Dine and Learn: Discussion about Chip-level Cybersecurity attacks
The Denver Section would like to invite you to join us for the latest presentation in our Dine and Learn series!
Come join your fellow IEEE members and local engineers for a fun filled evening of appetizers, networking, and dinner, while we discover exciting new innovations in technology. Once a month one of your local Denver IEEE Societies will host the event and bring in a unique speaker related to their field to present. This provides you, our members, with a unique opportunity to explore and learn about exciting new technologies being developed around you. Early on in the evening you’ll also have ample opportunity to mingle with your fellow engineers and colleagues delving into a broad range of technical expertise.
We will provide the appetizers, but dinner is at your own expense. Dinner for students is free.
If there is a specific speaker or topic you find interesting please let us know and we will try to accommodate it in the schedule.
Upcoming presentations:
March - SuperBowl Communications Management
April - TBD
Date and Time
Location
Hosts
Registration
- Date: 13 Feb 2018
- Time: 06:00 PM to 08:30 PM
- All times are (GMT-07:00) US/Mountain
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- 10633 Westminster Blvd
- #900
- Westminster, Colorado
- United States 80020
- Building: Rock Bottom Brewery
- Room Number: in the "Promenade Room"
- Click here for Map
- Starts 30 January 2018 12:00 AM
- Ends 13 February 2018 08:30 PM
- All times are (GMT-07:00) US/Mountain
- No Admission Charge
Speakers
Ernest Worthman
Chip-level Cybersecurity attacks
One of the biggest challenges to chip security is direct physical attacks. Today, this is particularly applicable to mobile devices’ chips processors, memory and other security areas, in mobile phones, tablets, Internet of Everything/Everyone (IoX) devices, smart “X” devices, and more. Such attacks are used to lift secret keys and other confidential information stored in such chips.
This presentation will discuss the two most common types of such attacks: invasive and non-invasive. It will unpack the methodologies and processes (decapsulation/deprocessing, reverse engineering, depassivation/microprobing, chip modifications, glitching, side channel, etc.). We will show how it is done, with what, how results are obtained and what is done with the data.
Biography:
Currently, Ernest Worthman is the Executive Editor of Applied Wireless Technology and AGL Small Cell Magazines. In addition, he is also the principal of Worthman & Associates. His clients include Agilent Technologies, RF Industries, GLOBALFOUNDRIES, Advanced Linear Devices, and others for which he does technical writing.
Ernest has over 25 years of experience in high-tech print and online publishing as an Editorial Director, Technical Editor and high-tech writer.
He has held several editorial positions across a number of high-tech publications including: Semiconductor Engineering’s cybersecurity and Internet of Everything/Everyone (IoX) channels, Editor of RF Design, Editorial director or Reed’s Wireless group which included Wireless Design and Development and Fiber Optic Technology and several other editorial positions.
In addition to his experience across a number of high-tech platforms, he owns a consulting practice which, among other things, developed edge-of-the envelope training courses for computer software/hardware and OSs.
He holds an AAS in digital technology and a BSEET from Metropolitan State University of Denver. He is a life member of the IEEE and presently applying for senior member status. His full profile is available on LinkedIn.
Agenda
6:00 - 6:15 Registration and Appetizers
6:00 - 7:15 Dinner and Networking
7:30 - 9:00 Presentation
IEEE ---- Denver Section