BEGIN:VCALENDAR VERSION:2.0 PRODID:IEEE vTools.Events//EN CALSCALE:GREGORIAN BEGIN:VTIMEZONE TZID:Europe/Bucharest BEGIN:DAYLIGHT DTSTART:20270328T040000 TZOFFSETFROM:+0200 TZOFFSETTO:+0300 RRULE:FREQ=YEARLY;BYDAY=-1SU;BYMONTH=3 TZNAME:EEST END:DAYLIGHT BEGIN:STANDARD DTSTART:20261025T030000 TZOFFSETFROM:+0300 TZOFFSETTO:+0200 RRULE:FREQ=YEARLY;BYDAY=-1SU;BYMONTH=10 TZNAME:EET END:STANDARD END:VTIMEZONE BEGIN:VEVENT DTSTAMP:20260728T130721Z UID:CB141CA7-4795-479B-82B7-7412F2139D22 DTSTART;TZID=Europe/Bucharest:20261104T080000 DTEND;TZID=Europe/Bucharest:20261106T200000 DESCRIPTION:The main objective of ISETC is to bring together researchers an d industry professionals in the technical fields of Electronics\, Telecomm unications\, and Information Technologies in order to increase the underst anding of emerging scientific ideas and research methodologies\, dissemina te the latest progress\, discoveries\, and innovative applications\, and p romote and strengthen partnerships and cooperation between academia and in dustry.\n\nCo-sponsored by: Faculty of Electronics\, Telecommunications an d Information Technologies\, Politehnica University Timisoara\n\nAgenda: \ nWe are pleased to invite you to submit your latest research results to th e 17th International Symposium on Electronics and Telecommunications (ISET C 2026)\, which will take place in Timișoara\, Romania\, on November 4– 6\, 2026. The symposium is organized by the Faculty of Electronics\, Telec ommunications and Information Technologies\, Politehnica University Timiș oara\, in cooperation with the IEEE Romania Section\, COM and SP/COM/IT Jo int Chapters\, the Association of Electrical Engineers from Timișoara\, a nd the Romanian Academy of Technical Sciences.\nIEEE Conference Record Num ber: 71924 https://conferences.ieee.org/conferences_events/conferences/con ferencedetails/71924\nConference Topics: Authors are invited to submit ori ginal contributions in\, but not limited to\, the following areas:\nElectr onics\, Telecommunications and Information Technologies.\n\nElectronics\nS emiconductor Technologies\; Analog\, Mixed and Digital ICs\; VLSI Technolo gies\; FPGA and applications\;\nIntegrated Circuits Fabrication\; Embedded Systems\; Advances in 3OM and Photonics Technologies\;\nElectronic packag ing\; Power Converters\, Topologies and Design\; Modern Control in Power E lectronics\;\nRenewable Energy Power Systems\; Power Quality\; Modelling a nd Simulation in Power Electronics\;\nGrids\, Smart Grids\; Power Converte rs for Electric Vehicles\;\nInstrumentation\, sensors\, measurement techni ques and devices\; Industry 4.0 applications for smart manufacturing\nElec tromagnetic Compatibility\, Microwaves\, Antenna and Propagation\; Biomedi cal Applications\;\nAutomation solutions in dynamically reconfigurable man ufacturing processes\;\nReal-Time applications for measurement techniques\ , data acquisition and processing\n\nTelecommunications\nAdaptive and Non- linear Signal Processing\;  Statistical Signal Processing\;\nSignal anal ysis\, Transform\, Reconstruction and Compressive sensing\;\nSpeech and Au dio Signal Processing\;  RADAR\, Video and 3D Signal Processing\;\nWater marking\; Security\nModel-Based Deep Learning applied in Signal processing for telecommunications\nAntennas and propagation\;\nNetwork and Service M anagement\; Telecom Software\, Network Virtualization\, and Software Defin ed Networks\nData Science and Artificial Intelligence for Communications\;  Internet of Things and Sensor Networks\n3G\, 4G and 5G Communication N etworks\;  Satellite communications\nInformation Technologies\nDeep Lear ning\, Reinforcement Learning\, Machine Learning\; Deep Neural Networks\, LLM\, SNN\;\nFuzzy Systems\, Evolutionary Computing\; Computer Vision\; Me dical Imaging\;\nComputational Photography\; Biometrics\, Face\, Gesture\, Body\, Gait\; Natural Language Processing\;\nAutomated Optical Inspection \; EdgeAI\;\nOpen Education and Open Science: Open Access\, Open Publishin g\, Open Research\, Open Educational resources\nMOOCs and Blended Learning \; Digital Transformation of Higher Education\; Game Based Learning\nBlock chain Technologies\; Internet of Things\;\nRobotic systems in enhanced per ception\, autonomous and intelligent integrations\;  AI applications\n\n Publication\nProspective authors are invited to submit papers of up to six pages using the IEEE conference template (A4 format): [Instructions - ISE TC](https://isetc.upt.ro/conference/instructions) All submissions will und ergo a peer-review process. Accepted and presented papers will be submitte d for inclusion in the IEEE Xplore Digital Library. Since 2010\, ISETC pro ceedings have been indexed in major databases including IEEE Xplore\, Clar ivate Web of Science\, and Scopus. Selected high-quality papers will be in vited to submit extended versions to Applied Sciences (Q2 in Engineering\, Multidisciplinary\, IF 2.9).