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DTSTART:20270314T030000
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DTSTART:20261101T010000
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DTSTAMP:20261022T142342Z
UID:AEEE2729-F9E2-41D1-8746-92EC32040C1D
DTSTART;TZID=America/Los_Angeles:20261102T160000
DTEND;TZID=America/Los_Angeles:20261102T183000
DESCRIPTION:Lecture #1 by Prof. Wagih: The electronics industry produces no
 n-negligible emissions and e-waste\, and is a major consumer of critical r
 aw materials (CRMs)\,which could hinder its growth to deliver our digital 
 aspirations. I will introduce a life cycle assessment (LCA)-driven approac
 h to electronics design\, showing how to quantify the true environmental f
 ootprint as well as methods to design electronics for environmental sustai
 nability and supply chain resilience. Looking at the impact of semiconduct
 or devices and specifically RFICs\, methods for circularity through recycl
 ing and re-use will be introduced\, identifying trade-offs in reliability\
 , performance\, and ease of recycling. Fully biodegradable RF package asse
 mblies with high-performance transmission beyond 170 GHz will be showcased
 \, along with their ability to enable a circular economy for RFICs\, witho
 ut the use of traditional bonding approaches. Finally\, emerging applicati
 ons in RF-based sensing will be introduced\, showing how microwave electro
 nics could reduce the complexity of sensing interfaces.\n\nLecture #2 by P
 rof. Sharma: There is a great demand for high data throughput\, innovative
  beam steering antenna solutions for wireless and satellite communication 
 applications. Over the last decade\, beam steering antennas have advanced 
 significantly\, driven largely by mature silicon beamforming chipsets\, mu
 ltilayer printed circuit boards\, and 3D printing technologies. This talk 
 focuses on emerging flat panel phased array antennas used in wireless and 
 satellite communications. The presentation will delve into electronic beam
  steering through beamforming networks and commercially available beamform
 ing integrated circuit (BFIC) chips. The presentation will showcase exampl
 es of X-/Ku-/Ka-band flat panel phased array antennas featuring dual linea
 r\, dual circular\, and polarization-reconfigurable designs. These discuss
 ions will explore the challenges and roles of silicon BFICs\, multilayer p
 rinted circuit board (PCB) fabrication\, RF component assembly\, beamformi
 ng algorithms\, and 3D dielectric and metal printing in antenna array desi
 gn. The talk will emphasize the importance of data throughput testing of K
 a-band flat panel phased array antennas in a laboratory environment and ov
 er-the-air (OTA) testing across a 1 km link between two San Diego State Un
 iversity buildings. It will also cover data throughput testing of a dual c
 ircular polarized Ka-band flat panel phased array on a payload over a 100\
 ,000 ft Aerostar balloon. The speaker will conclude with insights on the f
 uture evolution of beam steering technology.\n\nSchedule:\n4-4.30 Networki
 ng\n4.30-5.30 - Prof. Wagih&#39;s lecture and Q&amp;A\n5.30-6.30 - Prof. Sharma&#39;s 
 lecture and Q&amp;A\n\nSpeaker(s): Prof. Mahmoud Wagih\, Prof. Satish Sharma\n
 \nAgenda: \nSchedule:\n4-4.30 Networking\n4.30-5.30 - Prof. Wagih&#39;s lectur
 e and Q&amp;A\n5.30-6.30 - Prof. Sharma&#39;s lecture and Q&amp;A\n\nBldg: Qualcomm Bu
 ilding Q Auditorium\, 6455 Lusk Blvd\, San Diego\, California\, United Sta
 tes\, 92121
LOCATION:Bldg: Qualcomm Building Q Auditorium\, 6455 Lusk Blvd\, San Diego\
 , California\, United States\, 92121
ORGANIZER:pthadesar3@gmail.com
SEQUENCE:40
SUMMARY:IEEE 2-Lecture Event - (1) Sustainable Semiconductors and Wireless 
 RF (Eco)Systems\, (2) Design and Development of Flat Panel Phased Array An
 tennas
URL;VALUE=URI:https://events.vtools.ieee.org/m/588093
X-ALT-DESC:Description: &lt;br /&gt;&lt;p&gt;&lt;span style=&quot;text-decoration: underline\;&quot;
 &gt;&lt;strong&gt;Lecture #1 by Prof. Wagih: &lt;/strong&gt;&lt;/span&gt;The electronics indust
 ry produces non-negligible emissions and e-waste\, and is a major consumer
  of critical raw materials (CRMs)\,which could hinder its growth to delive
 r our digital aspirations. I will introduce a life cycle assessment (LCA)-
 driven approach to electronics design\, showing how to quantify the true e
 nvironmental footprint as well as methods to design electronics for enviro
 nmental sustainability and supply chain resilience. Looking at the impact 
 of semiconductor devices and specifically RFICs\, methods for circularity 
 through recycling and re-use will be introduced\, identifying trade-offs i
 n reliability\, performance\, and ease of recycling. Fully biodegradable R
 F package assemblies with high-performance transmission beyond 170 GHz wil
 l be showcased\, along with their ability to enable a circular economy for
  RFICs\, without the use of traditional bonding approaches. Finally\, emer
 ging applications in RF-based sensing will be introduced\, showing how mic
 rowave electronics could reduce the complexity of sensing interfaces.&lt;/p&gt;\
 n&lt;p&gt;&lt;span style=&quot;text-decoration: underline\;&quot;&gt;&lt;strong&gt;Lecture #2 by Prof.
