BEGIN:VCALENDAR VERSION:2.0 PRODID:IEEE vTools.Events//EN CALSCALE:GREGORIAN BEGIN:VTIMEZONE TZID:America/Phoenix BEGIN:STANDARD DTSTART:19671029T010000 TZOFFSETFROM:-0600 TZOFFSETTO:-0700 TZNAME:MST END:STANDARD END:VTIMEZONE BEGIN:VEVENT DTSTAMP:20261003T165339Z UID:C3F3F93A-E0F8-47DE-80BB-631AA5712FB2 DTSTART;TZID=America/Phoenix:20261116T090500 DTEND;TZID=America/Phoenix:20261119T170700 DESCRIPTION:Explore the latest innovations and cutting-edge research tackli ng the rapidly evolving demands of AI – and the transformative challenge s it is creating across power electronics\, advanced packaging\, heterogen eous integration\, and vertical power delivery.\nThe conference is in Phoe nix this year and it is a collaboration of IEEE\, ASU and PSMA.\n\nThis ye ar's symposium places a special emphasis on AI challenges in Power Electro nics and Packaging. We will be featuring distinguished plenary speakers: K aladhar Radhakrishnan (Intel)\, Yi Zheng (Applied Materials)\, Cian Ó Mat húna (Tyndall National Institute)\, Madhavan Swaminathan (Penn State)\, S tephen Coates (Yuxuan Semi)\, and Rinkle Jain (NVIDIA)\, who will discuss topics including:\n\n· Power delivery architectures for next-generation A I accelerators\n\n· Vertical power delivery for AI computing and data cen ters\n\n· Heterogeneous integration of Vertical power for AI\n\n· AI-dri ven design\, modeling\, and optimization of power electronics\n\n· Advanc ed packaging technologies for AI high-density power delivery\n\n· Materia ls\, thermal management\, and reliability challenges for AI hardware\n\nWh ether your AI power challenges are for compute\, power delivery networks\, chiplet integration\, advanced semiconductor packaging\, thermal manageme nt\, or next-generation power conversion\, 3D-PEIM 2026 provides a unique forum to engage with the latest research and connect with leaders from aca demia and industry who are shaping the future of AI power solutions.\nFurt her details for this event can be found at: https://www.3d-peim.org/\n\nAg enda: \nSession Chairs\nAdvanced Packaging & 3D Integrated Modules Raja Ay yanar\, Arizona State University\;\nHongbin Yu\, Arizona State University\ nMaterials for Advanced Packaging Chanyeop Park\, Arizona State University \;\nAdam Morgan\, NoMIS Power\nThermal Management\nJong Ryu\, North Caroli na State University\n\nDesign\, Modeling & Simulation Doug Hopkins\, North Carolina State University\;\nLeslie Hwang\, Arizona State University\nRel iability & Failure Analysis Jeff Ewanchuk\, RTRC\nPassive Components Trifo n Liakopoulos\, Eneira\;\nKousuke Miyaji\, Shinshu University\nPower Deliv ery & Energy Storage Francesco Carobolante\, IoTissimo\nPartner Session Ho ngbin Yu\, Arizona State University\;\nBrian Narveson\, PSMA\nMTW Lab Tour s (separate registration required) Multiple ASU Researchers ----------- ----------------------------------------------------\n\n[Plenary Speakers] (https://www.3d-peim.org/2026-3d-peim-plenary-speakers/)\n\nPlenary P1 Pre senter: Kaladhar Radhakrishnan\, Intel\n\nPlenary P2 Presenter: Yi Zheng\, Applied Materials\n\nPlenary P3 Presenter: Cian Ó Mathúna\, Tyndall Nat ional Institute\n\nPlenary P4 Presenter: Madhavan Swaminathan\, Pennsylvan ia State University\n\nPlenary P5 Presenter: Stephen Coates\, Yuxuan Semi\ n\nPlenary P6 Presenter: Rinkle Jain\, NVIDIA\n\nRoom: Synergy I & II Room s\, Bldg: ASU Skysong Building 3 \, 1365 N. Scottsdale Rd.\, Scottsdale\, Arizona\, United States\, 85257 LOCATION:Room: Synergy I & II Rooms\, Bldg: ASU Skysong Building 3 \, 1365 N. Scottsdale Rd.\, Scottsdale\, Arizona\, United States\, 85257 ORGANIZER:lamsnow@asu.edu SEQUENCE:81 SUMMARY:Phoenix is hosting leading edge AI power electronics and packaging at 3D-PEIM 2026 URL;VALUE=URI:https://events.vtools.ieee.org/m/582016 X-ALT-DESC:Description: <br /><div>Explore the latest innovations and cutti ng-edge research tackling the rapidly evolving demands of <strong>AI</stro ng> &ndash\; and the transformative challenges it is creating across <stro ng>power electronics\, advanced packaging\, heterogeneous integration\, an d vertical power</strong> <strong>delivery. &nbsp\;</strong></div>\n<div>T he conference is in Phoenix this year and it is a collaboration of IEEE\, ASU and PSMA.