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DTSTART;TZID=America/Denver:20260910T190000
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DESCRIPTION:Abstract: The traditional computer system often had one silicon
  die attached to one package which was attached to the system’s motherbo
 ard. The package\, which sits in the middle\, helped translate the ultra-f
 ine silicon connections to a more manageable density for the system’s mo
 therboard. The need for faster processing and higher density systems has c
 hallenged this convention. Today’s package supports multiple processors 
 and in many cases 8-12 additional memory silicon die. Electrically connect
 ing all these die on one package has led to many thermal\, mechanical and 
 electrical challenges. In this presentation\, Chris Fieldsend will outline
  how the industry got here and what solutions have been used in the past 5
  years to deliver a major increase in speeds and density.\n\nStudents and 
 professionals are welcome to attend. Registration is encouraged to help us
  plan attendance and communicate event updates.\n\nParking: Parking inform
 ation at CU Boulder will be provided to event registrants closer to the ev
 ent date.\n\n** This event is part of the Front Range Speaker Series that 
 brings together students\, faculty\, IEEE members\, and engineering profes
 sionals for technical talks from experts across industry and academia. The
  speaker series is co-hosted by the IEEE University of Colorado Boulder St
 udent Branch and the IEEE Denver Section. The series is open to all levels
  from technical beginners to experts.\n\nUpcoming Talks:\n\n- Thursday\, O
 ctober 8\, 2026: &quot;Chiplets - What / Why / Where&quot; by Judd Gerber (Intel)\n-
  Thursday\, November 5\, 2026:&quot;Package and PCB Materials&quot; by Darren Hitchc
 ock (Panasonic)\n- Thursday\, December 3\, 2026: Student presentations sho
 wcasing research and industry topics\n\nAgenda: \nExample Agenda\n\n- 6:45
 –7:00 PM — Arrival and attendee check-in\n- 7:00–7:10 PM — Welcome
  and speaker introduction\n- 7:10–8:10 PM — Speaker presentation\n- 8:
 10–8:20 PM — Q&amp;A and discussion\n- 8:20–8:30 PM — Closing remarks 
 and upcoming speaker-series announcements\n\nRoom: ECCR 200\, Bldg: Engine
 ering Center\, 1111 Engineering Drive\, Boulder\, Colorado\, United States
 \, 80309
LOCATION:Room: ECCR 200\, Bldg: Engineering Center\, 1111 Engineering Drive
 \, Boulder\, Colorado\, United States\, 80309
ORGANIZER:mason.buffum@colorado.edu
SEQUENCE:131
SUMMARY:Dine &amp; Learn at CU Boulder: Advanced Packaging by Chris Fieldsend (
 Marvell Technology)
URL;VALUE=URI:https://events.vtools.ieee.org/m/573685
X-ALT-DESC:Description: &lt;br /&gt;&lt;p data-start=&quot;600&quot; data-end=&quot;641&quot;&gt;&lt;strong da
 ta-start=&quot;600&quot; data-end=&quot;613&quot;&gt;Abstract: &lt;/strong&gt;The traditional computer 
 system often had one silicon die attached to one package which was attache
 d to the system&amp;rsquo\;s motherboard. The package\, which sits in the midd
 le\, helped translate the ultra-fine silicon connections to a more managea
 ble density for the system&amp;rsquo\;s motherboard.&amp;nbsp\;The need for faster
  processing and higher density systems has challenged this convention. Tod
 ay&amp;rsquo\;s package supports multiple processors and in many cases 8-12 ad
 ditional memory silicon die. Electrically connecting all these die on one 
 package has led to many thermal\, mechanical and electrical challenges. In