\nImportant Dates\n\n- Paper Submission Deadl ine: August 30\, 2026 https://isetc.upt.ro/conference/submission\n- Notifi cation of Acceptance: September 1\, 2026\n- Camera-Ready Submission: Septe mber 10\, 2026\n-\nAuthor Registration Deadline: September 20\, 2026\n\nFu rther Information\nWebsite: [http://isetc.upt.ro](http://isetc.upt.ro/)\nE mail: simpo.etc@upt.ro\nWe would greatly appreciate it if you could circul ate this call among colleagues\, researchers\, and doctoral students who m ay be interested in participating.\nWe look forward to receiving your subm issions and welcoming you to Timișoara for ISETC 2026.\nKind regards\,\nI SETC 2026 Organizing Committee\nFaculty of Electronics\, Telecommunication s and Information Technologies\nPolitehnica University Timișoara\nRomania \n\nBd. V.Parvan no.2 B\, Timisoara\, Timis\, Romania LOCATION:Bd. V.Parvan no.2 B\, Timisoara\, Timis\, Romania ORGANIZER:gstamatescu@ieee.org SEQUENCE:24 SUMMARY:2026 International Symposium on Electronics and Telecommunications (ISETC) URL;VALUE=URI:https://events.vtools.ieee.org/m/567698 X-ALT-DESC:Description: <br /><p>The main objective of ISETC is to bring to gether researchers and industry professionals in the technical fields of E lectronics\, Telecommunications\, and Information Technologies in order to increase the understanding of emerging scientific ideas and research meth odologies\, disseminate the latest progress\, discoveries\, and innovative applications\, and promote and strengthen partnerships and cooperation be tween academia and industry.</p><br /><br />Agenda: <br /><div class="x_el ementToProof" data-olk-copy-source="MessageBody">We are pleased to invite you to submit your latest research results to the&nbsp\;<strong>17th Inter national Symposium on Electronics and Telecommunications (ISETC 2026)</str ong>\, which will take place in&nbsp\;<strong>Timișoara\, Romania\, on No vember 4&ndash\;6\, 2026</strong>. The symposium is organized by the&nbsp\ ;<strong>Faculty of Electronics\, Telecommunications and Information Techn ologies\, Politehnica University Timișoara</strong>\, in cooperation with the&nbsp\;<strong>IEEE Romania Section</strong>\,&nbsp\;<strong>COM and S P/COM/IT Joint Chapters</strong>\, the&nbsp\;<strong>Association of Electr ical Engineers from Timișoara</strong>\, and the&nbsp\;<strong>Romanian A cademy of Technical Sciences</strong>.</div>\n<div class="x_elementToProof "><strong>IEEE Conference Record Number: 71924</strong>&nbsp\;<a id="OWA9b b0a54d-ea6a-4f35-74d5-2ef5e1eff694" class="x_OWAAutoLink" title="https://c onferences.ieee.org/conferences_events/conferences/conferencedetails/71924 " href="https://conferences.ieee.org/conferences_events/conferences/confer encedetails/71924" target="_blank" rel="noopener noreferrer" data-auth="No tApplicable" data-linkindex="0">https://conferences.ieee.org/conferences_e vents/conferences/conferencedetails/71924</a></div>\n<div class="x_element ToProof"><strong>Conference Topics:&nbsp\;</strong>Authors are invited to submit original contributions in\, but not limited to\, the following area s:</div>\n<div class="x_elementToProof"><strong>Electronics\, Telecommunic ations and Information Technologies.</strong></div>\n<div class="x_element ToProof"><strong>&nbsp\;</strong></div>\n<div class="x_elementToProof"><st rong>Electronics</strong></div>\n<div class="x_elementToProof">Semiconduct or Technologies\;&nbsp\; Analog\, Mixed and Digital ICs\; VLSI Technologie s\; FPGA and applications\;</div>\n<div class="x_elementToProof">Integrate d Circuits Fabrication\; Embedded Systems\; Advances in 3OM and Photonics Technologies\;</div>\n<div class="x_elementToProof">Electronic packaging\; Power Converters\, Topologies and Design\; Modern Control in Power Electr onics\;</div>\n<div class="x_elementToProof">Renewable Energy Power System s\; Power Quality\; Modelling and Simulation in Power Electronics\;</div>\ n<div class="x_elementToProof">Grids\, Smart Grids\; Power Converters for Electric Vehicles\;</div>\n<div class="x_elementToProof">Instrumentation\, sensors\, measurement techniques and devices\; Industry 4.0 applications for smart manufacturing</div>\n<div class="x_elementToProof">Electromagnet ic Compatibility\, Microwaves\, Antenna and Propagation\; Biomedical Appli cations\;</div>\n<div class="x_elementToProof">Automation solutions in dyn amically reconfigurable manufacturing