BEGIN:VCALENDAR
VERSION:2.0
PRODID:IEEE vTools.Events//EN
CALSCALE:GREGORIAN
BEGIN:VTIMEZONE
TZID:America/New_York
BEGIN:DAYLIGHT
DTSTART:20260308T030000
TZOFFSETFROM:-0500
TZOFFSETTO:-0400
RRULE:FREQ=YEARLY;BYDAY=2SU;BYMONTH=3
TZNAME:EDT
END:DAYLIGHT
BEGIN:STANDARD
DTSTART:20261101T010000
TZOFFSETFROM:-0400
TZOFFSETTO:-0500
RRULE:FREQ=YEARLY;BYDAY=1SU;BYMONTH=11
TZNAME:EST
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTAMP:20261016T165618Z
UID:4437F9EC-D29F-418B-9D97-47A59CCF05B5
DTSTART;TZID=America/New_York:20261023T113000
DTEND;TZID=America/New_York:20261023T133000
DESCRIPTION:In this talk\, inkjet-/3D-printed antennas\, interconnects\, 
 “smart” encapsulation and packages\, RF electronics\, RFIDs microfluid
 ics and sensors fabricated on glass\, PET\, paper and other flexible subst
 rates are introduced as a system-level solution for ultra-low-cost mass pr
 oduction of Millimeter-Wave/Sub-THz Modules and Metasurfaces for Communica
 tion\, Energy Harvesting and Sensing (ISAC) applications. The presented ap
 proach could potentially set the foundation for the first truly convergent
  AI-enabled flexible wireless sensor ad-hoc ISAC networks of the future wi
 th enhanced cognitive intelligence and “rugged” packaging. Prof. Tentz
 eris will also discuss issues concerning the power sources of “near-perp
 etual” RF modules\, including 5G+ enabled wireless power grids as well a
 s energy harvesting approaches involving thermal\, EM\, vibration and sola
 r energy forms. The final step of the presentation will involve examples f
 rom shape-changing 4D-printed (origami) phased arrays\, packages\, reflect
 arrays and mmW wearable (e.g. biomonitoring) antennas and RF modules. Spec
 ial attention will be paid on the integration of ultrabroadband (Gb/sec) i
 nkjet-printed nanotechnology-based backscattering communication modules\, 
 opto-RF modules as well as miniaturized printable wireless (e.g. CNT) sens
 ors for Internet of Things (IoT)\, 5G+ and smart agriculture/biomonitoring
  applications. It has to be noted that the talk will review and present so
 lutions for “5S Challenges” (Scalability\, Sustainability\, Speed\, Se
 curity and Smartness) as well as future directions in the area of environm
 entally-friendly transient (“green”) RF electronics and “smart-skin
 ” conformal sensors as well as massively scalable “tile-by-tile” RFI
 D-enabled autonomous reconfigurable intelligent surfaces.\n\nSpeaker(s): E
 mmanouil Tentzeris\n\nAgenda: \n11:30PM : Lunch\n\n12:00PM - 1:00PM : IEEE
  Talk\n\n1:00PM - 1:30PM : Conclusion\n\nRoom: 1026\, Bldg: B11\, 2001 Dix
 ie Ave SE\, Smyrna\, Georgia\, United States\, 30080\, Virtual: https://ev
 ents.vtools.ieee.org/m/576504
LOCATION:Room: 1026\, Bldg: B11\, 2001 Dixie Ave SE\, Smyrna\, Georgia\, Un
 ited States\, 30080\, Virtual: https://events.vtools.ieee.org/m/576504
ORGANIZER:phuc.do@gtri.gatech.edu
SEQUENCE:140
SUMMARY:Printing the Wireless Future: From 4D Origami Phased Arrays to AI-E
 nabled Networks Reshaping Communication\, Sensing\, and Energy Harvesting
URL;VALUE=URI:https://events.vtools.ieee.org/m/576504
X-ALT-DESC:Description: <br /><p><span style="font-size: small\;"><span sty
 le="font-size: 14px\; background-color: white\;">In this talk\, inkjet-/3D
 -printed antennas\, interconnects\, &ldquo\;smart&rdquo\; encapsulation an
 d packages\, RF electronics\, RFIDs microfluidics and sensors fabricated o
 n glass\, PET\, paper and other flexible substrates are introduced as a sy
 stem-level solution for ultra-low-cost mass production of Millimeter-Wave/
 Sub-THz Modules and Metasurfaces for Communication\, Energy Harvesting and
  Sensing (ISAC) applications. The presented approach could potentially set
  the foundation for the first truly convergent AI-enabled flexible wireles
 s sensor ad-hoc ISAC networks of the future with enhanced cognitive intell
 igence and &ldquo\;rugged&rdquo\; packaging. Prof. Tentzeris will also dis
 cuss issues concerning the power sources of &ldquo\;near-perpetual&rdquo\;
  RF modules\, including 5G+ enabled wireless power grids as well as energy
  harvesting approaches involving thermal\, EM\, vibration and solar energy
  forms. The final step of the presentation will involve examples from shap
 e-changing 4D-printed (origami) phased arrays\, packages\, reflectarrays a
 nd mmW wearable (e.g. biomonitoring) antennas and RF modules. Special atte
 ntion will be paid on the integration of ultrabroadband (Gb/sec) inkjet-pr
 inted nanotechnology-based backscattering communication modules\, opto-RF 
 modules as well as miniaturized printable wireless (e.g. CNT) sensors for 
 Internet of Things (IoT)\, 5G+ and smart agriculture/biomonitoring applica
 tions. It has to be noted that the talk will review and present solutions 
 for &ldquo\;5S Challenges&rdquo\; (Scalability\, Sustainability\, Speed\, 
 Security and Smartness) as well as future directions in the area of enviro
 nmentally-friendly transient (&ldquo\;green&rdquo\;) RF electronics and &l
 dquo\;smart-skin&rdquo\; conformal sensors as well as massively scalable &
 ldquo\;tile-by-tile&rdquo\; RFID-enabled autonomous reconfigurable intelli
 gent surfaces.</span></span></p><br /><br />Agenda: <br /><p>11:30PM&nbsp\
 ; &nbsp\; &nbsp\; &nbsp\; &nbsp\; &nbsp\; &nbsp\; &nbsp\; &nbsp\; &nbsp\; 
 &nbsp\; &nbsp\; : Lunch</p>\n<p>12:00PM - 1:00PM&nbsp\; &nbsp\; &nbsp\; : 
 IEEE Talk</p>\n<p>1:00PM - 1:30PM&nbsp\; &nbsp\; &nbsp\; &nbsp\; : Conclus
 ion</p>\n<p>&nbsp\;</p>
END:VEVENT
END:VCALENDAR