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DTSTART:20260329T030000
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DTSTART:20261025T020000
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DTSTAMP:20260821T133610Z
UID:0EB31F2B-4300-4465-9263-9172B870D752
DTSTART;TZID=Europe/Zurich:20260907T150000
DTEND;TZID=Europe/Zurich:20260907T180000
DESCRIPTION:The IEEE Electronics Packaging Society (EPS) Chapter is pleased
  to invite you to a Distinguished Lecturer event featuring Dr. Dongkai Sha
 ngguan\, IEEE Fellow\, IMAPS Fellow\, and internationally recognized exper
 t in advanced electronics packaging and semiconductor manufacturing.\n\nLe
 cture: Advanced Semiconductor Packaging: Technology Trends\, Reliability a
 nd Thermal Management\n\nThe lecture will provide insights into emerging p
 ackaging technologies\, reliability challenges\, and thermal management so
 lutions for next-generation semiconductor systems. The event will conclude
  with a networking apéro\, offering an excellent opportunity to engage wi
 th researchers\, students\, and industry professionals and to establish ne
 w collaborations.\n\nThis event is sponsored in part by the IEEE EPS Socie
 ty Distinguished Lecturer Program.\n\nSpeaker(s): \, Dongkai Shangguan\n\n
 Room: ETZ E 81\, Bldg: ETZ\, Gloriastrasse 35\, Zurich\, Switzerland\, Swi
 tzerland\, 8092
LOCATION:Room: ETZ E 81\, Bldg: ETZ\, Gloriastrasse 35\, Zurich\, Switzerla
 nd\, Switzerland\, 8092
ORGANIZER:cornelia.nef@ost.ch
SEQUENCE:54
SUMMARY:IEEE EPS Distinguished Lecture on Advanced Semiconductor Packaging
URL;VALUE=URI:https://events.vtools.ieee.org/m/568963
X-ALT-DESC:Description: &lt;br /&gt;&lt;p&gt;The IEEE Electronics Packaging Society (EP
 S) Chapter is pleased to invite you to a Distinguished Lecturer event feat
 uring&amp;nbsp\;&lt;strong&gt;Dr. Dongkai Shangguan&lt;/strong&gt;\, IEEE Fellow\, IMAPS F
 ellow\, and internationally recognized expert in advanced electronics pack
 aging and semiconductor manufacturing.&lt;/p&gt;\n&lt;p&gt;&lt;strong&gt;Lecture:&lt;/strong&gt;&amp;n
 bsp\;&lt;em&gt;Advanced Semiconductor Packaging: Technology Trends\, Reliability
  and Thermal Management&lt;/em&gt;&lt;/p&gt;\n&lt;p&gt;The lecture will provide insights int
 o emerging packaging technologies\, reliability challenges\, and thermal m
 anagement solutions for next-generation semiconductor systems. The event w
 ill conclude with a networking ap&amp;eacute\;ro\, offering an excellent oppor
 tunity to engage with researchers\, students\, and industry professionals 
 and to establish new collaborations.&lt;/p&gt;\n&lt;p&gt;This event is sponsored in pa
 rt by the IEEE EPS Society Distinguished Lecturer Program.&lt;/p&gt;
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