BEGIN:VCALENDAR VERSION:2.0 PRODID:IEEE vTools.Events//EN CALSCALE:GREGORIAN BEGIN:VTIMEZONE TZID:Asia/Taipei BEGIN:STANDARD DTSTART:19790930T230000 TZOFFSETFROM:+0900 TZOFFSETTO:+0800 TZNAME:CST END:STANDARD END:VTIMEZONE BEGIN:VEVENT DTSTAMP:20260831T050106Z UID:111B546C-D0B5-403F-AD76-3675BD4EE628 DTSTART;TZID=Asia/Taipei:20260909T132000 DTEND;TZID=Asia/Taipei:20260909T142000 DESCRIPTION:Title: From Chip to System: A Holistic Approach to 2D Scalable Low-Loss D-Band Active Phased Array Realization\n\nAbstract:\n\nThe relent less demand for multi-gigabit wireless communication and high-resolution s ensing drives rapid innovation in D-band (110–170 GHz) systems. However\ , realizing efficient and scalable active phased arrays at these frequenci es remains challenging due to high cost\, interconnect losses\, packaging parasitics\, and heterogeneous integration constraints. This talk presents a holistic\, system-level approach to low-loss D-band phased array integr ation that unifies circuit\, antenna\, and packaging co-design. Leveraging both silicon-based (CMOS\, SiGe) and III–V integrated circuits\, the ap proach emphasizes optimized beamformer and power amplifier architectures c ombined with low-cost 2D scalable\, wide-angle scanning wideband antenna a rrays implemented using low-cost PCB processes. Through electromagnetic co -optimization and advanced interconnect engineering\, the framework achiev es significant reduction in loss and improvement in overall system efficie ncy. Measured D-band results from prototype modules demonstrate wide-angle beam steering and data transmission rates up to 100 Gb/s. These results c onfirm the feasibility of steerable\, high-capacity arrays suitable for bo th communication and sensing platforms.\n\nSpeaker:\n\nKamil Yavuz Kapusuz (Senior Member\, IEEE) received the M.Sc. degree in Electrical Engineerin g from Atilim University\, Ankara\, Turkey\, in 2013\, and the Ph.D. degre e in Electrical Engineering from the Electromagnetics Group\, Department o f Information Technology\, Ghent University\, Belgium in 2021.\n\nFrom 201 4 to 2016\, he worked as a Senior Antenna Engineer at Remote Sensing Techn ologies\, Turkey. Between 2021 and 2022\, he was a Visiting Scientist at t he CNRS\, IETR Laboratory\, France. Since 2022\, he has been a Senior Rese archer in Electromagnetics at IMEC and Ghent University. His research incl udes on the analysis and design of quasi-optical systems\, leaky-wave ante nnas\, near-field focusing techniques\, in/on-body communication systems\, active/reconfigurable/unconventional millimeter-wave and sub-terahertz ph ased arrays\, and electromagnetic modeling and optimization of 2.5D and 3D RF packaging architectures.\n\nDr. Kapusuz received the URSI Young Scient ist Award at the 2021 URSI General Assembly.\n\nDepartment of Electrical E ngineering\, No.1\, Sec. 4\, Roosevelt Road\, Taipei\, T'ai-pei\, Taiwan\, 10617 LOCATION:Department of Electrical Engineering\, No.1\, Sec. 4\, Roosevelt R oad\, Taipei\, T'ai-pei\, Taiwan\, 10617 ORGANIZER:yuhsiang@ntu.edu.tw SEQUENCE:7 SUMMARY:From Chip to System: A Holistic Approach to 2D Scalable Low-Loss D- Band Active Phased Array Realization URL;VALUE=URI:https://events.vtools.ieee.org/m/575019 X-ALT-DESC:Description: <br /><p>Title: From Chip to System: A Holistic App roach to 2D Scalable Low-Loss D-Band Active Phased Array Realization</p>\n <p>Abstract:&nbsp\;</p>\n<p>The relentless demand for multi-gigabit wirele ss communication and high-resolution sensing drives rapid innovation in D- band (110&ndash\;170 GHz) systems. However\, realizing efficient and scala ble active phased arrays at these frequencies remains challenging due to h igh cost\, interconnect losses\, packaging parasitics\, and heterogeneous integration constraints. This talk presents a holistic\, system-level appr oach to low-loss D-band phased array integration that unifies circuit\, an tenna\, and packaging co-design. Leveraging both silicon-based (CMOS\, SiG e) and III&ndash\;V integrated circuits\, the approach emphasizes optimize d beamformer and power amplifier architectures combined with low-cost 2D s calable\, wide-angle scanning wideband antenna arrays implemented using lo w-cost PCB processes. Through electromagnetic co-optimization and advanced interconnect engineering\, the framework achieves significant reduction i n loss and improvement in overall system efficiency. Measured D-band resul ts from prototype modules demonstrate wide-angle beam steering and data tr ansmission rates up to 100 Gb/s. These results confirm the feasibility of steerable\, high-capacity arrays suitable for both communication and sensi ng platforms.</p>\n<p>Speaker:&nbsp\;</p>\n<p>Kamil Yavuz Kapusuz (Senior Member\, IEEE) received the M.Sc. degree in Electrical Engineering from At ilim University\, Ankara\, Turkey\, in 2013\, and the Ph.D. degree in Elec trical Engineering from the Electromagnetics Group\, Department of Informa tion Technology\, Ghent University\, Belgium in 2021.</p>\n<p>From 2014 to 2016\, he worked as a Senior Antenna Engineer at Remote Sensing Technolog ies\, Turkey. Between 2021 and 2022\, he was a Visiting Scientist at the C NRS\, IETR Laboratory\, France. Since 2022\, he has been a Senior Research er in Electromagnetics at IMEC and Ghent University. His research includes on the analysis and design of quasi-optical systems\, leaky-wave antennas \, near-field focusing techniques\, in/on-body communication systems\, act ive/reconfigurable/unconventional millimeter-wave and sub-terahertz phased arrays\, and electromagnetic modeling and optimization of 2.5D and 3D RF packaging architectures.</p>\n<p>Dr. Kapusuz received the URSI Young Scien tist Award at the 2021 URSI General Assembly.</p> END:VEVENT END:VCALENDAR