IEEE Hybrid Bonding Symposium
-- Enabling Hybrid Bonding Commercialization: performance, technology, materials, equipment, reliability ...
Hybrid Bonding has emerged as the technology of choice in the semiconductor industry for ultra-fine-pitch interconnection. With significant benefits for interconnect density and device performance, it will become widely adopted for a broad range of high-performance semiconductor devices in the years to come. The success of Hybrid Bonding technology for high-volume manufacturing depends critically on the process technology as well as materials and equipment. Design, performance characterization, thermal management and reliability are also important considerations to enable applications in various areas.
Join us to learn about this expanding field, and discover how it will affect heterogeneous integration and system design. Please download the full Advance Program and Hybrid Bonding Overview.
Date and Time
Location
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Registration
- Start time: 16 Jan 2025 08:00 AM
- End time: 17 Jan 2025 05:00 PM
- All times are (UTC-08:00) Pacific Time (US & Canada)
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- SEMI World Headquarters
- 673 South Milpitas Blvd
- Milpitas, California
- United States 95035
- Starts 22 December 2024 12:00 AM
- Ends 17 January 2025 12:00 PM
- All times are (UTC-08:00) Pacific Time (US & Canada)
- Admission fee ?
- Menu: Standard, Vegetarian