[Legacy Report] Demystifying Vias in High Speed PCB Design

#32nd #ANNUAL #SYMPOSIUM #AND #MINI-SHOW

In PCB designs, vias are virtually everywhere and come in various types, whether signal, ground, or thermal
vias, as well as through-hole, blind, and buried vias for manufacturing technology.
There are even single-ended or differential vias for signaling purpose. No matter how the vias are classified, it
is important to note that they play an important role in the PCB, especially in high-speed designs.
This paper discusses the basics of high speed PCB via designs such as via pads, anti-pads, return currents,
stubs, and crosstalk using electrical and Electro-Magnetic (EM) modeling approaches.
Dan Schwarz is an Applications Engineer with Keysight Technologies and is focused on Advanced Simulation
Tools, Device Modeling, EM and High Speed Digital circuits. Dan has 25 Years’ experience in
RF/Microwave/Analog Design with expertise in Transceiver, Synthesizer, VCO and MMIC design. Expertise
with advanced simulation technology from Transient analysis through 3D EM.
Prior to Keysight, Dan worked at Harris - Electronic Warfare Systems where he was involved with a large array
of projects from airborne ECM systems to ground based C-IED. His designs include a wide dynamic range CIED
receiver with best in class performance, microwave octave tunable push-pull VCO’s, Digital Receivers,
IFM and highly integrated MMIC solutions.
Prior to this, Dan worked at Lucent Technologies in the design of commercial application products intended for
high performance next generation base stations
Prior to Lucent, Dan worked at Harris - Space Systems in GPS Design and Development. Advanced ground
based GPS payload receiver capable of making precise navigation figure-of-merit measurements.
Dan holds a BSEE degree from New Jersey Institute of Technology in 1991
dan.schwarz@keysight.com

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