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TZID:Europe/Bucharest
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DTSTART:20270328T040000
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DTSTART:20261025T030000
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BEGIN:VEVENT
DTSTAMP:20261102T094847Z
UID:BC6D9BB2-6FF4-47BA-BC44-56ABCA9ECC3B
DTSTART;TZID=Europe/Bucharest:20261027T083000
DTEND;TZID=Europe/Bucharest:20261027T210000
DESCRIPTION:The present IEEE EPS&amp;NTC Student Branch Chapters Summit is a me
 eting organized for students\, having two important goals: to present them
  some of new trends in electronics packaging filed and to know each other 
 and start collaboration between them.\n\nThis is the 5th summit and it wil
 l be held in Târgoviște\, Romania\, on 27th October 2026 as part of 32nd
  International Symposium for Design and Technology in Electronics Packagin
 g ([SIITME2026](https://siitme.ro/)).\n\nThe current edition brings togeth
 er students from IEEE EPS&amp;NTC Student Branch Chapters from Bulgaria\, Hung
 ary\, and Romania\, being an environment where the representatives of thes
 e chapters to know each other and excellent opportunity for them to find o
 ut the new trends in Electronics Packaging and nanotechnology\, from lectu
 rers that are deeply involved in these domains.\n\nCo-sponsored by: IEEE E
 lectronics Packaging Society\, IEEE Nanotechnology Council\, Association f
 or Promoting Electronics Technology - APTE\, BEKO\n\nSpeaker(s): Dorin Ant
 onovici\, Gabriel-Alexandru Constantinescu\, Katherine “Kitty” Pearsal
 l\, Ph.D.\, Attila Bonyar\, Cristina-Elena Ungureanu\n\nBldg: Institute of
  Multidisciplinary Research for Science and Technology Valahia University 
 of Târgoviște\, Aleea Sinaia 13\, Târgoviște\, Dambovita\, Romania\, 1
 30004
LOCATION:Bldg: Institute of Multidisciplinary Research for Science and Tech
 nology Valahia University of Târgoviște\, Aleea Sinaia 13\, Târgoviște
 \, Dambovita\, Romania\, 130004
ORGANIZER:andrei.popescu0914@gmail.com
SEQUENCE:68
SUMMARY:5th SUMMIT of IEEE EPS &amp; NTC STUDENT BRANCH CHAPTERS
URL;VALUE=URI:https://events.vtools.ieee.org/m/583407
X-ALT-DESC:Description: &lt;br /&gt;&lt;p class=&quot;zfr3Q CDt4Ke &quot; dir=&quot;ltr&quot;&gt;&lt;span clas
 s=&quot;C9DxTc &quot;&gt;The present IEEE EPS&amp;amp\;NTC Student Branch Chapters Summit i
 s a meeting organized for students\, having two important goals: to presen
 t them some of new trends in electronics packaging filed and to know each 
 other and start collaboration between them.&amp;nbsp\;&lt;/span&gt;&lt;/p&gt;\n&lt;p class=&quot;z
 fr3Q CDt4Ke &quot; dir=&quot;ltr&quot;&gt;&lt;span class=&quot;C9DxTc &quot;&gt;This is the &lt;/span&gt;&lt;span cla
 ss=&quot;C9DxTc &quot;&gt;5&lt;/span&gt;&lt;span class=&quot;C9DxTc &quot;&gt;th&lt;/span&gt; &lt;span class=&quot;C9DxTc &quot;
 &gt;summit and it will be held in &lt;/span&gt;&lt;span class=&quot;C9DxTc &quot;&gt;T&amp;acirc\;rgovi
 ște&lt;/span&gt;&lt;span class=&quot;C9DxTc &quot;&gt;\, Romania\, on &lt;/span&gt;&lt;span class=&quot;C9DxT
 c &quot;&gt;27&lt;/span&gt;&lt;span class=&quot;C9DxTc &quot;&gt;th&lt;/span&gt; &lt;span class=&quot;C9DxTc &quot;&gt;October
 &lt;/span&gt;&lt;span class=&quot;C9DxTc &quot;&gt; 202&lt;/span&gt;&lt;span class=&quot;C9DxTc &quot;&gt;6&lt;/span&gt;&lt;spa
 n class=&quot;C9DxTc &quot;&gt; as part of &lt;/span&gt;&lt;span class=&quot;C9DxTc &quot;&gt;3&lt;/span&gt;&lt;span c
 lass=&quot;C9DxTc &quot;&gt;2&lt;/span&gt;&lt;span class=&quot;C9DxTc &quot;&gt;nd&lt;/span&gt; &lt;span class=&quot;C9DxTc
  &quot;&gt;International Symposium for Design and Technology in Electronics Packag
 ing &lt;/span&gt;&lt;span class=&quot;C9DxTc &quot;&gt;(&lt;/span&gt;&lt;a class=&quot;XqQF9c&quot; href=&quot;https://s
 iitme.ro/&quot; target=&quot;_blank&quot; rel=&quot;noopener&quot;&gt;&lt;span class=&quot;C9DxTc &quot;&gt;SIITME2026
 &lt;/span&gt;&lt;/a&gt;&lt;span class=&quot;C9DxTc &quot;&gt;)&lt;/span&gt;&lt;span class=&quot;C9DxTc &quot;&gt;.&lt;/span&gt;&lt;/p
 &gt;\n&lt;p class=&quot;zfr3Q CDt4Ke &quot; dir=&quot;ltr&quot;&gt;&lt;span class=&quot;C9DxTc &quot;&gt;The current ed
 ition brings together students from IEEE EPS&amp;amp\;NTC Student Branch Chapt
 ers from Bulgaria\, Hungary\, and Romania\, being an environment where the
  representatives of these chapters to know each other and excellent opport
 unity for them to find out the new trends in Electronics Packaging and nan
 otechnology\, from lecturers that are deeply involved in these domains.&lt;/s
 pan&gt;&lt;/p&gt;
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