20th Electronics Packaging Technology Conference (EPTC)

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20th Electronics Packaging Technology Conference (EPTC), was held at Asia's leading leisure destination Resort World Sentosa, Singapore, from December 4 - 7, 2018. This premier international conference is organized by the IEEE RS/EPS/EDS Joint Singapore Chapter and co-sponsored by the IEEE Electronic Packaging Society (EPS), with the aim of bringing together engineers and researchers from the global microelectronics packaging community, such as semiconductor companies, foundry and OSAT service providers, equipment manufacturers, materials suppliers, research institutions and universities, under one roof for knowledge sharing and networking.


  Date and Time

  Location

  Hosts

  Registration


  • Add_To_Calendar_icon Add Event to Calendar
  • Resorts World Sentosa
  • Resorts World Sentosa
  • Singapore, Singapore
  • Singapore S099958
  • Building: Resorts World Sentosa
  • Room Number: Resorts World Sentosa
  • Click here for Map
  • Contact Event Host

  • http://sites.ieee.org/singapore-rleped/about/

     

  • Co-sponsored by XIAOWU ZHANG
  • Starts 01 October 2018 12:30 AM UTC
  • Ends 07 December 2018 12:30 AM UTC
  • No Admission Charge

  Speakers

Topic:

20th EPTC Keynote Speakers

 

Visualizing the Packaging Roadmap
Mr. Ivor Barber, Vice President, Packaging Engineering, AMD

Thermal Packaging of High Flux Power and Logic Components - History and Recent Progress
Dr. Avram Bar-Cohen, Principal Engineering Fellow Raytheon - Space and Airborne Systems Rosslyn, Va

Packaging and Heterogeneous Integration
Ms Jean Trewhella, Director, Packaging Research and Development, GLOBALFOUNDRIES


 




Agenda

Conference comprising:

Special Program (5th Dec)

 3 Keynote talks

 2 Panel session (10 speaker including 2 moderators)

 

Technical sessions (6th & 7th Dec)

 20 Invited presentations

 135 Oral Papers in 35 Technical Sessions in 5 parallel tracks

 55 poster presentations in 2 Interactive Sessions

 12 Table-top Exhibitors and Exhibitors Presentations during tea break sessions

Closing Panel session (5 speakers including moderator)

 Heterogeneous Integration Workshop