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BEGIN:DAYLIGHT
DTSTART:20260308T030000
TZOFFSETFROM:-0800
TZOFFSETTO:-0700
RRULE:FREQ=YEARLY;BYDAY=2SU;BYMONTH=3
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DTSTART:20261101T010000
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BEGIN:VEVENT
DTSTAMP:20260718T143424Z
UID:C0836F2A-177C-4893-BE25-4D374DC49C97
DTSTART;TZID=America/Los_Angeles:20261030T080000
DTEND;TZID=America/Los_Angeles:20261030T153000
DESCRIPTION:Dear Exhibitor\, this is the page for you to register for a tab
 le. Two lunches are included. Additional lunches can be purchased on the r
 egular attendee page\, [https://events.vtools.ieee.org/m/429808](https://e
 vents.vtools.ieee.org/m/496023)\n\nCLASTECH will be at the Eravant Facilit
 y this year. We will have a 4 speakers on Microwave and Antenna topics. Th
 ere will be a box lunch from Panera Bread.\n\nSpace is limited - no onsite
  registration\n\nList of Speakers: (Last year- working on this year)\n\n1-
  Prof. Mark Rodwell\, Electrical and Computer Engineering Department\, UCS
 B\, &quot;100-300 GHz Wireless: Transistor\, ICS\, Systems&quot;\n\n2- Jenna Commiss
 o\, Opterus R&amp;D Inc.\, “Novel Deployable Apertures Utilizing High Strain
  Composite Materials”\n\n3- Dr. C. J. Reddy\, 2025 IEEE AP-S President E
 lect\, &quot;Antenna Placement\, Co-site Interference and RCS Simulations for A
 ir\, Sea and Ground Platforms&quot;\n\n4- Prof. Cristiano Tomassoni\, Departmen
 t of Engineering\, University of Perugia\, Italy\, “Additive Manufacturi
 ng: Emerging Opportunities for Microwave Components&quot;\n\nHere is a link abo
 ut Eravant https://www.eravant.com/\n\nAgenda: \n8:00 Registration and Cof
 fee\n\n9:00 AM 1st Session (Last year&#39;s talks)\nProf. Mark Rodwell\, Elect
 rical and Computer Engineering Department\, UCSB\, &quot;100-300 GHz Wireless: 
 Transistor\, ICS\, Systems&quot;\n\n10:00 - 10:30 AM Break\n(Exhibit Opens at 8
 :30 AM)\n\n10:30 AM 2nd Session\nJenna Commisso\, Opterus R&amp;D Inc.\, &quot;Nove
 l Deployable Apertures Utilizing High Strain Composite Materials&quot;\n\n11:30
  AM - 1:00 PM Lunch\n\n1:00 PM - 2:00 PM 3rd Session\nDr. C. J. Reddy\, 20
 25 IEEE AP-S President Elect\, &quot;Antenna Placement\, Co-site Interference a
 nd RCS Simulations for Air\, Sea and Ground Platforms&quot;\n\n2:00 - 2:30 PM B
 reak\n(Exhibition Closes at 3:30 PM)\n\n2:30 PM - 3:30 PM 4th Session\nPro
 f. Cristiano Tomassoni\, Department of Engineering\, University of Perugia
 \, Italy\, &quot;Additive Manufacturing: Emerging Opportunities for Microwave C
 omponents&quot;\n\nBldg: Eravant\, 501 Amapola Avenue\, Torrance\, California\,
  United States\, 90501
LOCATION:Bldg: Eravant\, 501 Amapola Avenue\, Torrance\, California\, Unite
 d States\, 90501
ORGANIZER:c.jackson@ieee.org
SEQUENCE:17
SUMMARY:CLASTECH 2026- Exhibitor Registration
URL;VALUE=URI:https://events.vtools.ieee.org/m/568523
X-ALT-DESC:Description: &lt;br /&gt;&lt;p&gt;&lt;img src=&quot;https://events.vtools.ieee.org/v
 tools_ui/media/display/5cac64f0-4826-44af-95c4-c2563e124dbb&quot;&gt; &amp;nbsp\; &lt;img
  src=&quot;https://events.vtools.ieee.org/vtools_ui/media/display/557ad6ef-b940
