BEGIN:VCALENDAR
VERSION:2.0
PRODID:IEEE vTools.Events//EN
CALSCALE:GREGORIAN
BEGIN:VTIMEZONE
TZID:America/Los_Angeles
BEGIN:DAYLIGHT
DTSTART:20270314T030000
TZOFFSETFROM:-0800
TZOFFSETTO:-0700
RRULE:FREQ=YEARLY;BYDAY=2SU;BYMONTH=3
TZNAME:PDT
END:DAYLIGHT
BEGIN:STANDARD
DTSTART:20261101T010000
TZOFFSETFROM:-0700
TZOFFSETTO:-0800
RRULE:FREQ=YEARLY;BYDAY=1SU;BYMONTH=11
TZNAME:PST
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTAMP:20260811T154420Z
UID:9422CBC7-0998-4FF7-A758-A0A492168309
DTSTART;TZID=America/Los_Angeles:20261112T080000
DTEND;TZID=America/Los_Angeles:20261113T170000
DESCRIPTION:[]This 2-day symposium focuses on quantified reliability\, acce
 lerated testing and probabilistic assessments of the useful lifetime of el
 ectronic\, photonic\, MEMS and MOEMS materials\, assemblies\, packages and
  systems in electronics and photonics packaging. This includes failure mod
 es\, stress levels\, mechanisms\, testing schemes\, accelerated testing\, 
 and environmental stresses. The intent is to bring together electrical\, r
 eliability\, materials\, mechanical\, and computer engineers and applied s
 cientists to address the state-of-the-art in all the interconnected fields
  of electronic and photonic packaging\, with an emphasis on various reliab
 ilit-yrelated aspects: design-for-reliability\, manufacturing\, reliabilit
 y modeling and accelerated testing.\n\nLocation: In person at UCLA\, and o
 ver IEEE WebEx\nDates: November 12-13\, 2026\nCost: $90 ($75 for IEEE memb
 ers\, $35 for WebEx) through Oct. 16\n\nUCLA\, Los Angeles\, California\, 
 United States
LOCATION:UCLA\, Los Angeles\, California\, United States
ORGANIZER:p.wesling@ieee.org
SEQUENCE:12
SUMMARY:Seventh Annual IEEE Symposium on Reliability for Electronics and Ph
 otonics Packaging (REPP)
URL;VALUE=URI:https://events.vtools.ieee.org/m/572167
X-ALT-DESC:Description: <br /><p><img style="float: right\;" src="https://e
 vents.vtools.ieee.org/vtools_ui/media/display/0185f22f-3ecb-4977-a425-5e3d
 6a1ac899" alt="" width="432" height="204">This 2-day symposium focuses on 
 quantified reliability\, accelerated testing and probabilistic assessments
  of the useful lifetime of electronic\, photonic\, MEMS and MOEMS material
 s\, assemblies\, packages and systems in electronics and photonics packagi
 ng.&nbsp\; This includes failure modes\, stress levels\, mechanisms\, test
 ing schemes\, accelerated testing\, and environmental stresses.&nbsp\; The
  intent is to bring together electrical\, reliability\, materials\, mechan
 ical\, and computer engineers and applied scientists to address the state-
 of-the-art in all the interconnected fields of electronic and photonic pac
 kaging\, with an emphasis on various reliabilit-yrelated aspects: design-f
 or-reliability\, manufacturing\, reliability modeling and accelerated test
 ing.</p>\n<p><strong>Location</strong>: In person at UCLA\, and over IEEE 
 WebEx<br><strong>Dates</strong>: November 12-13\, 2026<br><strong>Cost</st
 rong>: $90 ($75 for IEEE members\, $35 for WebEx) through Oct. 16</p>\n<p>
 &nbsp\;</p>
END:VEVENT
END:VCALENDAR