BEGIN:VCALENDAR
VERSION:2.0
PRODID:IEEE vTools.Events//EN
CALSCALE:GREGORIAN
BEGIN:VTIMEZONE
TZID:Asia/Shanghai
BEGIN:STANDARD
DTSTART:19910915T010000
TZOFFSETFROM:+0900
TZOFFSETTO:+0800
TZNAME:CST
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END:VTIMEZONE
BEGIN:VEVENT
DTSTAMP:20261017T031426Z
UID:B4B10E47-F6AC-4B8E-A4C6-14F5D5813EFA
DTSTART;TZID=Asia/Shanghai:20261016T160000
DTEND;TZID=Asia/Shanghai:20261016T170000
DESCRIPTION:This is an IEEE AP-S YP Ambassador Seminar.\n\nIEEE AP/MTT/Join
 t Qingdao Chapter (CH10879) is pleased to host an online seminar by Dr. Ka
 mil Yavuz Kapusuz\, 2026 IEEE Antennas and Propagation Society Young Profe
 ssional Ambassador\, as part of the IEEE AP-S Young Professional Ambassado
 r Program.\n\nCo-sponsored by: City University of Hong Kong Qingdao Resear
 ch Institute\n\nSpeaker(s): Dr. Kamil Yavuz Kapusuz\, \n\nAgenda: \nAbstra
 ct:\nThe relentless demand for multi-gigabit wireless communication and hi
 gh-resolution sensing drives rapid innovation in D-band (110–170 GHz) sy
 stems. However\, realizing efficient and scalable active phased arrays at 
 these frequencies remains challenging due to high cost\, interconnect loss
 es\, packaging parasitics\, and heterogeneous integration constraints. Thi
 s talk presents a holistic\, system-level approach to low-loss D-band phas
 ed array integration that unifies circuit\, antenna\, and packaging co-des
 ign. Leveraging both silicon-based (CMOS\, SiGe) and III–V integrated ci
 rcuits\, the approach emphasizes optimized beamformer and power amplifier 
 architectures combined with low-cost 2D scalable\, wide-angle scanning wid
 eband antenna arrays implemented using low-cost PCB processes. Through ele
 ctromagnetic co-optimization and advanced interconnect engineering\, the f
 ramework achieves significant reduction in loss and improvement in overall
  system efficiency. Measured D-band results from prototype modules demonst
 rate wide-angle beam steering and data transmission rates up to 100 Gb/s. 
 These results confirm the feasibility of steerable\, high-capacity arrays 
 suitable for both communication and sensing platforms.\n\nVirtual: https:/
 /events.vtools.ieee.org/m/583429
LOCATION:Virtual: https://events.vtools.ieee.org/m/583429
ORGANIZER:xianzhong.tian@ieee.org
SEQUENCE:36
SUMMARY:From Chip to System: A Holistic Approach to 2D Scalable Low-Loss D-
 Band Active Phased Array Realization
URL;VALUE=URI:https://events.vtools.ieee.org/m/583429
X-ALT-DESC:Description: &lt;br /&gt;&lt;p&gt;This is an IEEE AP-S YP Ambassador Seminar
 .&lt;/p&gt;\n&lt;p&gt;IEEE AP/MTT/Joint Qingdao Chapter (CH10879) is pleased to host a
 n online seminar by Dr. Kamil Yavuz Kapusuz\, 2026 IEEE Antennas and Propa
 gation Society Young Professional Ambassador\, as part of the IEEE AP-S Yo
 ung Professional Ambassador Program.&lt;/p&gt;&lt;br /&gt;&lt;br /&gt;Agenda: &lt;br /&gt;&lt;p&gt;Abstr
 act:&lt;br&gt;The relentless demand for multi-gigabit wireless communication and
  high-resolution sensing drives rapid innovation in D-band (110&amp;ndash\;170
  GHz) systems. However\, realizing efficient and scalable active phased ar
 rays at these frequencies remains challenging due to high cost\, interconn
 ect losses\, packaging parasitics\, and heterogeneous integration constrai
 nts. This talk presents a holistic\, system-level approach to low-loss D-b
 and phased array integration that unifies circuit\, antenna\, and packagin
 g co-design. Leveraging both silicon-based (CMOS\, SiGe) and III&amp;ndash\;V 
 integrated circuits\, the approach emphasizes optimized beamformer and pow
 er amplifier architectures combined with low-cost 2D scalable\, wide-angle
  scanning wideband antenna arrays implemented using low-cost PCB processes
 . Through electromagnetic co-optimization and advanced interconnect engine
 ering\, the framework achieves significant reduction in loss and improveme
 nt in overall system efficiency. Measured D-band results from prototype mo
 dules demonstrate wide-angle beam steering and data transmission rates up 
 to 100 Gb/s. These results confirm the feasibility of steerable\, high-cap
 acity arrays suitable for both communication and sensing platforms.&lt;/p&gt;
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