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DTSTAMP:20260612T125619Z
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DTSTART;TZID=Asia/Kolkata:20260604T150000
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DESCRIPTION:We are pleased to invite you to an Industry Talk being organize
 d by the IEEE IES Guwahati Chapter as part of the 3rd IEEE Guwahati Subsec
 tion Conference (GCON 2026).\n\nTitle: Workforce Development for Six Sigma
  Manufacturing Capabilities of Legacy Packaging Technologies at OSATs and 
 Advanced Packaging Technologies in the Future\n\nSpeaker: Prof. Shankar Pr
 asad\nProfessor of Practice\, IIT Guwahati\n\nDate: 4 June 2026 (Thursday)
 \nTime: 3:00 PM – 4:00 PM\nVenue: IEEE GCON 2026\, IIT Guwahati\n\nThe t
 alk will focus on the evolving semiconductor packaging ecosystem\, highlig
 hting workforce development strategies required for achieving Six Sigma ma
 nufacturing capabilities in legacy packaging technologies at OSATs (Outsou
 rced Semiconductor Assembly and Test facilities)\, while also addressing t
 he skills and competencies needed for emerging advanced packaging technolo
 gies.\n\nThis session will provide valuable insights for students\, resear
 chers\, academicians\, and industry professionals interested in semiconduc
 tor manufacturing\, quality engineering\, advanced packaging\, and workfor
 ce readiness for the future of the electronics industry.\n\nWe cordially i
 nvite you to attend this informative session and interact with the speaker
 .\n\nWe look forward to your participation.\n\nWith regards\,\n\nIEEE IES 
 Guwahati Chapter\n\nguwahati\, Assam\, India\, 781039
LOCATION:guwahati\, Assam\, India\, 781039
ORGANIZER:sonkar@iitg.ac.in
SEQUENCE:10
SUMMARY:Workforce Development for Six Sigma Manufacturing Capabilities of L
 egacy Packaging Technologies at OSATs and Advanced Packaging Technologies 
 in the Future
URL;VALUE=URI:https://events.vtools.ieee.org/m/562260
X-ALT-DESC:Description: <br /><p class="isSelectedEnd">We are pleased to in
 vite you to an Industry Talk being organized by the IEEE IES Guwahati Chap
 ter as part of the 3rd IEEE Guwahati Subsection Conference (GCON 2026).</p
 >\n<p class="isSelectedEnd"><strong>Title:</strong> <em>Workforce Developm
 ent for Six Sigma Manufacturing Capabilities of Legacy Packaging Technolog
 ies at OSATs and Advanced Packaging Technologies in the Future</em></p>\n<
 p class="isSelectedEnd"><strong>Speaker:</strong> Prof. Shankar Prasad<br>
 Professor of Practice\, IIT Guwahati</p>\n<p class="isSelectedEnd"><strong
 >Date:</strong> 4 June 2026 (Thursday)<br><strong>Time:</strong> 3:00 PM &
 ndash\; 4:00 PM<br><strong>Venue:</strong> IEEE GCON 2026\, IIT Guwahati</
 p>\n<p class="isSelectedEnd">The talk will focus on the evolving semicondu
 ctor packaging ecosystem\, highlighting workforce development strategies r
 equired for achieving Six Sigma manufacturing capabilities in legacy packa
 ging technologies at OSATs (Outsourced Semiconductor Assembly and Test fac
 ilities)\, while also addressing the skills and competencies needed for em
 erging advanced packaging technologies.</p>\n<p class="isSelectedEnd">This
  session will provide valuable insights for students\, researchers\, acade
 micians\, and industry professionals interested in semiconductor manufactu
 ring\, quality engineering\, advanced packaging\, and workforce readiness 
 for the future of the electronics industry.</p>\n<p class="isSelectedEnd">
 We cordially invite you to attend this informative session and interact wi
 th the speaker.</p>\n<p class="isSelectedEnd">We look forward to your part
 icipation.</p>\n<p class="isSelectedEnd">With regards\,</p>\n<p><strong>IE
 EE IES Guwahati Chapter</strong></p>
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