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DTSTART:20260308T030000
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DTSTART:20261101T010000
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DTSTAMP:20260619T193426Z
UID:BB3DF58D-12DB-4A93-8935-790C1420C3CD
DTSTART;TZID=America/New_York:20260713T110000
DTEND;TZID=America/New_York:20260713T120000
DESCRIPTION:[]Microelectronics serve as the structural backbone for both gl
 obal economic competitiveness and as our national defense strategy and for
 ms the technical foundation for a wide array of applications. These includ
 e high-performance computing\, artificial intelligence\, autonomous system
 s\, communications networks\, and integrated sensing ecosystems. Next-gene
 ration microelectronic technologies are shifting away from traditional 2D 
 silicon scaling by embracing 3D Heterogeneous Integration (3DHI)\, which v
 ertically stacks and interconnects diverse materials. This leap enables un
 precedented processing power\, miniaturization\, and energy efficiency cru
 cial for advanced computing\, sensing and communication systems.\nThis tal
 k will focus on this grand vision as well as recent advances in the next-g
 eneration microelectronics and manufacturing for sensing and communication
  systems. It will highlight challenges and opportunities for innovations t
 o address traditional physical scaling limits.\n\nSpeaker(s): Hasan Sharif
 i\, \n\nBldg: WALC 2127\, Purdue University\, West Lafayette\, Indiana\, U
 nited States\, Virtual: https://events.vtools.ieee.org/m/564441
LOCATION:Bldg: WALC 2127\, Purdue University\, West Lafayette\, Indiana\, U
 nited States\, Virtual: https://events.vtools.ieee.org/m/564441
ORGANIZER:p.wesling@ieee.org
SEQUENCE:16
SUMMARY:Next Generation Microelectronics for Sensing & Communication System
 s: Challenges and Opportunities for Innovations from Novel Materials\, Dev
 ices & Circuits to Advanced Packaging & 3D Heterogenous Integration
URL;VALUE=URI:https://events.vtools.ieee.org/m/564441
X-ALT-DESC:Description: <br /><p><img style="float: right\;" src="https://e
 vents.vtools.ieee.org/vtools_ui/media/display/dd81ebf1-14e6-4671-a15a-099e
 0a08386e" alt="" width="419" height="179">Microelectronics serve as the st
 ructural backbone for both global economic competitiveness and as our nati
 onal defense strategy and forms the technical foundation for a wide array 
 of applications. These include high-performance computing\, artificial int
 elligence\, autonomous systems\, communications networks\, and integrated 
 sensing ecosystems. Next-generation microelectronic technologies are shift
 ing away from traditional 2D silicon scaling by embracing 3D Heterogeneous
  Integration (3DHI)\, which vertically stacks and interconnects diverse ma
 terials. This leap enables unprecedented processing power\, miniaturizatio
 n\, and energy efficiency crucial for advanced computing\, sensing and com
 munication systems.<br>This talk will focus on this grand vision as well a
 s recent advances in the next-generation microelectronics and manufacturin
 g for sensing and communication systems. It will highlight challenges and 
 opportunities for innovations to address traditional physical scaling limi
 ts.</p>
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