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DESCRIPTION:The Trident Chapter is pleased to host AP-S Young Professional 
 Ambassador Dr. Kamil Yavuz Kapusuz from IMEC and Ghent University\, Belgiu
 m. Dr. Kapusuz will give an online seminar\, &quot;From Chip to System: A Holis
 tic Approach to 2D Scalable Low-Loss D-Band Active Phased Array Realizatio
 n&quot; at 12:00 pm ET on Monday\, October 5.\n\nSEM Trident Chapter (AP03/ED15
 /MTT17/PHO36) [website](https://r4.ieee.org/sem/chapter-iv-trident/)\n\nSp
 eaker(s): Dr. Kamil Yavuz Kapusuz\n\nAgenda: \nWelcome: 12:00 pm\n\nPresen
 tation\n\nQ&amp;A\n\nClosing\n\nFrom Chip to System: A Holistic Approach to 2D
  Scalable Low-Loss D-Band Active Phased Array Realization\n\nDr. Kamil Kap
 usuz (Senior Member\, IEEE)\n\nSenior Researcher in Electromagnetics\nIMEC
  and Ghent University\, Belgium\n\nAbstract: The relentless demand for mul
 ti-gigabit wireless communication and high-resolution sensing drives rapid
  innovation in D-band (110–170 GHz) systems. However\, realizing efficie
 nt and scalable active phased arrays at these frequencies remains challeng
 ing due to high cost\, interconnect losses\, packaging parasitics\, and he
 terogeneous integration constraints. This talk presents a holistic\, syste
 m-level approach to low-loss D-band phased array integration that unifies 
 circuit\, antenna\, and packaging co-design. Leveraging both silicon-based
  (CMOS\, SiGe) and III–V integrated circuits\, the approach emphasizes o
 ptimized beamformer and power amplifier architectures combined with low-co
 st 2D scalable\, wide-angle scanning wideband antenna arrays implemented u
 sing low-cost PCB processes. Through electromagnetic co-optimization and a
 dvanced interconnect engineering\, the framework achieves significant redu
 ction in loss and improvement in overall system efficiency. Measured D-ban
 d results from prototype modules demonstrate wide-angle beam steering and 
 data transmission rates up to 100 Gb/s. These results confirm the feasibil
 ity of steerable\, high-capacity arrays suitable for both communication an
 d sensing platforms.\n\nBio: Kamil Yavuz Kapusuz (Senior Member\, IEEE) re
 ceived the M.Sc. degree in Electrical Engineering from Atilim University\,
  Ankara\, Turkey\, in 2013\, and the Ph.D. degree in Electrical Engineerin
 g from the Electromagnetics Group\, Department of Information Technology\,
  Ghent University\, Belgium in 2021.\n\nFrom 2014 to 2016\, he worked as a
  Senior Antenna Engineer at Remote Sensing Technologies\, Turkey. Between 
 2021 and 2022\, he was a Visiting Scientist at the CNRS\, IETR Laboratory\
 , France. Since 2022\, he has been a Senior Researcher in Electromagnetics
  at IMEC and Ghent University. His research includes on the analysis and d
 esign of quasi-optical systems\, leaky-wave antennas\, near-field focusing
  techniques\, in/on-body communication systems\, active/reconfigurable/unc
 onventional millimeter-wave and sub-terahertz phased arrays\, and electrom
 agnetic modeling and optimization of 2.5D and 3D RF packaging architecture
 s.\nDr. Kapusuz received the URSI Young Scientist Award at the 2021 URSI G
