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DTSTART:20260308T030000
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DTSTART:20261101T010000
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DTSTAMP:20260628T184642Z
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DTSTART;TZID=America/New_York:20260713T110000
DTEND;TZID=America/New_York:20260713T120000
DESCRIPTION:[]POSTPONED -- register yourself\, to hear about the new date!\
 n\nMicroelectronics serve as the structural backbone for both global econo
 mic competitiveness and as our national defense strategy and forms the tec
 hnical foundation for a wide array of applications. These include high-per
 formance computing\, artificial intelligence\, autonomous systems\, commun
 ications networks\, and integrated sensing ecosystems. Next-generation mic
 roelectronic technologies are shifting away from traditional 2D silicon sc
 aling by embracing 3D Heterogeneous Integration (3DHI)\, which vertically 
 stacks and interconnects diverse materials. This leap enables unprecedente
 d processing power\, miniaturization\, and energy efficiency crucial for a
 dvanced computing\, sensing and communication systems.\nThis talk will foc
 us on this grand vision as well as recent advances in the next-generation 
 microelectronics and manufacturing for sensing and communication systems. 
 It will highlight challenges and opportunities for innovations to address 
 traditional physical scaling limits.\n\nSpeaker(s): Hasan Sharifi\, \n\nBl
 dg: WALC 2127\, Purdue University\, West Lafayette\, Indiana\, United Stat
 es\, Virtual: https://events.vtools.ieee.org/m/564441
LOCATION:Bldg: WALC 2127\, Purdue University\, West Lafayette\, Indiana\, U
 nited States\, Virtual: https://events.vtools.ieee.org/m/564441
ORGANIZER:p.wesling@ieee.org
SEQUENCE:17
SUMMARY:Next Generation Microelectronics for Sensing & Communication System
 s: Challenges and Opportunities for Innovations from Novel Materials\, Dev
 ices & Circuits to Advanced Packaging & 3D Heterogenous Integration
URL;VALUE=URI:https://events.vtools.ieee.org/m/564441
X-ALT-DESC:Description: <br /><p><img style="float: right\;" src="https://e
 vents.vtools.ieee.org/vtools_ui/media/display/dd81ebf1-14e6-4671-a15a-099e
 0a08386e" alt="" width="419" height="179"><em><strong>POSTPONED -- registe
 r yourself\, to hear about the new date!</strong></em></p>\n<p><br>Microel
 ectronics serve as the structural backbone for both global economic compet
 itiveness and as our national defense strategy and forms the technical fou
 ndation for a wide array of applications. These include high-performance c
 omputing\, artificial intelligence\, autonomous systems\, communications n
 etworks\, and integrated sensing ecosystems. Next-generation microelectron
 ic technologies are shifting away from traditional 2D silicon scaling by e
 mbracing 3D Heterogeneous Integration (3DHI)\, which vertically stacks and
  interconnects diverse materials. This leap enables unprecedented processi
 ng power\, miniaturization\, and energy efficiency crucial for advanced co
 mputing\, sensing and communication systems.<br>This talk will focus on th
 is grand vision as well as recent advances in the next-generation microele
 ctronics and manufacturing for sensing and communication systems. It will 
 highlight challenges and opportunities for innovations to address traditio
 nal physical scaling limits.</p>
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