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TZID:Asia/Kolkata
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DTSTART:19451014T230000
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TZOFFSETTO:+0530
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BEGIN:VEVENT
DTSTAMP:20260630T153953Z
UID:C5EDBDFA-F8C8-4C8F-81AF-27C5850D2E4E
DTSTART;TZID=Asia/Kolkata:20260701T120000
DTEND;TZID=Asia/Kolkata:20260701T130000
DESCRIPTION:The micro and nanoelectronics device evolution towards fully in
 tegration in our daily life has been driven by Moore’s law\, requiring t
 he use of novel materials\, the development of novel processing schemes an
 d the switch toward novel design concepts and device architectures.\nSemic
 onductors are everywhere\, are essential to solve humanitarian challenges 
 and are at the basis of innovative technologies such as AI. Device archite
 ctures such as FinFETs\, TFETs\, Gate-All-Around\, nanowires (NWs)\, nanos
 heets (NSs)\, CFET and Forksheet structures for logic and analog/RF buildi
 ng blocks enable System-on-Chip (SoC) applications. The strong progress ac
 hieved in silicon technology and heterogenous integration of Ge and III-V 
 technologies on a silicon platform results in the on-chip integration of b
 uilding blocks with different functionality. In addition \,there is a comm
 ercial breakthrough of GaN devices\, although dependent on the application
  competing with SiC . Major trends in process integration approaches are r
 eviewed and technological challenges of some process modules and device st
 ructures highlighted.\n\nRoom: G-54\, Bldg: AITR\, acropolis institute of 
 technology and research\, Mangliya\, Indore\, Indore\, Madhya Pradesh\, In
 dia\, 452001
LOCATION:Room: G-54\, Bldg: AITR\, acropolis institute of technology and re
 search\, Mangliya\, Indore\, Indore\, Madhya Pradesh\, India\, 452001
ORGANIZER:alpanadeshmukh@acropolis.in
SEQUENCE:17
SUMMARY:ADVANCED SEMICONDUCTOR TECHNOLOGY AND DEVICE ARCHITECTURES FOR THE 
 NEXT DECADE
URL;VALUE=URI:https://events.vtools.ieee.org/m/565796
X-ALT-DESC:Description: <br /><p>The micro and nanoelectronics device evolu
 tion towards fully integration in our daily life has&nbsp\;been driven by 
 Moore&rsquo\;s law\, requiring the use of novel materials\, the developmen
 t of novel&nbsp\;processing schemes and the switch toward novel design con
 cepts and device architectures.<br>Semiconductors are everywhere\, are ess
 ential to solve humanitarian challenges and are at the basis of innovative
  technologies such as AI. Device architectures such as FinFETs\, TFETs\, G
 ate-All-Around\, nanowires (NWs)\, nanosheets (NSs)\, CFET and Forksheet s
 tructures for logic and analog/RF building blocks&nbsp\;enable System-on-C
 hip (SoC) applications. The strong progress achieved in silicon&nbsp\;tech
 nology and heterogenous integration of Ge and III-V technologies on a sili
 con platform results in the on-chip integration of building blocks with di
 fferent functionality. In addition \,there is a commercial breakthrough of
  GaN devices\, although dependent on the application competing with SiC . 
 Major trends in process integration approaches are reviewed and technologi
 cal challenges of some process modules and device structures highlighted.<
 /p>
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