Physical Insights and Analysis Methods for Signal Integrity in High-Speed Designs
Signal Integrity
While the signal integrity challenges due to increasing switching frequencies and sharper edge rates of data are becoming major bottlenecks in high-speed designs, the analysis tools are continuously playing the catch-up. Although 3D-EM simulators are available today for analysis of critical paths and design modules, they are very slow for practical purposes and can blur the designer’s insight into the fundamentals of the problems they are trying to solve. This emphasizes the importance of analytical electromagnetic techniques in signal integrity. For serial data links, which can transmit data rates over 56 Gbps, the analysis of interconnect, discontinuities like crossing junctions, slots on reference planes and vias cannot be overstated. Conformal mapping methods combined with microwave analysis techniques will be discussed as a quick and accurate supplementary simulation tool to computationally intensive and opaque numerical methods. Physical insight into the underlying problems will be provided, enabling faster signal integrity analysis of disjoint modules as well as full systems.
Date and Time
Location
Hosts
Registration
- Date: 23 Sep 2019
- Time: 04:15 PM to 05:00 PM
- All times are (UTC+03:00) Istanbul
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- Gebze Technical University
- Electrical Electronics Eng Dept
- Kocaeli, Kocaeli
- Türkiye
- Contact Event Host
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Prof. Dr. Levent Sevgi; ls@leventsevgi.net
- Co-sponsored by Levent Sevgi
Speakers
DR. İhsan Erdin
Dr. İhsan Erdin
Eng. Design Manager
Biography:
İhsan Erdin is the Engineering Design Manager and SI/PI subject matter expert at Celestica. His primary job function is Celestica’s global SI/PI/EMC subject matter expert on product development and technical services. The responsibilities also include mentoring and providing technical support to the SI/PI design and analysis team. He has 20 years of experience in signal and power integrity design of multi-gigabit rate ATCA core and edge routers, including Metro Ethernet, ATM, MPLS and Carrier Ethernet line cards/ backplanes. He is an expert in timing, jitter and power/signal integrity analysis of high-speed serial and parallel interfaces as well as power and still-air thermal analysis of printed circuit structures with an in-depth knowledge of electromagnetic theory, expert on transmission lines, microwave/EMI filters as well as grounding techniques for challenging mixed-analog/digital systems. He has published over 30 journal and conference papers on electromagnetic analysis of printed circuit structures with particular emphasis on signal and power integrity. Dr. Erdin has authored over 150 signal and power integrity reports for a variety of customers including IBM, Microsoft, CISCO, Ciena, DirecTV, NEC, Juniper and others
Email:
Address:Celestica Engineering Services , 329 March Rd. Suite 223 Kanata On. , Ontario, Canada, K2K 2E1
EMC Short Course