologies to serve the 5G infrast ructure requirements. A closer look will be given to Hot Carriers. The cha racterization\, models and qualification methodologies will be put in the required perspective for the successful qualification and transfer of lead ing-edge technologies to a manufacturing environment.\n\nSpeaker(s): Dr.Fe rnando Guarin\, \n\nVirtual: https://events.vtools.ieee.org/m/561746 LOCATION:Virtual: https://events.vtools.ieee.org/m/561746 ORGANIZER:jiupeng.zhang@mail.utoronto.ca SEQUENCE:22 SUMMARY:[IEEE CAS04/ED15/EP21/PHO36 EDS Distinguished Lecture] Reliability Topics for the Miniaturization and Qualification of Advanced Silicon CMOS Technologies URL;VALUE=URI:https://events.vtools.ieee.org/m/561746 X-ALT-DESC:Description: <br /><p><span style="font-size: 14pt\; font-family : arial\, helvetica\, sans-serif\;">IEEE Electronic Packaging Society Toro nto is proud to invite you to a virtual distinguished lecture by Dr. Ferna ndo Guarin of GlobalFoundries.</span></p>\n<p><span style="font-size: 14pt \; font-family: arial\, helvetica\, sans-serif\;">Join us Monday\, 25 June 2026 at <s>10AM (ET) </s><span style="color: rgb(45\, 194\, 107)\;">9AM(E ST)</span></span></p>\n<p>&nbsp\;</p>\n<p><span style="font-size: 18pt\; f ont-family: arial\, helvetica\, sans-serif\;"><strong>Abstract</strong></s pan></p>\n<hr>\n<p style="margin: 0cm\;"><span lang="EN-US" style="color: black\; font-size: 14pt\; font-family: arial\, helvetica\, sans-serif\;">U p to this point in the evolution of leading-edge Silicon CMOS technologies the qualification of the latest nodes has been carried out using the meth ods and targets dictated by digital/logic applications.&nbsp\; For RF appl ications digital centric methodology and metrics will no longer be applica ble.&nbsp\; We will discuss the reliability impact of miniaturization and the qualification activities driven by the need to support reliable operat ion for RF circuit applications. &nbsp\; The CMOS solutions for RF applica tions include the introduction of SOI that may introduce additional reliab ility considerations.&nbsp\; &nbsp\; The path to maintaining the advanced CMOS scaling cadence and new reliability limiting factors will be examined from the reliability perspective. We will also review the reliability req uirements for RF reliability devices and applications as we prepare to int roduce technologies to serve the 5G infrastructure requirements. A closer look will be given to Hot Carriers.&nbsp\; The characterization\, models a nd qualification methodologies will be put in the required perspective for the successful qualification and transfer of leading-edge technologies to a manufacturing environment.&nbsp\;</span></p>\n<p style="margin: 0cm\;"> &nbsp\;</p>\n<p style="margin: 0cm\;"><span lang="EN-US" style="color: bla ck\; font-size: 12pt\; font-family: arial\, helvetica\, sans-serif\;"><img style="display: block\; margin-left: auto\; margin-right: auto\;" src="ht tps://events.vtools.ieee.org/vtools_ui/media/display/ef06f1db-0ebc-4f6e-b9 e6-37946662789c" width="976" height="549"></span></p> END:VEVENT END:VCALENDAR