 eneral Assembly.\n\nVirtual: https://events.vtools.ieee.org/m/577184
LOCATION:Virtual: https://events.vtools.ieee.org/m/577184
ORGANIZER:yms@umich.edu
SEQUENCE:38
SUMMARY:From Chip to System: A Holistic Approach to 2D Scalable Low-Loss D-
 Band Active Phased Array Realization (AP-S Young Professional Lecture)
URL;VALUE=URI:https://events.vtools.ieee.org/m/577184
X-ALT-DESC:Description: &lt;br /&gt;&lt;p&gt;The Trident Chapter is pleased to host AP-
 S Young Professional Ambassador Dr. Kamil Yavuz Kapusuz from IMEC and Ghen
 t University\, Belgium. Dr. Kapusuz will give an online seminar\, &amp;nbsp\;&quot;
 From Chip to System: A Holistic Approach to 2D Scalable Low-Loss D-Band Ac
 tive Phased Array Realization&quot; at 12:00 pm ET on Monday\, October 5.&lt;/p&gt;\n
 &lt;p&gt;SEM Trident Chapter (AP03/ED15/MTT17/PHO36) &lt;a href=&quot;https://r4.ieee.or
 g/sem/chapter-iv-trident/&quot;&gt;website&lt;/a&gt;&lt;/p&gt;&lt;br /&gt;&lt;br /&gt;Agenda: &lt;br /&gt;&lt;p&gt;Wel
 come: 12:00 pm&lt;/p&gt;\n&lt;p&gt;Presentation&lt;/p&gt;\n&lt;p&gt;Q&amp;amp\;A&lt;/p&gt;\n&lt;p&gt;Closing&lt;/p&gt;\n
 &lt;p&gt;&lt;img src=&quot;https://events.vtools.ieee.org/vtools_ui/media/display/23fdde
 29-16b1-42e3-89f9-57acd7ec21d0&quot;&gt;&lt;/p&gt;\n&lt;p&gt;&lt;strong&gt;From Chip to System: A Ho
 listic Approach to 2D Scalable Low-Loss D-Band Active Phased Array Realiza
 tion&lt;/strong&gt;&lt;/p&gt;\n&lt;table style=&quot;border-collapse: collapse\; width: 100%\;
  border-width: 1px\; border-style: none\;&quot; border=&quot;1&quot;&gt;&lt;colgroup&gt;&lt;col style
 =&quot;width: 24.9513%\;&quot;&gt;&lt;col style=&quot;width: 75.0487%\;&quot;&gt;&lt;/colgroup&gt;\n&lt;tbody&gt;\n
 &lt;tr&gt;\n&lt;td style=&quot;text-align: left\;&quot;&gt;\n&lt;p style=&quot;margin: 0in\; text-align:
  left\;&quot; align=&quot;center&quot;&gt;&amp;nbsp\; &amp;nbsp\;&lt;img src=&quot;https://events.vtools.iee
 e.org/vtools_ui/media/display/b8c17278-a28d-4678-aee7-3dfe4e51a9cf&quot; width=
 &quot;230&quot; height=&quot;272&quot;&gt;&lt;/p&gt;\n&lt;/td&gt;\n&lt;td&gt;\n&lt;p style=&quot;margin: 0in\; text-align: 
 left\;&quot; align=&quot;center&quot;&gt;&lt;strong&gt;&lt;span lang=&quot;EN-CA&quot; style=&quot;font-size: 12.0pt
 \; font-family: &#39;Times New Roman&#39;\,serif\; color: windowtext\;&quot;&gt;Dr. Kamil 
 Kapusuz &lt;/span&gt;&lt;/strong&gt;&lt;span lang=&quot;EN-CA&quot; style=&quot;font-size: 12.0pt\; font
 -family: &#39;Times New Roman&#39;\,serif\; color: windowtext\;&quot;&gt;(Senior Member\, 
 IEEE)&lt;/span&gt;&lt;/p&gt;\n&lt;p class=&quot;MsoNormal&quot; style=&quot;margin-bottom: 0in\; text-al
 ign: left\;&quot; align=&quot;center&quot;&gt;&lt;span style=&quot;font-size: 12.0pt\; line-height: 
 115%\; font-family: &#39;Times New Roman&#39;\,serif\; mso-bidi-theme-font: minor-
 bidi\;&quot;&gt;Senior Researcher in Electromagnetics&lt;br&gt;&lt;/span&gt;&lt;span style=&quot;font-
 size: 12.0pt\; line-height: 115%\; font-family: &#39;Times New Roman&#39;\,serif\;
  mso-bidi-theme-font: minor-bidi\;&quot;&gt;IMEC and Ghent University\, Belgium&lt;/s
 pan&gt;&lt;/p&gt;\n&lt;/td&gt;\n&lt;/tr&gt;\n&lt;/tbody&gt;\n&lt;/table&gt;\n&lt;p class=&quot;MsoNormal&quot; style=&quot;te