</div>\n<div>&nbsp\;</div>\n<div><img src="https://events.vto ols.ieee.org/vtools_ui/media/display/68bd1147-30af-4fbe-b29b-69925ae3acc3" width="714" height="354"></div>\n<div>&nbsp\;</div>\n<div>\n<p>&nbsp\;</p >\n<p>This year's symposium places a special emphasis on <strong>AI challe nges</strong> in <strong>Power Electronics and Packaging</strong>. We will be featuring distinguished plenary speakers: <strong>Kaladhar Radhakrishn an (Intel)\, Yi Zheng (Applied Materials)\, Cian &Oacute\; Math&uacute\;na (Tyndall National Institute)\, Madhavan Swaminathan (Penn State)\, Stephe n Coates (Yuxuan Semi)\, and Rinkle Jain (NVIDIA)</strong>\, who will disc uss topics including:</p>\n<p>&middot\; Power delivery architectures for n ext-generation AI accelerators</p>\n<p>&middot\; Vertical power delivery f or AI computing and data centers</p>\n<p>&middot\; Heterogeneous integrati on of Vertical power for AI</p>\n<p>&middot\; AI-driven design\, modeling\ , and optimization of power electronics</p>\n<p>&middot\; Advanced packagi ng technologies for AI high-density power delivery</p>\n<p>&middot\; Mater ials\, thermal management\, and reliability challenges for AI hardware</p> \n<p>&nbsp\;</p>\n<p>Whether your AI power challenges are for <strong>comp ute\, power delivery networks\, chiplet integration\, advanced semiconduct or packaging\, thermal management\, or next-generation power conversion</s trong>\, 3D-PEIM 2026 provides a unique forum to engage with the latest re search and connect with leaders from academia and industry who are shaping the future of AI power solutions.</p>\n<div data-olk-copy-source="Message Body">Further details for this event can be found at:&nbsp\; <a href="http s://www.3d-peim.org/">https://www.3d-peim.org/</a></div>\n<div>&nbsp\;</di v>\n<div>&nbsp\;</div>\n</div><br /><br />Agenda: <br /><header class="ent ry-header">\n<figure class="wp-block-table">\n<table>\n<tbody>\n<tr>\n<td> <strong>Session</strong></td>\n<td><strong>Chairs</strong></td>\n</tr>\n<t r>\n<td>Advanced Packaging &amp\; 3D Integrated Modules</td>\n<td>Raja Ayy anar\, Arizona State University\;<br>Hongbin Yu\, Arizona State University </td>\n</tr>\n<tr>\n<td>Materials for Advanced Packaging</td>\n<td>Chanyeo p Park\, Arizona State University\;<br>Adam Morgan\, NoMIS Power</td>\n</t r>\n<tr>\n<td>Thermal Management</td>\n<td>\n<p>Jong Ryu\, North Carolina State University</p>\n</td>\n</tr>\n<tr>\n<td>Design\, Modeling &amp\; Sim ulation</td>\n<td>Doug Hopkins\, North Carolina State University\;<br>Lesl ie Hwang\, Arizona State University</td>\n</tr>\n<tr>\n<td>Reliability &am p\; Failure Analysis</td>\n<td>Jeff Ewanchuk\, RTRC</td>\n</tr>\n<tr>\n<td >Passive Components</td>\n<td>Trifon Liakopoulos\, Eneira\;<br>Kousuke Miy aji\, Shinshu University</td>\n</tr>\n<tr>\n<td>Power Delivery &amp\; Ener gy Storage</td>\n<td>Francesco Carobolante\, IoTissimo</td>\n</tr>\n<tr>\n <td>Partner Session</td>\n<td>Hongbin Yu\, Arizona State University\;<br>B rian Narveson\, PSMA</td>\n</tr>\n<tr>\n<td>MTW Lab Tours (separate regist ration required)</td>\n<td>Multiple ASU Researchers</td>\n</tr>\n</tbody>\ n</table>\n<hr>\n<p>&nbsp\;</p>\n</figure>\n<div class="dc">\n<h3><a href= "https://www.3d-peim.org/2026-3d-peim-plenary-speakers/" target="_blank" r el="noopener"><strong>Plenary Speakers</strong></a></h3>\n<p>Plenary P1 Pr esenter: <strong>Kaladhar Radhakrishnan</strong>\, Intel</p>\n<p>Plenary P 2 Presenter: <strong>Yi Zheng</strong>\, Applied Materials</p>\n<p>Plenary P3 Presenter: <strong>Cian &Oacute\; Math&uacute\;na</strong>\, Tyndall N ational Institute</p>\n<p>Plenary P4 Presenter: <strong>Madhavan Swaminath an</strong>\, Pennsylvania State University</p>\n<p>Plenary P5 Presenter: <strong>Stephen Coates</strong>\, Yuxuan Semi</p>\n<p>Plenary P6 Presenter : <strong>Rinkle Jain</strong>\, NVIDIA</p>\n</div>\n</header> END:VEVENT END:VCALENDAR