  Sharma: &lt;/strong&gt;&lt;/span&gt;There is a great demand for high data throughput\
 , innovative beam steering antenna solutions for wireless and satellite&amp;nb
 sp\;communication applications. Over the last decade\, beam steering anten
 nas have advanced significantly\, driven largely&amp;nbsp\;by mature silicon b
 eamforming chipsets\, multilayer printed circuit boards\, and 3D printing 
 technologies. This talk&amp;nbsp\;focuses on emerging flat panel phased array 
 antennas used in wireless and satellite communications. The presentation&amp;n
 bsp\;will delve into electronic beam steering through beamforming networks
  and commercially available beamforming&amp;nbsp\;integrated circuit (BFIC) ch
 ips. The presentation will showcase examples of X-/Ku-/Ka-band flat panel 
 phased array&amp;nbsp\;antennas featuring dual linear\, dual circular\, and po
 larization-reconfigurable designs. These discussions will explore the&amp;nbsp
 \;challenges and roles of silicon BFICs\, multilayer printed circuit board
  (PCB) fabrication\, RF component assembly\,&amp;nbsp\;beamforming algorithms\
 , and 3D dielectric and metal printing in antenna array design. The talk w
 ill emphasize the&amp;nbsp\;importance of data throughput testing of Ka-band f
 lat panel phased array antennas in a laboratory environment and over-the-a
 ir (OTA) testing across a 1 km link between two San Diego State University
  buildings. It will also cover data&amp;nbsp\;throughput testing of a dual cir
 cular polarized Ka-band flat panel phased array on a payload over a 100\,0
 00 ft Aerostar&amp;nbsp\;balloon. The speaker will conclude with insights on t
 he future evolution of beam steering technology.&lt;/p&gt;\n&lt;div&gt;&amp;nbsp\;&lt;/div&gt;\n
 &lt;div&gt;&lt;span style=&quot;text-decoration: underline\;&quot;&gt;&lt;strong&gt;Schedule:&lt;/strong&gt;
 &lt;/span&gt;&lt;/div&gt;\n&lt;div&gt;4-4.30 Networking&lt;/div&gt;\n&lt;div&gt;4.30-5.30 - Prof. Wagih&#39;
 s lecture and Q&amp;amp\;A&lt;/div&gt;\n&lt;div&gt;5.30-6.30 - Prof. Sharma&#39;s lecture and 
 Q&amp;amp\;A&lt;/div&gt;\n&lt;div&gt;&amp;nbsp\;&lt;/div&gt;&lt;br /&gt;&lt;br /&gt;Agenda: &lt;br /&gt;&lt;div&gt;&lt;span sty
 le=&quot;text-decoration: underline\;&quot;&gt;&lt;strong&gt;Schedule:&lt;/strong&gt;&lt;/span&gt;&lt;/div&gt;\
 n&lt;div&gt;4-4.30 Networking&lt;/div&gt;\n&lt;div&gt;4.30-5.30 - Prof. Wagih&#39;s lecture and 
 Q&amp;amp\;A&lt;/div&gt;\n&lt;div&gt;5.30-6.30 - Prof. Sharma&#39;s lecture and Q&amp;amp\;A&lt;/div&gt;
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