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DTSTART:20260308T030000
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DTSTAMP:20260607T154738Z
UID:ACC970C7-4ADC-4D3B-96C3-B5E0AB5D563F
DTSTART;TZID=America/Los_Angeles:20260724T150000
DTEND;TZID=America/Los_Angeles:20260724T163000
DESCRIPTION:The advent of artificial intelligence\, high-performance comput
 ing\, data centers\, health\, automotive and communication is driving the 
 quest for more creative integration methods. Future packaging technologies
  will exhibit high interconnect densities and large numbers of diverse com
 ponents and devices. Such schemes are expected to offer relaxed transactio
 ns between components\, increased bandwidth\, and better energy efficiency
 . To achieve these potentials\, the implementation of these systems will r
 equire assistance from design tools that can handle unmatched levels of co
 mplexity and highly complex computational challenges. This talk will addre
 ss recent developments in computer-aided design (CAD) tools for interconne
 cts and packages. We will emphasize the signal integrity\, power and bandw
 idth requirements. Multi-domain and multi-physics challenges will be explo
 red as well as potential co-design solutions.\n\nSpeaker(s): José E. Schu
 tt-Ainé\n\nBldg: Qualcomm Building Q Auditorium\, 6455 Lusk Blvd\, San Di
 ego\, California\, United States\, 92121
LOCATION:Bldg: Qualcomm Building Q Auditorium\, 6455 Lusk Blvd\, San Diego\
 , California\, United States\, 92121
ORGANIZER:vaishnav.srinivas@gmail.com
SEQUENCE:12
SUMMARY:IEEE Lecture - Co-Design and Tools for Heterogeneous Integration - 
 Challenges and Opportunities
URL;VALUE=URI:https://events.vtools.ieee.org/m/562784
X-ALT-DESC:Description: <br /><p style="text-align: justify\;">The advent o
 f artificial intelligence\, high-performance computing\, data centers\,&nb
 sp\;health\, automotive and communication is driving the quest for more cr
 eative integration&nbsp\;methods. Future packaging technologies will exhib
 it high interconnect densities and large&nbsp\;numbers of diverse componen
 ts and devices. Such schemes are expected to offer relaxed&nbsp\;transacti
 ons between components\, increased bandwidth\, and better energy efficienc
 y. To achieve&nbsp\;these potentials\, the implementation of these systems
  will require assistance from design tools &nbsp\;that can handle unmatche
 d levels of complexity and highly complex computational challenges.&nbsp\;
 This talk will address recent developments in computer-aided design (CAD) 
 tools for&nbsp\;interconnects and packages. We will emphasize the signal i
 ntegrity\, power and bandwidth&nbsp\;requirements. Multi-domain and multi-
 physics challenges will be explored as well as potential&nbsp\;co-design s
 olutions.</p>
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