2018 IEEE SCV Instrumentation and Measurement Technical Seminar

#microwave #and #millimeter #wave #sensing #detection #smart #environments #autonomous #driving #human-machine #interaction #medical #screening #SAR #NDT
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Seeing Hidden Objects in Layered Media using Synthetic Aperture Radar Technology by Dr. Fallahpour


A technial talk on "Seeing Hidden Objects in Layered Media using Synthetic Aperture Radar Technology" will be given by Dr. Mojtaba Fallahpour. This seminar is organized by the IEEE Santa Clara Valley Section Instrumentation and Measurement Chapter. IEEE members and non-members are invited. Admission is free. RSVP to brian.lee@ieee.org is required.

 



  Date and Time

  Location

  Hosts

  Registration



  • Date: 14 Nov 2018
  • Time: 06:30 PM to 08:15 PM
  • All times are (GMT-08:00) US/Pacific
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  • 2190 Fortune Dr.
  • San Jose, California
  • United States 95131
  • Building: Geometrics Inc.
  • Room Number: Meeting Room
  • Click here for Map

  • Contact Event Host
  • RSVP to Brian Lee brian.lee@ieee.org by 13 November, 2018

  • Co-sponsored by IEEE SCV Communication Society
  • Starts 11 October 2018 10:00 AM
  • Ends 14 November 2018 10:20 AM
  • All times are (GMT-08:00) US/Pacific
  • No Admission Charge


  Speakers

Mojtaba Fallahpour of ANSYS Inc.

Topic:

Seeing Hidden Objects in Layered Media using Synthetic Aperture Radar Technology

 Abstract:

There is a growing interest in using microwave and millimeter wave technologies for sensing and detection in emerging applications such as smart environments, autonomous driving, human-machine interaction, and medical screening. Since most of these applications demand for a system with low power consumption and reduced complexity, the conventional technologies (e.g., phased arrays with complex feeding network) solely may not be able to address the problem. As a potential solution, synthetic aperture radar (SAR) technology can offer a high-quality performance in term of power consumption, system (hardware) simplicity, and image resolution. Despite the advantages offered by the SAR, it had been initially developed for free-space imaging and could not be used for seeing through inhomogeneous media (e.g., through-the-walls). To address this issue, a Green’s function-based 3D SAR algorithm is introduced which uses Wiener filter deconvolution and can properly image embedded targets inside layered media. The performance of the proposed technique is verified through comprehensive simulations and measurements for different applications such as nondestructive testing (NDT), through-the-wall imaging, and structural health monitoring.

Biography:

Mojtaba Fallahpour received his Ph.D. degree from Missouri University of Science and Technology in 2013. In summer 2012, he interned at Signal Integrity Group at Micron Technology Inc., and later in Fall 2012, he interned at Signal Integrity Group at Cisco Systems Inc.

After graduation, he joined the University of Illinois at Urbana-Champaign (UIUC), as a Postdoctoral Research Associate (2013-2015) and worked on multi-scale scattering problems. In January 2016, he started at the Center of Integrated Systems at the Stanford University and worked on short-range millimeter wave radar-based imaging and microwave-induced thermoacoustic imaging. In August 2017, he joined ANSYS Inc., where he is currently working on modeling and simulating high frequency devices and systems.

Dr. Fallahpour is a member of IEEE Instrumentation and Measurement Society, Antennas and Propagation Society,  Nanotechnology Council, and Eta Kappa Nu. He has over 30 technical publications consisting of journal articles, conference proceedings, book chapter, and technical reports. In 2013, he was recognized as “Outstanding Reviewer” by IEEE Transactions on Instrumentation and Measurement. In 2015, he was named to “the UIUC’s List of Teachers Ranked Excellent by Students”. In 2018, he received “the IEEE Instrumentation and Measurement’s J. Barry Oakes Advancement Award.”





Agenda

6:30 PM to 6:45 PM Check in and Refreshment

6:45 PM to 7:45 PM Presentation

7:45 PM to 8:00 PM Q&A



Event Date: November 14, 2018