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DTSTAMP:20260714T192428Z
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DTSTART;TZID=America/Los_Angeles:20260810T080000
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DESCRIPTION:The IEEE Electronics Packaging Society (EPS) San Diego Chapter\
 , in partnership with San Diego State University (SDSU)\, is pleased to pr
 esent a three-day summer school focused on the fundamentals and emerging t
 rends in electronic packaging design and characterization.\n\nThe program 
 is designed for senior undergraduate students\, graduate students\, recent
  graduates\, and practicing engineers interested in advanced packaging tec
 hnologies\, heterogeneous integration\, signal integrity\, power integrity
 \, thermal management\, materials\, package characterization\, and electro
 nic design automation.\n\nAgenda: \nThe first two days will feature lectur
 es from leading experts in industry and academia\, followed by hands-on de
 monstrations and training sessions using advanced EDA and measurement tool
 s provided by Keysight Technologies. The third day will include an industr
 y site visit to Kyocera.\n\nTopics Include\n\n- Signal Integrity and S-Par
 ameters\n- Power Distribution Network (PDN) Measurement\n- Electronic Pack
 aging Materials\n- Advanced Semiconductor Packaging\n- Heterogeneous Integ
 ration\n- Package Thermal Design\n- Die-Package Co-Design\n- 5G Beamformer
  Packaging\n- Integrated Passives\n- Package Characterization and Measurem
 ents\n- Electronic Design Automation for Advanced Packaging\n\nSan Diego S
 tate University\, San Diego\, California\, United States\, 92182
LOCATION:San Diego State University\, San Diego\, California\, United State
 s\, 92182
ORGANIZER:vaishnav.srinivas@gmail.com
SEQUENCE:27
SUMMARY:IEEE Electronic Packaging Design and Characterization Summer School
  2026
URL;VALUE=URI:https://events.vtools.ieee.org/m/567281
X-ALT-DESC:Description: <br /><div>\n<p>The IEEE Electronics Packaging Soci
 ety (EPS) San Diego Chapter\, in partnership with San Diego State Universi
 ty (SDSU)\, is pleased to present a three-day summer school focused on the
  fundamentals and emerging trends in electronic packaging design and chara
 cterization.</p>\n<p>The program is designed for senior undergraduate stud
 ents\, graduate students\, recent graduates\, and practicing engineers int
 erested in advanced packaging technologies\, heterogeneous integration\, s
 ignal integrity\, power integrity\, thermal management\, materials\, packa
 ge characterization\, and electronic design automation.</p>\n</div><br /><
 br />Agenda: <br /><p>The first two days will feature lectures from leadin
 g experts in industry and academia\, followed by hands-on demonstrations a
 nd training sessions using advanced EDA and measurement tools provided by 
 Keysight Technologies. The third day will include an industry site visit t
 o Kyocera.</p>\n<h3><span style="font-size: 12pt\;">Topics Include</span><
 /h3>\n<ul>\n<li>Signal Integrity and S-Parameters</li>\n<li>Power Distribu
 tion Network (PDN) Measurement</li>\n<li>Electronic Packaging Materials</l
 i>\n<li>Advanced Semiconductor Packaging</li>\n<li>Heterogeneous Integrati
 on</li>\n<li>Package Thermal Design</li>\n<li>Die-Package Co-Design</li>\n
 <li>5G Beamformer Packaging</li>\n<li>Integrated Passives</li>\n<li>Packag
 e Characterization and Measurements</li>\n<li>Electronic Design Automation
  for Advanced Packaging</li>\n</ul>
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