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DTSTART:20260308T030000
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DTSTART:20261101T010000
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DTSTAMP:20260722T011137Z
UID:D89A8501-E753-4972-AC78-214C2F1AB94C
DTSTART;TZID=America/Los_Angeles:20260731T110000
DTEND;TZID=America/Los_Angeles:20260731T120000
DESCRIPTION:With the increasing demands for higher signal speeds coupled wi
 th the need for decreasing feature sizes\, interconnect related signal int
 egrity effects such as delay\, distortion\, reflections\, crosstalk\, grou
 nd bounce and electromagnetic interference have become the dominant factor
 s limiting the performance of high-speed systems. These effects can be div
 erse and can seriously impact the design performance at all hierarchical l
 evels including integrated circuits\, printed circuit boards\, multi-chip 
 modules and backplanes. This talk provides a comprehensive approach for un
 derstanding the multidisciplinary problem of signal integrity: issues/mode
 ling/analysis in high-speed designs.\n\nSpeaker(s): Ramachandra\n\nRoom: H
 enry Booker Room\, Bldg: Jacobs Hall\, 9736 Engineers Ln\, La Jolla\, CA 9
 2093\, San Diego\, California\, United States
LOCATION:Room: Henry Booker Room\, Bldg: Jacobs Hall\, 9736 Engineers Ln\, 
 La Jolla\, CA 92093\, San Diego\, California\, United States
ORGANIZER:nkoripally@ucsd.edu
SEQUENCE:16
SUMMARY:DL - Emerging High-Speed Nanoscale Interconnect Issues and Modellin
 g Challenges 
URL;VALUE=URI:https://events.vtools.ieee.org/m/569006
X-ALT-DESC:Description: &lt;br /&gt;&lt;p class=&quot;MsoNormal&quot; style=&quot;text-align: justi
 fy\;&quot;&gt;&lt;span style=&quot;font-size: 12.0pt\; line-height: 115%\;&quot;&gt;With the incre
 asing demands for higher signal speeds coupled with the need for decreasin
 g feature sizes\, interconnect related signal integrity effects such as de
 lay\, distortion\, reflections\, crosstalk\, ground bounce and electromagn
 etic interference have become the dominant factors limiting the performanc
 e of high-speed systems. These effects can be diverse and can seriously im
 pact the design performance at all hierarchical levels including integrate
 d circuits\, printed circuit boards\, multi-chip modules and backplanes. T
 his talk provides a comprehensive approach for understanding the multidisc
 iplinary problem of signal integrity: issues/modeling/analysis in high-spe
 ed designs.&lt;/span&gt;&lt;/p&gt;
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