processes\;</div>\n<div class="x_ele mentToProof">Real-Time applications for measurement techniques\, data acqu isition and processing</div>\n<div>\n<div class="x_elementToProof"><strong >Telecommunications</strong></div>\n<div class="x_elementToProof">Adaptive and Non-linear Signal Processing\; &ensp\;Statistical Signal Processing\; </div>\n<div class="x_elementToProof">Signal analysis\, Transform\, Recons truction and Compressive sensing\;</div>\n<div class="x_elementToProof">Sp eech and Audio Signal Processing\; &ensp\;RADAR\, Video and 3D Signal Proc essing\;</div>\n<div class="x_elementToProof">Watermarking\; Security</div >\n<div class="x_elementToProof">Model-Based Deep Learning applied in Sign al processing for telecommunications</div>\n<div class="x_elementToProof"> Antennas and propagation\;</div>\n<div class="x_elementToProof">Network an d Service Management\; Telecom Software\, Network Virtualization\, and Sof tware Defined Networks</div>\n<div class="x_elementToProof">Data Science a nd Artificial Intelligence for Communications\; &ensp\;Internet of Things and Sensor Networks</div>\n<div class="x_elementToProof">3G\, 4G and 5G Co mmunication Networks\; &ensp\;Satellite communications</div>\n</div>\n<div class="x_elementToProof"><strong>Information Technologies</strong></div>\ n<div class="x_elementToProof">Deep Learning\, Reinforcement Learning\, Ma chine Learning\; Deep Neural Networks\, LLM\, SNN\;</div>\n<div class="x_e lementToProof">Fuzzy Systems\, Evolutionary Computing\; Computer Vision\;& nbsp\; Medical Imaging\;</div>\n<div class="x_elementToProof">Computationa l Photography\; Biometrics\, Face\, Gesture\, Body\, Gait\; Natural Langua ge Processing\;</div>\n<div class="x_elementToProof">Automated Optical Ins pection\; EdgeAI\;</div>\n<div class="x_elementToProof">Open Education and Open Science: Open Access\, Open Publishing\, Open Research\, Open Educat ional resources</div>\n<div class="x_elementToProof">MOOCs and Blended Lea rning\; Digital Transformation of Higher Education\; Game Based Learning</ div>\n<div class="x_elementToProof">Blockchain Technologies\; Internet of Things\;</div>\n<div class="x_elementToProof">Robotic systems in enhanced perception\, autonomous and intelligent integrations\; &ensp\;AI applicati ons</div>\n<div>&nbsp\;</div>\n<div class="x_elementToProof"><strong>Publi cation</strong></div>\n<div class="x_elementToProof">Prospective authors a re invited to submit papers of&nbsp\;<strong>up to six pages</strong> usin g the IEEE conference template (A4 format): <a href="https://isetc.upt.ro/ conference/instructions">Instructions - ISETC</a> All submissions will und ergo a peer-review process. Accepted and presented papers will be submitte d for inclusion in the <strong>IEEE Xplore Digital Library</strong>. Since 2010\, ISETC proceedings have been indexed in major databases including&n bsp\;<strong>IEEE Xplore\, Clarivate Web of Science\, and Scopus</strong>. Selected high-quality papers will be invited to submit extended versions to&nbsp\;<strong>Applied Sciences&nbsp\;</strong>(Q2 in Engineering\, Mult idisciplinary\, IF 2.9).</div>\n<div class="x_elementToProof"><strong>Impo rtant Dates</strong></div>\n<ul>\n<li><strong>Paper Submission Deadline:</ strong>&nbsp\;<strong>August 30\, 2026&nbsp\;<a href="https://isetc.upt.ro /conference/submission">https://isetc.upt.ro/conference/submission</a></st rong></li>\n<li><strong>Notification of Acceptance:</strong>&nbsp\;Septemb er 1\, 2026</li>\n<li><strong>Camera-Ready Submission:</strong>&nbsp\;Sept ember 10\, 2026</li>\n<li>\n<div role="presentation"><strong>Author Regist ration Deadline:</strong>&nbsp\;September 20\, 2026&nbsp\;</div>\n</li>\n< /ul>\n<div class="x_elementToProof"><strong>Further Information</strong></ div>\n<div class="x_elementToProof">Website:&nbsp\;<strong><a class="ms-ou tlook-linkify" title="http://isetc.upt.ro" href="http://isetc.upt.ro/" tar get="_blank" rel="noopener" data-linkindex="1">http://isetc.upt.ro</a></st rong><br>Email:&nbsp\;<strong>simpo.etc@upt.ro</strong>&nbsp\;</div>\n<div class="x_elementToProof">We would greatly appreciate it if you could circ ulate this call among colleagues\, researchers\, and doctoral students who may be interested in participating.</div>\n<div class="x_elementToProof"> We look forward to receiving your submissions and welcoming you to Timișo ara for ISETC 2026.</div>\n<div class="x_elementToProof">Kind regards\,</d iv>\n<div class="x_elementToProof"><strong>ISETC 2026 Organizing Committee </strong><br>Faculty of Electronics\, Telecommunications and Information T echnologies<br>Politehnica University Timișoara<br>Romania</div> END:VEVENT END:VCALENDAR