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VERSION:2.0
PRODID:IEEE vTools.Events//EN
CALSCALE:GREGORIAN
BEGIN:VTIMEZONE
TZID:Asia/Taipei
BEGIN:STANDARD
DTSTART:19790930T230000
TZOFFSETFROM:+0900
TZOFFSETTO:+0800
TZNAME:CST
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BEGIN:VEVENT
DTSTAMP:20260921T121824Z
UID:6C4E5478-6E0C-49AB-A896-923A874FACD7
DTSTART;TZID=Asia/Taipei:20261022T100000
DTEND;TZID=Asia/Taipei:20261022T120000
DESCRIPTION:Semiconductor soldering is much more delicate and is very criti
 cal for reliability of devices. This course covers the critical parameters
  governing the reliability for soldering in semiconductor packaging. The r
 eliability discussed includes parameters affecting the intermetallic compo
 unds (IMC)\, voiding\, electromigration\, low temperature soldering\, high
  temperature soldering\, and electrochemical migration under a variety of 
 material combinations. The failure modes are discussed in details\, with p
 referred choices of materials and designs recommended.\n\nSpeaker(s): Dr. 
 Ning-Cheng Lee\n\nAgenda: \n•IMC\n–Effect of Cu Pad Grain Size on IMC\
 n–Interaction of Cu and Ni\n–Effect of Base Metal Co-P on IMC\n•Void
 ing\n–Effect of Solder Form on Voiding\n–Effect of Joint Height\, Temp
 erature\, Electrical\, Mechanical on Shear Strength\, IMC\, Kirkendall Voi
 ding\n–Effect of Cu Structure on Kirkendall Voids\n•Electrochemical Mi
 gration (ECM)\n•EM\n–Effect of EM vs TC on Crack Formation\n–Effect 
 of Back Stress on EM\n–Effect of Grain Orientation on EM\n–Effect of R
 DL Design on EM\n–Electromigration of Low Temperature Sn-57Bi-1Ag\n–El
 ectromigration of LTS - Alloy Effect\n–Electromigration of LTS - Surface
  Finish Effect\n•LTS\n–Bi-Rich Whisker Growth\n–TCT Reliability of L
 TS\n–Collapse of LTS\n–Deposition\, Hot Tear\, Bi Stratification of LT
 S\n–Hot Tear of Homogeneous LTS BiSn - Effect of Profile &amp; Surface Finis
 h\n–Drop Test of LTS\n•HTS - TLPB (Transient Liquid Phase Bonding)\n\n
 Room: 403\, 4F\, Bldg: Taipei Nangang Exhibition Center\, Hall 1 (TaiNEX 1
 )\, No. 1\, Jingmao 2nd Rd.\, Nangang Dist.\, Taipei\, T&#39;ai-pei\, Taiwan
LOCATION:Room: 403\, 4F\, Bldg: Taipei Nangang Exhibition Center\, Hall 1 (
 TaiNEX 1)\, No. 1\, Jingmao 2nd Rd.\, Nangang Dist.\, Taipei\, T&#39;ai-pei\, 
 Taiwan
ORGANIZER:crkao@ntu.edu.tw
SEQUENCE:15
SUMMARY:IMPACT PDC - High Reliability Advanced Semiconductor Soldering
URL;VALUE=URI:https://events.vtools.ieee.org/m/578191
X-ALT-DESC:Description: &lt;br /&gt;&lt;p style=&quot;text-align: justify\;&quot;&gt;Semiconducto
 r soldering is much more delicate and is very critical for reliability of 
 devices. This course covers the critical parameters governing the reliabil
 ity for soldering in semiconductor packaging. The reliability discussed in
 cludes parameters affecting the intermetallic compounds (IMC)\, voiding\, 
 electromigration\, low temperature soldering\, high temperature soldering\
 , and electrochemical migration under a variety of material combinations. 
 The failure modes are discussed in details\, with preferred choices of mat
 erials and designs recommended.&lt;/p&gt;&lt;br /&gt;&lt;br /&gt;Agenda: &lt;br /&gt;&lt;p&gt;&amp;bull\;IMC
 &lt;br&gt;&amp;ndash\;Effect of Cu Pad Grain Size on IMC&lt;br&gt;&amp;ndash\;Interaction of C
 u and Ni&lt;br&gt;&amp;ndash\;Effect of Base Metal Co-P on IMC&lt;br&gt;&amp;bull\;Voiding&lt;br&gt;
 &amp;ndash\;Effect of Solder Form on Voiding&lt;br&gt;&amp;ndash\;Effect of Joint Height
 \, Temperature\, Electrical\, Mechanical on Shear Strength\, IMC\, Kirkend
 all Voiding&lt;br&gt;&amp;ndash\;Effect of Cu Structure on Kirkendall Voids&lt;br&gt;&amp;bull
 \;Electrochemical Migration (ECM)&lt;br&gt;&amp;bull\;EM&lt;br&gt;&amp;ndash\;Effect of EM vs 
 TC on Crack Formation&lt;br&gt;&amp;ndash\;Effect of Back Stress on EM&lt;br&gt;&amp;ndash\;Ef
 fect of Grain Orientation on EM&lt;br&gt;&amp;ndash\;Effect of RDL Design on EM&lt;br&gt;&amp;
 ndash\;Electromigration of Low Temperature Sn-57Bi-1Ag&lt;br&gt;&amp;ndash\;Electrom
 igration of LTS - Alloy Effect&lt;br&gt;&amp;ndash\;Electromigration of LTS - Surfac
 e Finish Effect&lt;br&gt;&amp;bull\;LTS&lt;br&gt;&amp;ndash\;Bi-Rich Whisker Growth&lt;br&gt;&amp;ndash\
 ;TCT Reliability of LTS&lt;br&gt;&amp;ndash\;Collapse of LTS&lt;br&gt;&amp;ndash\;Deposition\,
  Hot Tear\, Bi Stratification of LTS&lt;br&gt;&amp;ndash\;Hot Tear of Homogeneous LT
 S BiSn - Effect of Profile &amp;amp\; Surface Finish&lt;br&gt;&amp;ndash\;Drop Test of L
 TS&lt;br&gt;&amp;bull\;HTS - TLPB (Transient Liquid Phase Bonding)&lt;/p&gt;
END:VEVENT
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