Kirsten Weide-Zaage of Gottfried Wilhelm Leibniz Universität

The technology evolution worsens the stress level of microelectronic applications. On chip level the dimension increase, higher interconnect stacks, the diversity of functions, higher frequencies and power density lead to higher stress and more interaction of effects. At package and assembly level the densification of internal interconnections, the combination of RF, digital, analog and power, new materials like lead free solder, more aggressive processes and 3D packages deliver new challenges for reliability performance. Requirements of harsh environment applications, the use of consumer products in cars or challenging mission profiles for automotive applications trigger new considerations about mission profile specific reliability, higher robustness and robustness validation.

Under harsh environment conditions like corrosion, radiation, high temperature and vibration the aging of the components is drastically accelerated. In some cases the tests standards are not anymore sufficient. For example the AEC-Q100 is not matching the demands of the conditions in e-mobility this will be discussed in detail. Furthermore corrosion comes in the focus in drilling, automotive and air vehicles. Nowadays, reliability studies pass through the joint use of experimental evaluation and finite element simulations. Simulation can give a look on special aspects in terms of thermal-electrical-mechanical issues, radiation effects and corrosion sensitivity.

Biography:

Kirsten Weide-Zaage is Apl. Professor in the field of microelectronics at the Faculty of electrical electrical engineering engineering and Computer Science of the Gottfried Wilhelm Leibniz Universität in Hannover, Germany. She is leader of the group ‘Reliability: Simulation and Risk Analysis’ (RESRI) to the Institute of Microelectronic Systems. Her main research activities are in the field of thermal-electrical-mechanical static and dynamic simulation of microelectronic reliability. She is author/ co-author of more than 100 scientific articles, including journal and conference publications, book chapters, a book, invited papers, keynotes and editor of a book. Kirsten Weide-Zaage is member of the IEEE, SMTA and VDE. Furthermore she is 1st deputy-chair of the VDE-ITG group 8.5.6 (fast) fWLR/ Wafer Level Reliability, Reliability-Simulation & Qualification.

Address:Gottfried Wilhelm Leibniz Universität, , Hannover, Germany

Verena Hein of 4academy

Research and development work always has the challenge to act under complexity. A complex system/ problem is characterized by several traits. Such systems/ problems have a high number of inter-dependent variables. Complex systems are self-dynamical. In complex development processes there are some time periods without any actions, effects and information. Some parts of a complex system/ problem are non-transparent. In research work it is common to follow different goals which contradict each other. In interactions between some effects and processes, only weak relations exist. Often the complex system is novel for the scientist or engineer.

Six fundamental failures in the handling of complex problems or systems have to be considered. The first failure is a wrong goal description. The second failure is analyzing a complex system like a linear system. Early fixed focus on wrong topics and disregarding important themes and interactions are the third failure. Fourth failure is to forget to take side effects into account. The fifth failure is the overdrive of a dynamical system and underestimation of time delays. The sixth failure is the tendency to authoritarianism by humans.

The presentation will give an introduction about the traits of complex systems, problems, projects and social work interactions on examples of the experience from reliability work in microelectronics. The theoretical base for the special social components of complex problem handling will be explained on the psychological theory for management of complexity. Some conclusions and recommendations for the daily work will be given.

Biography:

Verena Hein was born in Potsdam, Germany, in 1964. She received the Diploma in Crystallography from the Karl- Marx University, Leipzig, Germany, in 1988. 2001 she joined Company Melexis Erfurt and was responsible for WLR tests in the Reliability group. Since 2005 she is with X-FAB AG in Erfurt and is presently the Technical Coordinator- Interconnect Reliability in the global Process Characterisation Group.

In her second profession she has education as Personal-Coach, Hypno-Coach, and therapist for dolphin assisted therapy and non-medical practitioner for Psychotherapy. She finished Bachelor of Psychology at University Hagen in 2014 and is presently Master student. She works as freelancer in her own company 4academy.

Address:Erfurt, Germany