 xt-align: justify\;&quot;&gt;&lt;strong style=&quot;mso-bidi-font-weight: normal\;&quot;&gt;&lt;span 
 style=&quot;font-size: 12.0pt\; line-height: 115%\;&quot;&gt;Abstract:&lt;/span&gt;&lt;/strong&gt;&lt;
 span style=&quot;font-size: 12.0pt\; line-height: 115%\;&quot;&gt; The relentless deman
 d for multi-gigabit wireless communication and high-resolution sensing dri
 ves rapid innovation in D-band (110&amp;ndash\;170 GHz) systems. However\, rea
 lizing efficient and scalable active phased arrays at these frequencies re
 mains challenging due to high cost\, interconnect losses\, packaging paras
 itics\, and heterogeneous integration constraints. This talk presents a ho
 listic\, system-level approach to low-loss D-band phased array integration
  that unifies circuit\, antenna\, and packaging co-design. Leveraging both
  silicon-based (CMOS\, SiGe) and III&amp;ndash\;V integrated circuits\, the ap
 proach emphasizes optimized beamformer and power amplifier architectures c
 ombined with low-cost 2D scalable\, wide-angle scanning wideband antenna a
 rrays implemented using low-cost PCB processes. Through electromagnetic co
 -optimization and advanced interconnect engineering\, the framework achiev
 es significant reduction in loss and improvement in overall system efficie
 ncy. Measured D-band results from prototype modules demonstrate wide-angle
  beam steering and data transmission rates up to 100 Gb/s. These results c
 onfirm the feasibility of steerable\, high-capacity arrays suitable for bo
 th communication and sensing platforms.&lt;/span&gt;&lt;/p&gt;\n&lt;p class=&quot;MsoNormal&quot; s
 tyle=&quot;text-align: justify\;&quot;&gt;&lt;strong style=&quot;mso-bidi-font-weight: normal\;
 &quot;&gt;&lt;span style=&quot;font-size: 12.0pt\; line-height: 115%\;&quot;&gt;Bio:&lt;/span&gt;&lt;/stron
 g&gt;&lt;span style=&quot;font-size: 12.0pt\; line-height: 115%\;&quot;&gt; Kamil Yavuz Kapus
 uz (Senior Member\, IEEE) received the M.Sc. degree in Electrical Engineer
 ing from Atilim University\, Ankara\, Turkey\, in 2013\, and the Ph.D. deg
 ree in Electrical Engineering from the Electromagnetics Group\, Department
  of Information Technology\, Ghent University\, Belgium in 2021.&lt;br&gt;&lt;/span
 &gt;&lt;/p&gt;\n&lt;p class=&quot;MsoNormal&quot; style=&quot;text-align: justify\;&quot;&gt;&lt;span style=&quot;fon
 t-size: 12.0pt\; line-height: 115%\;&quot;&gt;From 2014 to 2016\, he worked as a S
 enior Antenna Engineer at Remote Sensing Technologies\, Turkey. Between 20
 21 and 2022\, he was a Visiting Scientist at the CNRS\, IETR Laboratory\, 
 France. Since 2022\, he has been a Senior Researcher in Electromagnetics a
 t IMEC and Ghent University. His research includes on the analysis and des
 ign of quasi-optical systems\, leaky-wave antennas\, near-field focusing t
 echniques\, in/on-body communication systems\, active/reconfigurable/uncon
 ventional millimeter-wave and sub-terahertz phased arrays\, and electromag
 netic modeling and optimization of 2.5D and 3D RF packaging architectures.
 &lt;br&gt;Dr. Kapusuz received the URSI Young Scientist Award at the 2021 URSI G
 eneral Assembly.&lt;br&gt;&lt;/span&gt;&lt;/p&gt;
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