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VERSION:2.0
PRODID:IEEE vTools.Events//EN
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TZID:America/Chicago
BEGIN:DAYLIGHT
DTSTART:20260308T030000
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TZOFFSETTO:-0500
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TZNAME:CDT
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DTSTART:20261101T010000
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BEGIN:VEVENT
DTSTAMP:20260902T001458Z
UID:B21381B9-8CFA-49D2-B603-B35B17A7C0C5
DTSTART;TZID=America/Chicago:20260904T100000
DTEND;TZID=America/Chicago:20260904T110000
DESCRIPTION:The seminar focuses on advanced package-integrated antenna syst
 ems\, active phased arrays\, and antenna–electronics co-design.\n\nVirtu
 al: https://events.vtools.ieee.org/m/575310
LOCATION:Virtual: https://events.vtools.ieee.org/m/575310
ORGANIZER:djackson@uh.edu
SEQUENCE:17
SUMMARY:From Chip to System: A Holistic Approach to 2D Scalable Low-Loss D-
 Band Active Phased Array Realization
URL;VALUE=URI:https://events.vtools.ieee.org/m/575310
X-ALT-DESC:Description: <br /><p><span data-olk-copy-source="MessageBody">T
 he seminar focuses on advanced package-integrated antenna systems\, active
  phased arrays\, and antenna&ndash\;electronics co-design.</span></p>
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