BEGIN:VCALENDAR VERSION:2.0 PRODID:IEEE vTools.Events//EN CALSCALE:GREGORIAN BEGIN:VTIMEZONE TZID:America/Denver BEGIN:DAYLIGHT DTSTART:20270314T030000 TZOFFSETFROM:-0700 TZOFFSETTO:-0600 RRULE:FREQ=YEARLY;BYDAY=2SU;BYMONTH=3 TZNAME:MDT END:DAYLIGHT BEGIN:STANDARD DTSTART:20261101T010000 TZOFFSETFROM:-0600 TZOFFSETTO:-0700 RRULE:FREQ=YEARLY;BYDAY=1SU;BYMONTH=11 TZNAME:MST END:STANDARD END:VTIMEZONE BEGIN:VEVENT DTSTAMP:20261102T152216Z UID:9A05D4CB-0D99-4C8D-B913-009FED912FC6 DTSTART;TZID=America/Denver:20261105T190000 DTEND;TZID=America/Denver:20261105T203000 DESCRIPTION:Abstract:\n\nPrinted circuit boards are often viewed simply as the platform that connects electronic components\, but as systems become f aster and more complex\, the PCB itself becomes a critical part of the ele ctrical design.\n\nThis talk will begin with the basics of PCB constructio n and manufacturing\, using familiar two-layer boards to introduce copper\ , laminates\, drilling\, plating\, and etching. From there\, it will build toward the multilayer boards used in modern computers and high-performanc e servers\, where layer count\, vias\, materials\, and fabrication become much more challenging. The discussion will explore how higher data rates i ncrease dielectric and conductor loss\, driving the need for lower-loss la minates\, smoother copper\, more advanced via structures\, and tighter man ufacturing controls. Along the way\, attendees will see why a 30-layer ser ver board is far more than a simple extension of a basic PCB.\n\nThe goal is to give attendees a practical understanding of how electrical performan ce\, manufacturability\, reliability\, and cost come together in modern PC B design.\n\nParking: Parking information at CU Boulder will be provided t o event registrants closer to the event date.\n\n** The Front Range Speake r Series brings together students\, faculty\, IEEE members\, and engineeri ng professionals for technical talks from experts across industry and acad emia. This event is part of the ongoing speaker series co-hosted by the IE EE University of Colorado Boulder Student Branch and the IEEE Denver Secti on. This series is open to all levels from technical beginners to experts. \n\nUpcoming Events:\n\n- Thursday\, December 3\, 2026: Student presentati ons showcasing research and industry topics\n- More Coming in the Spring!\ n\nAgenda: \nEvent Agenda\n\n-\n6:45–7:00 PM — Networking\, arrival\, and attendee check-in\n\n-\n7:00–7:10 PM — Welcome and speaker introdu ction\n\n-\n7:10–8:10 PM — Speaker presentation\n\n-\n8:10–8:20 PM — Q&A and discussion\n\n-\n8:20–8:30 PM — Closing remarks and upcomi ng speaker-series announcements\n\nRoom: ECCR 200\, Bldg: Engineering Cent er\, 1111 Engineering Drive\, Boulder\, Colorado\, United States\, 80309 LOCATION:Room: ECCR 200\, Bldg: Engineering Center\, 1111 Engineering Drive \, Boulder\, Colorado\, United States\, 80309 ORGANIZER:Tim.swettlen@colorado.edu SEQUENCE:15 SUMMARY:Dine & Learn at CU Boulder: Package and PCB Materials by Darren Hit chcock (Panasonic) URL;VALUE=URI:https://events.vtools.ieee.org/m/575322 X-ALT-DESC:Description: <br /><p data-start="600" data-end="641"><strong da ta-start="600" data-end="613">Abstract:&nbsp\; </strong></p>\n<p data-star t="600" data-end="641"><span data-olk-copy-source="MessageBody">Printed ci rcuit boards are often viewed simply as the platform that connects electro nic components\, but as systems become faster and more complex\, the PCB i tself becomes a critical part of the electrical design.</span></p>\n<p>&nb sp\;This talk will begin with the basics of PCB construction and manufactu ring\, using familiar two-layer boards to introduce copper\, laminates\, d rilling\, plating\, and etching. From there\, it will build toward the mul tilayer boards used in modern computers and high-performance servers\, whe re layer count\, vias\, materials\, and fabrication become much more chall enging. The discussion will explore how higher data rates increase dielect ric and conductor loss\, driving the need for lower-loss laminates\, smoot her copper\, more advanced via structures\, and tighter manufacturing cont rols. Along the way\, attendees will see why a 30-layer server board is fa r more than a simple extension of a basic PCB.</p>\n<p>&nbsp\;The goal is to give attendees a practical understanding of how electrical performance\ , manufacturability\, reliability\, and cost come together in modern PCB d esign.</p>\n<p data-start="646" data-end="780"><strong data-start="237" da ta-end="249">Parking:</strong> Parking information at CU Boulder will be p rovided to event registrants closer to the event date.</p>\n<p data-start= "646" data-end="780"><em>** The Front Range Speaker Series brings together students\, faculty\, IEEE members\, and engineering professionals for tec hnical talks from experts across industry and academia. This event is part of the ongoing speaker series co-hosted by the IEEE University of Colorad o Boulder Student Branch and the IEEE Denver Section.&nbsp\;<strong>This s eries is open to all levels from technical beginners to experts.</strong>< /em></p>\n<p data-start="646" data-end="780"><em><strong>Upcoming Events:< /strong></em></p>\n<ul>\n<li data-start="646" data-end="780"><em>Thursday\ , December 3\, 2026: Student presentations showcasing research and industr y topics</em></li>\n<li data-start="646" data-end="780"><em>More Coming in the Spring!</em></li>\n</ul><br /><br />Agenda: <br /><h3 data-pm-slice=" 1 3 []">Event Agenda</h3>\n<ul data-spread="false">\n<li>\n<p><strong>6:45 &ndash\;7:00 PM</strong> &mdash\; Networking\, arrival\, and attendee chec k-in</p>\n</li>\n<li>\n<p><strong>7:00&ndash\;7:10 PM</strong> &mdash\; We lcome and speaker introduction</p>\n</li>\n<li>\n<p><strong>7:10&ndash\;8: 10 PM</strong> &mdash\; Speaker presentation</p>\n</li>\n<li>\n<p><strong> 8:10&ndash\;8:20 PM</strong> &mdash\; Q&amp\;A and discussion</p>\n</li>\n <li>\n<p><strong>8:20&ndash\;8:30 PM</strong> &mdash\; Closing remarks and upcoming speaker-series announcements</p>\n</li>\n</ul> END:VEVENT END:VCALENDAR