Ravinder Dahiya

Ravinder Dahiya is Professor of Electronics and Nanoengineering and
Engineering and Physical Sciences Research Council (EPSRC) Fellow in the
School of Engineering at University of Glasgow. He is the Director of
Electronic Systems Design Centre (ESDC) and the leader of Bendable
Electronics and Sensing Technologies (BEST) group. His group conducts
fundamental research on high-mobility materials based flexible electronics
and electronic skin, and their application in robotics, prosthetics and
wearable systems.

Prof. Dahiya has published more than 200 research articles, 4 books (3 at
various publication stages), and 12 patents (including 7 submitted). He
has given more than 100 invited/plenary talks. He has led many
international projects including those funded by European Commission,
EPSRC, The Royal Society, The Royal Academy of Engineering, and The
Scottish Funding Council.

He is Distinguished Lecturer of IEEE Sensors Council and is on the
Editorial Boards of Scientific Reports (Nature Group), IEEE Transactions
on Robotics and IEEE Sensors Journal. He was the Technical Program
Co-Chair (TPC) for IEEE Sensors Conference in 2017 and in continuing in
this role for the IEEE Sensors Conference in 2018.

Prof. Dahiya holds EPSRC Fellowship and in past he received Marie Curie
Fellowship and Japanese Monbusho Fellowship. He has received several
awards and most recent among them are: 2016 IEEE Sensor Council Technical
Achievement Award, the 2016 Microelectronic Engineering Young Investigator
Award (Elsevier). In 2016, he was included in list of Scottish 40UNDER40.

Address:University of Glasgow, , United Kingdom