Xuejun Fan

This presentation will give an overview of moisture related reliability issues in electronic packaging. Moisture preconditioning and the associated moisture sensitivity at reflow, packaging reliability degradation and swelling-induced stress during HAST, and the failure mechanism of electrochemical metal migration under biased HAST condition, will be presented. The modeling and characterization related to moisture will be introduced. The moisture reliability analysis for typical semiconductor packages and interconnect device in industry will be presented and discussed.

Biography:

Dr. Xuejun Fan is currently a professor in the Department of Mechanical Engineering at Lamar University, Beaumont, Texas. He was a Senior Staff Engineer with Intel Corporation in Arizona from 2004 to 2007, and a Senior Member of Research Staff with Philips Research in New York from 2000 to 2003. Dr. Fan’s area of expertise includes characterization, modeling and reliability of semiconductor packaging.

Dr. Fan serves as a member of Board of Governors (BoG) of Electronic Packaging Society (EPS) of IEEE, and is an Associate Editor of the IEEE Transactions of Components, Packaging and Manufacturing Technology. He is an IEEE Distinguished Lecturer. He received the Outstanding Sustained Technical Contribution Award in 2017, and Exceptional Technical Achievement Award in 2011, from the IEEE Electronic Packaging Society.

Dr. Fan has published four books, more than 20 book chapters, and over 250 technical papers. He has given numerous lectures and tutorials worldwide in the field of electronic packaging reliability and modeling. His book “Moisture Sensitivity of Plastic Packages of IC Devices” has been downloaded more than 25,000 times since its publication in 2010.

Email:

Address:Lamar University, , Beaumont, Texas, United States