BEGIN:VCALENDAR
VERSION:2.0
PRODID:IEEE vTools.Events//EN
CALSCALE:GREGORIAN
BEGIN:VTIMEZONE
TZID:America/Los_Angeles
BEGIN:DAYLIGHT
DTSTART:20260308T030000
TZOFFSETFROM:-0800
TZOFFSETTO:-0700
RRULE:FREQ=YEARLY;BYDAY=2SU;BYMONTH=3
TZNAME:PDT
END:DAYLIGHT
BEGIN:STANDARD
DTSTART:20261101T010000
TZOFFSETFROM:-0700
TZOFFSETTO:-0800
RRULE:FREQ=YEARLY;BYDAY=1SU;BYMONTH=11
TZNAME:PST
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTAMP:20260731T211255Z
UID:903BA3EC-98C7-47AD-8B00-D549285674FE
DTSTART;TZID=America/Los_Angeles:20260810T080000
DTEND;TZID=America/Los_Angeles:20260812T170000
DESCRIPTION:The IEEE Electronics Packaging Society (EPS) San Diego Chapter\
 , in partnership with San Diego State University (SDSU)\, is pleased to pr
 esent a three-day summer school focused on the fundamentals and emerging t
 rends in electronic packaging design and characterization.\n\nThe program 
 is designed for senior undergraduate students\, graduate students\, recent
  graduates\, and practicing engineers interested in advanced packaging tec
 hnologies\, heterogeneous integration\, signal integrity\, power integrity
 \, thermal management\, materials\, package characterization\, and electro
 nic design automation.\n\nAgenda: \nThe first two days will feature lectur
 es from leading experts in industry and academia\, followed by hands-on de
 monstrations and training sessions using advanced EDA and measurement tool
 s provided by Keysight Technologies. The third day will include an industr
 y site visit to Kyocera.\n\nTopics Include\n\n- Signal Integrity and S-Par
 ameters\n- Power Distribution Network (PDN) Measurement\n- Electronic Pack
 aging Materials\n- Advanced Semiconductor Packaging\n- Heterogeneous Integ
 ration\n- Package Thermal Design\n- Die-Package Co-Design\n- 5G Beamformer
  Packaging\n- Integrated Passives\n- Package Characterization and Measurem
 ents\n- Electronic Design Automation for Advanced Packaging\n\nParking Inf
 ormation\n\nAttendees can find parking information and reserve parking in 
 advance using the following link:\n[Parking Link](https://www.offstreet.io
 /events/R9T7M4I3)\n\n[image.png]\n\nBldg: Parma Payne Goodall Alumni Cente
 r\, Allan Bailey Library\, 5250 55th St\, San Diego\, California\, United 
 States\, 92182
LOCATION:Bldg: Parma Payne Goodall Alumni Center\, Allan Bailey Library\, 5
 250 55th St\, San Diego\, California\, United States\, 92182
ORGANIZER:vaishnav.srinivas@gmail.com
SEQUENCE:33
SUMMARY:IEEE Electronic Packaging Design and Characterization Summer School
  2026
URL;VALUE=URI:https://events.vtools.ieee.org/m/567281
X-ALT-DESC:Description: &lt;br /&gt;&lt;div&gt;\n&lt;p&gt;The IEEE Electronics Packaging Soci
 ety (EPS) San Diego Chapter\, in partnership with San Diego State Universi
 ty (SDSU)\, is pleased to present a three-day summer school focused on the
  fundamentals and emerging trends in electronic packaging design and chara
 cterization.&lt;/p&gt;\n&lt;p&gt;The program is designed for senior undergraduate stud
 ents\, graduate students\, recent graduates\, and practicing engineers int
 erested in advanced packaging technologies\, heterogeneous integration\, s
 ignal integrity\, power integrity\, thermal management\, materials\, packa
 ge characterization\, and electronic design automation.&lt;/p&gt;\n&lt;/div&gt;&lt;br /&gt;&lt;
 br /&gt;Agenda: &lt;br /&gt;&lt;p&gt;The first two days will feature lectures from leadin
 g experts in industry and academia\, followed by hands-on demonstrations a
 nd training sessions using advanced EDA and measurement tools provided by 
 Keysight Technologies. The third day will include an industry site visit t
 o Kyocera.&lt;/p&gt;\n&lt;h3&gt;&lt;span style=&quot;font-size: 12pt\;&quot;&gt;Topics Include&lt;/span&gt;&lt;
 /h3&gt;\n&lt;ul&gt;\n&lt;li&gt;Signal Integrity and S-Parameters&lt;/li&gt;\n&lt;li&gt;Power Distribu
 tion Network (PDN) Measurement&lt;/li&gt;\n&lt;li&gt;Electronic Packaging Materials&lt;/l
 i&gt;\n&lt;li&gt;Advanced Semiconductor Packaging&lt;/li&gt;\n&lt;li&gt;Heterogeneous Integrati
 on&lt;/li&gt;\n&lt;li&gt;Package Thermal Design&lt;/li&gt;\n&lt;li&gt;Die-Package Co-Design&lt;/li&gt;\n
 &lt;li&gt;5G Beamformer Packaging&lt;/li&gt;\n&lt;li&gt;Integrated Passives&lt;/li&gt;\n&lt;li&gt;Packag
 e Characterization and Measurements&lt;/li&gt;\n&lt;li&gt;Electronic Design Automation
  for Advanced Packaging&lt;/li&gt;\n&lt;/ul&gt;\n&lt;p&gt;&amp;nbsp\;&lt;/p&gt;\n&lt;h3&gt;&lt;span style=&quot;colo
 r: rgb(0\, 0\, 0)\;&quot;&gt;Parking Information&lt;br&gt;&lt;/span&gt;&lt;/h3&gt;\n&lt;div&gt;Attendees c
 an find parking information and reserve parking in advance using the follo
 wing link:&lt;/div&gt;\n&lt;div&gt;&lt;a title=&quot;https://www.offstreet.io/events/R9T7M4I3&quot;
  href=&quot;https://www.offstreet.io/events/R9T7M4I3&quot; data-auth=&quot;NotApplicable&quot;
  data-linkindex=&quot;81&quot; data-olk-copy-source=&quot;MessageBody&quot;&gt;Parking Link&lt;/a&gt;&lt;/
 div&gt;\n&lt;div&gt;&amp;nbsp\;&lt;/div&gt;\n&lt;div&gt;&lt;img class=&quot;Do8Zj&quot; tabindex=&quot;0&quot; src=&quot;https:
 //events.vtools.ieee.org/vtools_ui/media/display/ab7acf56-c274-4a3a-9dcb-4
 17ebf887800&quot; alt=&quot;image.png&quot; width=&quot;146&quot; height=&quot;146&quot; crossorigin=&quot;use-cre
 dentials&quot; data-imagetype=&quot;AttachmentByCid&quot; data-custom=&quot;AAkALgAAAAAAHYQDEa
 pmEc2byACqAC%2FEWg0A15800Yk9AUS%2BGJX6wUudBgABCWYnOwAAARIAEAAKsJazynqCSavG
 3w0UPnQF&quot;&gt;&amp;nbsp\;&lt;/div&gt;
END:VEVENT
END:VCALENDAR

