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DTSTART:20270314T030000
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DTSTART:20261101T010000
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DTSTAMP:20261021T193109Z
UID:45318FDA-97D8-46AC-BA6C-67385A04600D
DTSTART;TZID=America/Los_Angeles:20270128T080000
DTEND;TZID=America/Los_Angeles:20270129T163000
DESCRIPTION:[]\n\nHybrid Bonding has emerged as the technology of choice in
  the semiconductor industry for ultra-fine-pitch interconnection. With sig
 nificant benefits for interconnect density and device performance\, it wil
 l become widely adopted for a broad range of high-performance semiconducto
 r devices in the years to come. The success of Hybrid Bonding technology f
 or high-volume manufacturing depends critically on the process technology 
 as well as materials and equipment. Design\, performance characterization\
 , thermal management and reliability are also important considerations to 
 enable applications in various areas.\n\nJoin us to learn about this expan
 ding field\, and discover how it will affect heterogeneous integration and
  system design. Registration should start around November 1st.\n\nCo-spons
 ored by: Paul Wesling\n\nSan Jose\, California\, United States\, Virtual: 
 https://events.vtools.ieee.org/m/588020
LOCATION:San Jose\, California\, United States\, Virtual: https://events.vt
 ools.ieee.org/m/588020
ORGANIZER:p.wesling@ieee.org
SEQUENCE:26
SUMMARY:Third Annual IEEE Hybrid Bonding Symposium (HBS)
URL;VALUE=URI:https://events.vtools.ieee.org/m/588020
X-ALT-DESC:Description: &lt;br /&gt;&lt;p&gt;&lt;img style=&quot;float: right\;&quot; src=&quot;https://e
 vents.vtools.ieee.org/vtools_ui/media/display/d098629d-1cad-4ca2-b351-345d
 8716dd25&quot; alt=&quot;&quot; width=&quot;371&quot; height=&quot;228&quot;&gt;&lt;/p&gt;\n&lt;p&gt;&lt;strong&gt;Hybrid Bonding&lt;
 /strong&gt; has emerged as the technology of choice in the semiconductor indu
 stry for ultra-fine-pitch interconnection. With significant benefits for i
 nterconnect density and device performance\, it will become widely adopted
  for a broad range of high-performance semiconductor devices in the years 
 to come. The success of Hybrid Bonding technology for high-volume manufact
 uring depends critically on the process technology as well as materials an
 d equipment. Design\, performance characterization\, thermal management an
 d reliability are also important considerations to enable applications in 
 various areas.&lt;/p&gt;\n&lt;p&gt;Join us to learn about this expanding field\, and d
 iscover how it will affect heterogeneous integration and system design. Re
 gistration should start around November 1st.&lt;/p&gt;
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