 -4a6f-a7b3-ad4f34585583&quot; width=&quot;168&quot; height=&quot;177&quot;&gt;&lt;/p&gt;\n&lt;p&gt;&amp;nbsp\;&lt;/p&gt;\n&lt;p
 &gt;Dear Exhibitor\, this is the page for you to register for a table. Two lu
 nches are included.&amp;nbsp\; Additional lunches can be purchased on the regu
 lar attendee page\, &lt;a href=&quot;https://events.vtools.ieee.org/m/496023&quot;&gt;http
 s://events.vtools.ieee.org/m/429808&lt;/a&gt;&lt;/p&gt;\n&lt;p&gt;CLASTECH will be at the Er
 avant Facility this year.&amp;nbsp\; We will have a 4 speakers on Microwave an
 d Antenna topics.&amp;nbsp\; There will be a box lunch from Panera Bread.&lt;/p&gt;\
 n&lt;p&gt;Space is limited - no onsite registration&lt;/p&gt;\n&lt;p&gt;List of Speakers:&amp;nb
 sp\; (Last year- working on this year)&lt;/p&gt;\n&lt;p&gt;1-&amp;nbsp\;&lt;strong&gt;Prof. Mark
  Rodwell\, Electrical and Computer Engineering Department\, UCSB&lt;/strong&gt;\
 , &quot;100-300 GHz Wireless: Transistor\, ICS\, Systems&quot;&lt;/p&gt;\n&lt;p&gt;2-&amp;nbsp\;&lt;str
 ong&gt;Jenna Commisso\, Opterus R&amp;amp\;D Inc.\,&amp;nbsp\;&lt;/strong&gt;&amp;ldquo\;Novel 
 Deployable Apertures Utilizing High Strain Composite Materials&amp;rdquo\;&lt;/p&gt;
 \n&lt;p&gt;3- &amp;nbsp\;&lt;strong&gt;Dr. C. J. Reddy\, 2025 IEEE AP-S President Elect\,&lt;
 /strong&gt;&amp;nbsp\;&quot;Antenna Placement\, Co-site Interference and RCS Simulatio
 ns for Air\, Sea and Ground Platforms&quot;&lt;/p&gt;\n&lt;p&gt;4-&amp;nbsp\;&lt;strong&gt;Prof. Cris
 tiano Tomassoni\, Department of Engineering\, University of Perugia\, Ital
 y&lt;/strong&gt;\, &amp;ldquo\;Additive Manufacturing: Emerging Opportunities for Mi
 crowave Components&quot;&amp;nbsp\;&lt;/p&gt;\n&lt;p&gt;Here is a link about Eravant&amp;nbsp\;&lt;a h
 ref=&quot;https://www.eravant.com/&quot;&gt;https://www.eravant.com/&lt;/a&gt;&amp;nbsp\;&lt;/p&gt;&lt;br 
 /&gt;&lt;br /&gt;Agenda: &lt;br /&gt;&lt;p&gt;8:00 Registration and Coffee&lt;/p&gt;\n&lt;p&gt;9:00 AM 1st 
 Session&amp;nbsp\; (Last year&#39;s talks)&lt;br&gt;Prof. Mark Rodwell\, Electrical and 
 Computer Engineering Department\, UCSB\, &quot;100-300 GHz Wireless: Transistor
 \, ICS\, Systems&quot;&lt;/p&gt;\n&lt;p&gt;10:00 - 10:30 AM Break&amp;nbsp\;&lt;br&gt;(Exhibit Opens 
 at 8:30 AM)&lt;/p&gt;\n&lt;p&gt;10:30 AM 2nd Session&amp;nbsp\;&lt;br&gt;Jenna Commisso\, Opteru
 s R&amp;amp\;D Inc.\, &quot;Novel Deployable Apertures Utilizing High Strain Compos
 ite Materials&quot;&lt;/p&gt;\n&lt;p&gt;11:30 AM - 1:00 PM Lunch&lt;/p&gt;\n&lt;p&gt;1:00 PM - 2:00 PM 
 3rd Session&lt;br&gt;Dr. C. J. Reddy\, 2025 IEEE AP-S President Elect\, &quot;Antenna
  Placement\, Co-site Interference and RCS Simulations for Air\, Sea and Gr
 ound Platforms&quot;&lt;/p&gt;\n&lt;p&gt;2:00 - 2:30 &amp;nbsp\;PM Break&lt;br&gt;(Exhibition Closes 
 at 3:30 PM) &amp;nbsp\;&lt;/p&gt;\n&lt;p&gt;2:30 PM - 3:30 PM 4th Session&lt;br&gt;Prof. Cristia
 no Tomassoni\, Department of Engineering\, University of Perugia\, Italy\,
  &quot;Additive Manufacturing: Emerging Opportunities for Microwave Components&quot;
 &lt;/p&gt;
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