  this presentation\, Chris Fieldsend will outline how the industry got her
 e and what solutions have been used in the past 5 years to deliver a major
  increase in speeds and density.&lt;/p&gt;\n&lt;p data-start=&quot;646&quot; data-end=&quot;780&quot;&gt;S
 tudents and professionals are welcome to attend. Registration is encourage
 d to help us plan attendance and communicate event updates.&lt;/p&gt;\n&lt;p data-s
 tart=&quot;646&quot; data-end=&quot;780&quot;&gt;&lt;strong data-start=&quot;237&quot; data-end=&quot;249&quot;&gt;Parking:
 &lt;/strong&gt; Parking information at CU Boulder will be provided to event regi
 strants closer to the event date.&lt;/p&gt;\n&lt;p data-start=&quot;646&quot; data-end=&quot;780&quot;&gt;
 &lt;em&gt;** This event is part of the Front Range Speaker Series that brings to
 gether students\, faculty\, IEEE members\, and engineering professionals f
 or technical talks from experts across industry and academia. The speaker 
 series is co-hosted by the IEEE University of Colorado Boulder Student Bra
 nch and the IEEE Denver Section.&amp;nbsp\;&lt;strong&gt;The series is open to all l
 evels from technical beginners to experts.&lt;/strong&gt;&lt;/em&gt;&lt;/p&gt;\n&lt;p data-star
 t=&quot;646&quot; data-end=&quot;780&quot;&gt;&lt;em&gt;&lt;strong&gt;Upcoming Talks:&lt;/strong&gt;&lt;/em&gt;&lt;/p&gt;\n&lt;ul&gt;
 \n&lt;li data-start=&quot;646&quot; data-end=&quot;780&quot;&gt;&lt;em&gt;Thursday\, October 8\, 2026: &quot;Ch
 iplets - What / Why / Where&quot; by Judd Gerber (Intel)&lt;/em&gt;&lt;/li&gt;\n&lt;li data-st
 art=&quot;646&quot; data-end=&quot;780&quot;&gt;&lt;em&gt;Thursday\, November 5\, 2026:&quot;Package and PCB
  Materials&quot; by Darren Hitchcock (Panasonic)&lt;/em&gt;&lt;/li&gt;\n&lt;li data-start=&quot;646
 &quot; data-end=&quot;780&quot;&gt;&lt;em&gt;Thursday\, December 3\, 2026: Student presentations s
 howcasing research and industry topics&lt;/em&gt;&lt;/li&gt;\n&lt;/ul&gt;&lt;br /&gt;&lt;br /&gt;Agenda:
  &lt;br /&gt;&lt;p class=&quot;PDq2pG_selectionAnchorContainer&quot; data-start=&quot;63&quot; data-end
 =&quot;81&quot;&gt;&lt;strong data-start=&quot;63&quot; data-end=&quot;81&quot;&gt;Example Agenda&lt;/strong&gt;&lt;/p&gt;\n&lt;
 ul data-start=&quot;82&quot; data-end=&quot;347&quot;&gt;\n&lt;li data-start=&quot;82&quot; data-end=&quot;132&quot;&gt;&lt;st
 rong data-start=&quot;84&quot; data-end=&quot;100&quot;&gt;6:45&amp;ndash\;7:00 PM&lt;/strong&gt; &amp;mdash\; 
 Arrival and attendee check-in&lt;/li&gt;\n&lt;li data-start=&quot;133&quot; data-end=&quot;186&quot;&gt;&lt;s
 trong data-start=&quot;135&quot; data-end=&quot;151&quot;&gt;7:00&amp;ndash\;7:10 PM&lt;/strong&gt; &amp;mdash\
 ; Welcome and speaker introduction&lt;/li&gt;\n&lt;li data-start=&quot;187&quot; data-end=&quot;22
 8&quot;&gt;&lt;strong data-start=&quot;189&quot; data-end=&quot;205&quot;&gt;7:10&amp;ndash\;8:10 PM&lt;/strong&gt; &amp;m
 dash\; Speaker presentation&lt;/li&gt;\n&lt;li data-start=&quot;229&quot; data-end=&quot;268&quot;&gt;&lt;str
 ong data-start=&quot;231&quot; data-end=&quot;247&quot;&gt;8:10&amp;ndash\;8:20 PM&lt;/strong&gt; &amp;mdash\; 
 Q&amp;amp\;A and discussion&lt;/li&gt;\n&lt;li data-start=&quot;269&quot; data-end=&quot;347&quot;&gt;&lt;strong 
 data-start=&quot;271&quot; data-end=&quot;287&quot;&gt;8:20&amp;ndash\;8:30 PM&lt;/strong&gt; &amp;mdash\; Clos
 ing remarks and upcoming speaker-series announcements&lt;/li&gt;\n&lt;/ul&gt;
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