Challenges and Opportunities in Shrinking RDL Features: Microstructure Control of Copper Deposits for Improved Fill and Reliability
Co-sponsor: IEEE Boston/Providence/New Hampshire Reliability Chapter
Please visit our website at www.ieee.org/bostonrel
This is a co-sponsored event with iMAPS New England. For more information and registration, please visit http://events.r20.constantcontact.com/register/event?oeidk=a07egwink4z926dee29&llr=dntnvbkab.
Please do not use any registration button that may appear on this page to register for this co-sponsored event!
Although this page may indicate that there is no fee, a fee may apply and will be indicated on the co-sponsor's registration page.
Date and Time
Location
Hosts
Registration
- Date: 25 Feb 2020
- Time: 05:30 PM to 09:00 PM
- All times are (GMT-05:00) US/Eastern
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- Boxboro Regency Hotel & Conference Center
- 242 Adams Place
- Boxborough, Massachusetts
- United States 01719
- Contact Event Host
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Michael W. Bannan, Chair
Boston/Providence/New Hampshire Reliability Chapter
- Co-sponsored by IMAPS New England
Speakers
Alejo Lifschitz Arribio of Dupont
Challenges and Opportunities in Shrinking RDL Features: Microstructure Control of Copper Deposits for Improved Fill ...
Agenda
5:30 PM Registration, Socializing, Networking & Cash Bar
6:30 PM Boxboro Buffet - Stuffed Chicken Breast, Pasta Bolognese & sides
7:30 PM Technical Presentation
Please do not use any registration button that may appear on this page to register!
Note that a fee may apply and will be indicated on the co-sponsor's registration page.
Registration must be completed at the link indicated above.