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VERSION:2.0
PRODID:IEEE vTools.Events//EN
CALSCALE:GREGORIAN
BEGIN:VTIMEZONE
TZID:Asia/Taipei
BEGIN:STANDARD
DTSTART:19790930T230000
TZOFFSETFROM:+0900
TZOFFSETTO:+0800
TZNAME:CST
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BEGIN:VEVENT
DTSTAMP:20260924T165046Z
UID:67FD8C49-C23D-4001-A307-9B6099D3E2EF
DTSTART;TZID=Asia/Taipei:20261022T130000
DTEND;TZID=Asia/Taipei:20261022T140000
DESCRIPTION:Cu-Cu hybrid bonding is one of the flip-chip Bumpless assembly 
 technologies. The advantages of hybrid bonding are: (a) higher density\, (
 b) finer pad pitch\, (c) lower profile\, and (d) better performance. In th
 is lecture\, some fundamentals and more than 21 high-volume manufacturing 
 (HVM) or to be in HVM products and 12 new applications using hybrid bondin
 g will be presented. In the next few years\, we will see more implementati
 ons of Cu-Cu hybrid bonding\, whether it is for performance\, form factor\
 , power consumption or cost. The content of this lecture is shown below.\n
 \nSpeaker(s): Dr. John Lau\n\nAgenda: \n- Introduction\n- Origin of Hybrid
  Bonding\n- Cu-Cu Hybrid Bonding Fundamentals\n- 21 HVM or to be in HVM Pr
 oducts with Hybrid Bonding\n- 12 New Applications with Hybrid Bonding\n- S
 ummary\n- Potential R&D Topics in Hybrid Bonding\n\nRoom: Area L\, 4F\, TP
 CA Show Main Stage\, Bldg: Taipei Nangang Exhibition Center\, Hall 1 (TaiN
 EX 1)\, No. 1\, Jingmao 2nd Rd.\, Nangang Dist.\, Taipei\, T'ai-pei\, Taiw
 an
LOCATION:Room: Area L\, 4F\, TPCA Show Main Stage\, Bldg: Taipei Nangang Ex
 hibition Center\, Hall 1 (TaiNEX 1)\, No. 1\, Jingmao 2nd Rd.\, Nangang Di
 st.\, Taipei\, T'ai-pei\, Taiwan
ORGANIZER:crkao@ntu.edu.tw
SEQUENCE:205
SUMMARY:IMPACT Distinguished Lecture - Cu-Cu Hybrid Bonding for Chiplets He
 terogeneous Integration
URL;VALUE=URI:https://events.vtools.ieee.org/m/569751
X-ALT-DESC:Description: <br /><p style="text-align: justify\;">Cu-Cu hybrid
  bonding is one of the flip-chip Bumpless assembly technologies. The advan
 tages of hybrid bonding are: (a) higher density\, (b) finer pad pitch\, (c
 ) lower profile\, and (d) better performance. In this lecture\, some funda
 mentals and more than 21 high-volume manufacturing (HVM) or to be in HVM p
 roducts and 12 new applications using hybrid bonding will be presented. In
  the next few years\, we will see more implementations of Cu-Cu hybrid bon
 ding\, whether it is for performance\, form factor\, power consumption or 
 cost. The content of this lecture is shown below.</p><br /><br />Agenda: <
 br /><ul>\n<li>Introduction</li>\n<li>Origin of Hybrid Bonding</li>\n<li>C
 u-Cu Hybrid Bonding Fundamentals</li>\n<li>21 HVM or to be in HVM Products
  with Hybrid Bonding</li>\n<li>12 New Applications with Hybrid Bonding</li
 >\n<li>Summary</li>\n<li>Potential R&amp\;D Topics in Hybrid Bonding</li>\
 n</ul>
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