BEGIN:VCALENDAR VERSION:2.0 PRODID:IEEE vTools.Events//EN CALSCALE:GREGORIAN BEGIN:VTIMEZONE TZID:Europe/Copenhagen BEGIN:DAYLIGHT DTSTART:20260329T030000 TZOFFSETFROM:+0100 TZOFFSETTO:+0200 RRULE:FREQ=YEARLY;BYDAY=-1SU;BYMONTH=3 TZNAME:CEST END:DAYLIGHT BEGIN:STANDARD DTSTART:20261025T020000 TZOFFSETFROM:+0200 TZOFFSETTO:+0100 RRULE:FREQ=YEARLY;BYDAY=-1SU;BYMONTH=10 TZNAME:CET END:STANDARD END:VTIMEZONE BEGIN:VEVENT DTSTAMP:20260703T223503Z UID:67CA3C31-69E9-4A81-924B-913F2AAF4650 DTSTART;TZID=Europe/Copenhagen:20260902T140000 DTEND;TZID=Europe/Copenhagen:20260902T150000 DESCRIPTION:This webinar introduces FastRC\, a mesh-based modelling methodo logy for rapid extraction of electrical resistance and thermal impedance i n three-dimensional conductors and thermal structures. The method discreti ses arbitrary geometries into regular mesh cells and formulates the equiva lent electrical or thermal network using modified nodal analysis.\n\nA str eaming Kron reduction algorithm is then applied to eliminate internal node s while preserving the behaviour at boundary and user-defined points of in terest. This allows very large electrical and thermal problems to be solve d with significantly reduced memory requirements.\n\nThe webinar will cove r geometry discretisation\, material assignment\, network construction\, b oundary conditions\, Kron reduction\, and post-processing of voltage\, cur rent\, temperature\, and heat-flow distributions. Applications include PCB traces\, power busbars\, semiconductor packages\, and package-level therm al models.\n\nThe session will also discuss accuracy\, computational compl exity\, benchmarking examples\, and practical considerations for using Fas tRC as a fast alternative between simplified lumped models and full finite -element analysis.\n\nSpeaker: Prof. Cheng Zhang\n\nAffiliation: The Unive rsity of Manchester\, UK\n\nCo-sponsored by: Naime Ahmadi\n\nVirtual: http s://events.vtools.ieee.org/m/566323 LOCATION:Virtual: https://events.vtools.ieee.org/m/566323 ORGANIZER:sssa@energy.aau.dk SEQUENCE:117 SUMMARY:FastRC: Fast Resistance and Thermal Impedance Extraction Using Mesh -Based Modelling and Streaming Kron Reduction URL;VALUE=URI:https://events.vtools.ieee.org/m/566323 X-ALT-DESC:Description: <br /><p class="PDq2pG_selectionAnchorContainer" da ta-start="765" data-end="1130">This webinar introduces FastRC\, a mesh-bas ed modelling methodology for rapid extraction of electrical resistance and thermal impedance in three-dimensional conductors and thermal structures. The method discretises arbitrary geometries into regular mesh cells and f ormulates the equivalent electrical or thermal network using modified noda l analysis.</p>\n<p data-start="1132" data-end="1408">A streaming Kron red uction algorithm is then applied to eliminate internal nodes while preserv ing the behaviour at boundary and user-defined points of interest. This al lows very large electrical and thermal problems to be solved with signific antly reduced memory requirements.</p>\n<p data-start="1410" data-end="172 6">The webinar will cover geometry discretisation\, material assignment\, network construction\, boundary conditions\, Kron reduction\, and post-pro cessing of voltage\, current\, temperature\, and heat-flow distributions. Applications include PCB traces\, power busbars\, semiconductor packages\, and package-level thermal models.</p>\n<p data-start="1728" data-end="195 1" data-is-last-node="" data-is-only-node="">The session will also discuss accuracy\, computational complexity\, benchmarking examples\, and practic al considerations for using FastRC as a fast alternative between simplifie d lumped models and full finite-element analysis.</p>\n<p data-start="1728 " data-end="1951" data-is-last-node="" data-is-only-node="">&nbsp\;</p>\n< p data-start="1728" data-end="1951" data-is-last-node="" data-is-only-node ="">Speaker: Prof. Cheng Zhang</p>\n<p data-start="1728" data-end="1951" d ata-is-last-node="" data-is-only-node="">Affiliation: The University of Ma nchester\, UK</p> END:VEVENT END:VCALENDAR