[Legacy Report] SCV-CPMT-TM- Current Capabilities and Future Challenges of Acoustic Microscopy (AM) for 3D Interconnect & Underfill Inspection
Acoustic Microscopy (AM) has been an accepted non-destructive test method for several decades in the microelectronics industry. Capabilities have been developed to meet the needs of the evolving backend and front end of, typically the inspection of smaller and denser microelectronic devices.
The techniques and capabilities that have been developed for C-SAM® systems to inspect flip chip, bonded wafer and MEMS technologies can be applied to 3D IC interconnect, especially in wafer bond quality, thickness, bow, warp, sori and flatness. C-SAM technology can be used to provide qualitative and quantitative data for all current wafer bonding techniques, and to inspect CSP and flip chip interconnects, underfill, and/or bonding for voids, percent bond and delamination.
The challenges for 3D IC interconnect metrology for Acoustic Microscopy (AM) type systems include the scale of features, thickness/depth of inspection and structure. The state of the art for AM technologies will be discussed that are directly transferrable to 3D IC interconnect metrology as well as the areas that will need to be improved upon to meet the new challenges.
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Steven Martell of Sonoscan Inc
Current Capabilities and Future Challenges of Acoustic Microscopy (AM) for 3D Interconnect & Underfill Inspection
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Address:Santa Clara, California, United States